TWI871464B - 厚膜電阻糊、厚膜電阻體、及電子元件 - Google Patents

厚膜電阻糊、厚膜電阻體、及電子元件 Download PDF

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Publication number
TWI871464B
TWI871464B TW110115857A TW110115857A TWI871464B TW I871464 B TWI871464 B TW I871464B TW 110115857 A TW110115857 A TW 110115857A TW 110115857 A TW110115857 A TW 110115857A TW I871464 B TWI871464 B TW I871464B
Authority
TW
Taiwan
Prior art keywords
mass
thick film
film resistor
glass
powder
Prior art date
Application number
TW110115857A
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English (en)
Chinese (zh)
Other versions
TW202207244A (zh
Inventor
規
永野崇仁
Original Assignee
日商住友金屬鑛山股份有限公司
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00—Compositions for glass with special properties
    • C03C4/14—Compositions for glass with special properties for electro-conductive glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
    • C03C3/0745—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc containing more than 50% lead oxide, by weight
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/102—Glass compositions containing silica with 40% to 90% silica, by weight containing lead
    • C03C3/108—Glass compositions containing silica with 40% to 90% silica, by weight containing lead containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/06553—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of a combination of metals and oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/06—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Adjustable Resistors (AREA)
  • Conductive Materials (AREA)
TW110115857A 2020-05-01 2021-05-03 厚膜電阻糊、厚膜電阻體、及電子元件 TWI871464B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-081115 2020-05-01
JP2020081115 2020-05-01

Publications (2)

Publication Number Publication Date
TW202207244A TW202207244A (zh) 2022-02-16
TWI871464B true TWI871464B (zh) 2025-02-01

Family

ID=78332037

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110115857A TWI871464B (zh) 2020-05-01 2021-05-03 厚膜電阻糊、厚膜電阻體、及電子元件

Country Status (6)

Country Link
US (1) US12304860B2 (https=)
JP (1) JP7622738B2 (https=)
KR (1) KR102851511B1 (https=)
CN (1) CN115516578A (https=)
TW (1) TWI871464B (https=)
WO (1) WO2021221174A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254195A (en) * 1975-10-29 1977-05-02 Hitachi Ltd Resistor
CN1592659A (zh) * 2001-11-27 2005-03-09 费罗公司 热熔导体膏组合物
TW200705462A (en) * 2005-03-09 2007-02-01 Du Pont Black conductive thick film compositions, black electrodes, and methods of forming thereof
TW201912586A (zh) * 2017-08-25 2019-04-01 日商住友金屬礦山股份有限公司 厚膜電阻組成物及含有其之厚膜電阻糊
TW201920001A (zh) * 2017-09-22 2019-06-01 日商住友金屬礦山股份有限公司 厚膜電阻體用組成物、厚膜電阻糊及厚膜電阻體

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53100496A (en) * 1977-02-15 1978-09-01 Sumitomo Metal Mining Co Method of manufacturing paste for resistance body
JPS6221201A (ja) * 1985-07-22 1987-01-29 住友金属鉱山株式会社 厚膜抵抗体組成物の製造方法
JPS6324601A (ja) * 1986-07-17 1988-02-02 松下電器産業株式会社 描画用抵抗体組成物
JPH04320003A (ja) 1991-04-18 1992-11-10 Tdk Corp 厚膜抵抗体
JPH06140214A (ja) * 1992-10-23 1994-05-20 Sumitomo Metal Mining Co Ltd 厚膜抵抗体ペーストの製造方法および厚膜抵抗体の形成方法
JPH113801A (ja) * 1997-06-11 1999-01-06 Sumitomo Metal Mining Co Ltd 厚膜抵抗ペーストおよびその製造方法
KR100369565B1 (ko) * 1999-12-17 2003-01-29 대주정밀화학 주식회사 전기발열체용 저항 페이스트 조성물
JP4706703B2 (ja) 2005-04-25 2011-06-22 株式会社村田製作所 抵抗ペースト、可変抵抗器及びその製造方法
JP5835325B2 (ja) * 2011-06-21 2015-12-24 住友金属鉱山株式会社 酸化ルテニウム粉末、それを用いた厚膜抵抗体用組成物、厚膜抵抗体ペーストおよび厚膜抵抗体
JP5831055B2 (ja) * 2011-09-02 2015-12-09 住友金属鉱山株式会社 板状酸化ルテニウム粉末とその製造方法、それを用いた厚膜抵抗組成物
US8815125B2 (en) * 2012-06-20 2014-08-26 E. I. Du Pont De Nemours And Company Method of manufacturing a resistor paste
EP3329517A4 (en) * 2015-06-19 2019-05-22 Sun Chemical Corporation SILVER PASTE AND ITS USE IN SEMICONDUCTOR COMPONENTS
JP2018098412A (ja) * 2016-12-15 2018-06-21 住友金属鉱山株式会社 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、厚膜抵抗体およびこれらの製造方法
JP2023100496A (ja) * 2022-01-06 2023-07-19 株式会社三洋物産 遊技機
JP2023054195A (ja) * 2022-07-05 2023-04-13 パイオニア株式会社 走行軌跡取得方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254195A (en) * 1975-10-29 1977-05-02 Hitachi Ltd Resistor
CN1592659A (zh) * 2001-11-27 2005-03-09 费罗公司 热熔导体膏组合物
TW200705462A (en) * 2005-03-09 2007-02-01 Du Pont Black conductive thick film compositions, black electrodes, and methods of forming thereof
TW201912586A (zh) * 2017-08-25 2019-04-01 日商住友金屬礦山股份有限公司 厚膜電阻組成物及含有其之厚膜電阻糊
TW201920001A (zh) * 2017-09-22 2019-06-01 日商住友金屬礦山股份有限公司 厚膜電阻體用組成物、厚膜電阻糊及厚膜電阻體

Also Published As

Publication number Publication date
JP7622738B2 (ja) 2025-01-28
KR20230004486A (ko) 2023-01-06
US12304860B2 (en) 2025-05-20
CN115516578A (zh) 2022-12-23
TW202207244A (zh) 2022-02-16
JPWO2021221174A1 (https=) 2021-11-04
US20230167011A1 (en) 2023-06-01
WO2021221174A1 (ja) 2021-11-04
KR102851511B1 (ko) 2025-08-27

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