CN115516578A - 厚膜电阻糊、厚膜电阻体和电子部件 - Google Patents

厚膜电阻糊、厚膜电阻体和电子部件 Download PDF

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Publication number
CN115516578A
CN115516578A CN202180031480.6A CN202180031480A CN115516578A CN 115516578 A CN115516578 A CN 115516578A CN 202180031480 A CN202180031480 A CN 202180031480A CN 115516578 A CN115516578 A CN 115516578A
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CN
China
Prior art keywords
mass
film resistor
glass
thick film
powder
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180031480.6A
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English (en)
Chinese (zh)
Inventor
安藤真规
永野崇仁
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Sumitomo Metal Mining Co Ltd
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Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Publication of CN115516578A publication Critical patent/CN115516578A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00—Compositions for glass with special properties
    • C03C4/14—Compositions for glass with special properties for electro-conductive glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
    • C03C3/0745—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc containing more than 50% lead oxide, by weight
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/102—Glass compositions containing silica with 40% to 90% silica, by weight containing lead
    • C03C3/108—Glass compositions containing silica with 40% to 90% silica, by weight containing lead containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/06553—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of a combination of metals and oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/06—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Adjustable Resistors (AREA)
  • Conductive Materials (AREA)
CN202180031480.6A 2020-05-01 2021-04-30 厚膜电阻糊、厚膜电阻体和电子部件 Pending CN115516578A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-081115 2020-05-01
JP2020081115 2020-05-01
PCT/JP2021/017300 WO2021221174A1 (ja) 2020-05-01 2021-04-30 厚膜抵抗ペースト、厚膜抵抗体、及び電子部品

Publications (1)

Publication Number Publication Date
CN115516578A true CN115516578A (zh) 2022-12-23

Family

ID=78332037

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180031480.6A Pending CN115516578A (zh) 2020-05-01 2021-04-30 厚膜电阻糊、厚膜电阻体和电子部件

Country Status (6)

Country Link
US (1) US12304860B2 (https=)
JP (1) JP7622738B2 (https=)
KR (1) KR102851511B1 (https=)
CN (1) CN115516578A (https=)
TW (1) TWI871464B (https=)
WO (1) WO2021221174A1 (https=)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254195A (en) * 1975-10-29 1977-05-02 Hitachi Ltd Resistor
JPS53100496A (en) * 1977-02-15 1978-09-01 Sumitomo Metal Mining Co Method of manufacturing paste for resistance body
JPS6221201A (ja) * 1985-07-22 1987-01-29 住友金属鉱山株式会社 厚膜抵抗体組成物の製造方法
JPH113801A (ja) * 1997-06-11 1999-01-06 Sumitomo Metal Mining Co Ltd 厚膜抵抗ペーストおよびその製造方法
US6406646B1 (en) * 1999-12-17 2002-06-18 Daejoo Fine Chemical Co., Ltd. Resistive paste for the formation of electrically heat-generating thick film
JP2013053030A (ja) * 2011-09-02 2013-03-21 Sumitomo Metal Mining Co Ltd 板状酸化ルテニウム粉末とその製造方法、それを用いた厚膜抵抗組成物
CN103429537A (zh) * 2011-06-21 2013-12-04 住友金属矿山株式会社 氧化钌粉末、使用它的厚膜电阻体用组合物及厚膜电阻体
US20160369111A1 (en) * 2015-06-19 2016-12-22 Sun Chemical Corporation Silver paste and its use in semiconductor devices
JP2018098412A (ja) * 2016-12-15 2018-06-21 住友金属鉱山株式会社 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、厚膜抵抗体およびこれらの製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6324601A (ja) * 1986-07-17 1988-02-02 松下電器産業株式会社 描画用抵抗体組成物
JPH04320003A (ja) 1991-04-18 1992-11-10 Tdk Corp 厚膜抵抗体
JPH06140214A (ja) * 1992-10-23 1994-05-20 Sumitomo Metal Mining Co Ltd 厚膜抵抗体ペーストの製造方法および厚膜抵抗体の形成方法
US6814795B2 (en) * 2001-11-27 2004-11-09 Ferro Corporation Hot melt conductor paste composition
US7326370B2 (en) * 2005-03-09 2008-02-05 E. I. Du Pont De Nemours And Company Black conductive thick film compositions, black electrodes, and methods of forming thereof
JP4706703B2 (ja) 2005-04-25 2011-06-22 株式会社村田製作所 抵抗ペースト、可変抵抗器及びその製造方法
US8815125B2 (en) * 2012-06-20 2014-08-26 E. I. Du Pont De Nemours And Company Method of manufacturing a resistor paste
JP6966717B2 (ja) * 2017-08-25 2021-11-17 住友金属鉱山株式会社 厚膜抵抗体組成物及びそれを含む厚膜抵抗ペースト
JP7139691B2 (ja) * 2017-09-22 2022-09-21 住友金属鉱山株式会社 厚膜抵抗体用組成物、厚膜抵抗ペースト及び厚膜抵抗体
JP2023100496A (ja) * 2022-01-06 2023-07-19 株式会社三洋物産 遊技機
JP2023054195A (ja) * 2022-07-05 2023-04-13 パイオニア株式会社 走行軌跡取得方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254195A (en) * 1975-10-29 1977-05-02 Hitachi Ltd Resistor
JPS53100496A (en) * 1977-02-15 1978-09-01 Sumitomo Metal Mining Co Method of manufacturing paste for resistance body
JPS6221201A (ja) * 1985-07-22 1987-01-29 住友金属鉱山株式会社 厚膜抵抗体組成物の製造方法
JPH113801A (ja) * 1997-06-11 1999-01-06 Sumitomo Metal Mining Co Ltd 厚膜抵抗ペーストおよびその製造方法
US6406646B1 (en) * 1999-12-17 2002-06-18 Daejoo Fine Chemical Co., Ltd. Resistive paste for the formation of electrically heat-generating thick film
CN103429537A (zh) * 2011-06-21 2013-12-04 住友金属矿山株式会社 氧化钌粉末、使用它的厚膜电阻体用组合物及厚膜电阻体
JP2013053030A (ja) * 2011-09-02 2013-03-21 Sumitomo Metal Mining Co Ltd 板状酸化ルテニウム粉末とその製造方法、それを用いた厚膜抵抗組成物
US20160369111A1 (en) * 2015-06-19 2016-12-22 Sun Chemical Corporation Silver paste and its use in semiconductor devices
JP2018098412A (ja) * 2016-12-15 2018-06-21 住友金属鉱山株式会社 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、厚膜抵抗体およびこれらの製造方法

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TWI871464B (zh) 2025-02-01
JP7622738B2 (ja) 2025-01-28
KR20230004486A (ko) 2023-01-06
US12304860B2 (en) 2025-05-20
TW202207244A (zh) 2022-02-16
JPWO2021221174A1 (https=) 2021-11-04
US20230167011A1 (en) 2023-06-01
WO2021221174A1 (ja) 2021-11-04
KR102851511B1 (ko) 2025-08-27

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