TWI895533B - 熱電變換模組之製造方法 - Google Patents

熱電變換模組之製造方法

Info

Publication number
TWI895533B
TWI895533B TW110140096A TW110140096A TWI895533B TW I895533 B TWI895533 B TW I895533B TW 110140096 A TW110140096 A TW 110140096A TW 110140096 A TW110140096 A TW 110140096A TW I895533 B TWI895533 B TW I895533B
Authority
TW
Taiwan
Prior art keywords
thermoelectric conversion
conversion material
type thermoelectric
material chip
manufacturing
Prior art date
Application number
TW110140096A
Other languages
English (en)
Chinese (zh)
Other versions
TW202226625A (zh
Inventor
関佑太
加藤邦久
森田亘
升本睦
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202226625A publication Critical patent/TW202226625A/zh
Application granted granted Critical
Publication of TWI895533B publication Critical patent/TWI895533B/zh

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/856—Thermoelectric active materials comprising organic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW110140096A 2020-10-30 2021-10-28 熱電變換模組之製造方法 TWI895533B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020182610 2020-10-30
JP2020-182610 2020-10-30

Publications (2)

Publication Number Publication Date
TW202226625A TW202226625A (zh) 2022-07-01
TWI895533B true TWI895533B (zh) 2025-09-01

Family

ID=81382558

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110140096A TWI895533B (zh) 2020-10-30 2021-10-28 熱電變換模組之製造方法

Country Status (5)

Country Link
US (1) US12114568B2 (https=)
JP (1) JP7770335B2 (https=)
CN (1) CN116391458A (https=)
TW (1) TWI895533B (https=)
WO (1) WO2022092178A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09293909A (ja) * 1996-02-26 1997-11-11 Matsushita Electric Works Ltd 熱電モジュール及びその製造方法
JP2019500757A (ja) * 2015-10-27 2019-01-10 コリア アドバンスト インスティチュート オブ サイエンス アンド テクノロジー 柔軟な熱電素子及びその製造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4459428A (en) * 1982-04-28 1984-07-10 Energy Conversion Devices, Inc. Thermoelectric device and method of making same
JP2001102643A (ja) * 1999-09-27 2001-04-13 Seiko Instruments Inc 熱電素子の製造方法
JP2001352107A (ja) * 2000-06-07 2001-12-21 Nissan Motor Co Ltd 熱電変換モジュールの製造方法
JP2003258323A (ja) * 2002-03-07 2003-09-12 Citizen Watch Co Ltd 熱電素子
JP4345279B2 (ja) * 2002-09-13 2009-10-14 ソニー株式会社 熱電変換装置の製造方法
JP4275938B2 (ja) * 2002-12-25 2009-06-10 岡野電線株式会社 熱電変換モジュールの製造方法
JP2005019767A (ja) * 2003-06-27 2005-01-20 Yamaha Corp 熱電変換モジュールの製造方法
TWI405361B (zh) * 2008-12-31 2013-08-11 財團法人工業技術研究院 熱電元件及其製程、晶片堆疊結構及晶片封裝結構
JP2010161297A (ja) * 2009-01-09 2010-07-22 Toshiba Corp 熱電変換モジュールおよびその製造方法
JP2011176073A (ja) * 2010-02-24 2011-09-08 Aisin Seiki Co Ltd 高密度熱電変換素子の製造方法
JP5928599B2 (ja) * 2012-09-19 2016-06-01 富士通株式会社 発電装置、測定装置及び測定システム
JP6047413B2 (ja) * 2013-01-29 2016-12-21 富士フイルム株式会社 熱電発電モジュール
KR101493797B1 (ko) * 2013-10-18 2015-02-17 한국과학기술원 메쉬형 기판을 이용한 플랙시블 열전소자 및 그 제조방법
KR20160028697A (ko) * 2014-09-04 2016-03-14 한국전기연구원 벌크형 소면적 열전모듈 및 그 제조방법
KR20170019109A (ko) * 2015-08-11 2017-02-21 홍익대학교 산학협력단 열전모듈의 제조방법 및 이에 의해 제조된 열전모듈
JP6750404B2 (ja) 2015-09-18 2020-09-02 三菱マテリアル株式会社 熱電変換モジュール及び熱電変換装置並びに熱電変換モジュールの製造方法
WO2017052646A1 (en) * 2015-09-25 2017-03-30 Intel Corporation Island transfer for optical, piezo and rf applications
JP6709040B2 (ja) * 2015-11-18 2020-06-10 日東電工株式会社 半導体装置の製造方法
WO2018139475A1 (ja) * 2017-01-27 2018-08-02 リンテック株式会社 フレキシブル熱電変換素子及びその製造方法
CN110494997A (zh) * 2017-03-30 2019-11-22 琳得科株式会社 热电转换模块及其制造方法
JP7200616B2 (ja) * 2017-12-06 2023-01-10 三菱マテリアル株式会社 絶縁伝熱基板、熱電変換モジュール、及び、絶縁伝熱基板の製造方法
JP7346427B2 (ja) * 2018-08-28 2023-09-19 リンテック株式会社 熱電変換材料のチップの製造方法及びその製造方法により得られたチップを用いた熱電変換モジュールの製造方法
JP7543140B2 (ja) * 2018-10-05 2024-09-02 リンテック株式会社 熱電変換材料のチップ
WO2020196709A1 (ja) * 2019-03-28 2020-10-01 リンテック株式会社 熱電変換材料のチップの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09293909A (ja) * 1996-02-26 1997-11-11 Matsushita Electric Works Ltd 熱電モジュール及びその製造方法
JP2019500757A (ja) * 2015-10-27 2019-01-10 コリア アドバンスト インスティチュート オブ サイエンス アンド テクノロジー 柔軟な熱電素子及びその製造方法

Also Published As

Publication number Publication date
TW202226625A (zh) 2022-07-01
CN116391458A (zh) 2023-07-04
US20240023441A1 (en) 2024-01-18
WO2022092178A1 (ja) 2022-05-05
US12114568B2 (en) 2024-10-08
JP7770335B2 (ja) 2025-11-14
JPWO2022092178A1 (https=) 2022-05-05

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