KR102851511B1 - 후막 저항 페이스트, 후막 저항체, 및 전자 부품 - Google Patents
후막 저항 페이스트, 후막 저항체, 및 전자 부품Info
- Publication number
- KR102851511B1 KR102851511B1 KR1020227035721A KR20227035721A KR102851511B1 KR 102851511 B1 KR102851511 B1 KR 102851511B1 KR 1020227035721 A KR1020227035721 A KR 1020227035721A KR 20227035721 A KR20227035721 A KR 20227035721A KR 102851511 B1 KR102851511 B1 KR 102851511B1
- Authority
- KR
- South Korea
- Prior art keywords
- mass
- film resistor
- glass
- oxide
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
- C03C4/14—Compositions for glass with special properties for electro-conductive glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
- C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
- C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
- C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
- C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
- C03C3/0745—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc containing more than 50% lead oxide, by weight
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/102—Glass compositions containing silica with 40% to 90% silica, by weight containing lead
- C03C3/108—Glass compositions containing silica with 40% to 90% silica, by weight containing lead containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
- H01C17/06553—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of a combination of metals and oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/06—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Non-Adjustable Resistors (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020081115 | 2020-05-01 | ||
| JPJP-P-2020-081115 | 2020-05-01 | ||
| PCT/JP2021/017300 WO2021221174A1 (ja) | 2020-05-01 | 2021-04-30 | 厚膜抵抗ペースト、厚膜抵抗体、及び電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20230004486A KR20230004486A (ko) | 2023-01-06 |
| KR102851511B1 true KR102851511B1 (ko) | 2025-08-27 |
Family
ID=78332037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227035721A Active KR102851511B1 (ko) | 2020-05-01 | 2021-04-30 | 후막 저항 페이스트, 후막 저항체, 및 전자 부품 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12304860B2 (https=) |
| JP (1) | JP7622738B2 (https=) |
| KR (1) | KR102851511B1 (https=) |
| CN (1) | CN115516578A (https=) |
| TW (1) | TWI871464B (https=) |
| WO (1) | WO2021221174A1 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013053030A (ja) * | 2011-09-02 | 2013-03-21 | Sumitomo Metal Mining Co Ltd | 板状酸化ルテニウム粉末とその製造方法、それを用いた厚膜抵抗組成物 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5254195A (en) * | 1975-10-29 | 1977-05-02 | Hitachi Ltd | Resistor |
| JPS53100496A (en) * | 1977-02-15 | 1978-09-01 | Sumitomo Metal Mining Co | Method of manufacturing paste for resistance body |
| JPS6221201A (ja) * | 1985-07-22 | 1987-01-29 | 住友金属鉱山株式会社 | 厚膜抵抗体組成物の製造方法 |
| JPS6324601A (ja) * | 1986-07-17 | 1988-02-02 | 松下電器産業株式会社 | 描画用抵抗体組成物 |
| JPH04320003A (ja) | 1991-04-18 | 1992-11-10 | Tdk Corp | 厚膜抵抗体 |
| JPH06140214A (ja) * | 1992-10-23 | 1994-05-20 | Sumitomo Metal Mining Co Ltd | 厚膜抵抗体ペーストの製造方法および厚膜抵抗体の形成方法 |
| JPH113801A (ja) * | 1997-06-11 | 1999-01-06 | Sumitomo Metal Mining Co Ltd | 厚膜抵抗ペーストおよびその製造方法 |
| KR100369565B1 (ko) * | 1999-12-17 | 2003-01-29 | 대주정밀화학 주식회사 | 전기발열체용 저항 페이스트 조성물 |
| US6814795B2 (en) * | 2001-11-27 | 2004-11-09 | Ferro Corporation | Hot melt conductor paste composition |
| US7326370B2 (en) * | 2005-03-09 | 2008-02-05 | E. I. Du Pont De Nemours And Company | Black conductive thick film compositions, black electrodes, and methods of forming thereof |
| JP4706703B2 (ja) | 2005-04-25 | 2011-06-22 | 株式会社村田製作所 | 抵抗ペースト、可変抵抗器及びその製造方法 |
| JP5835325B2 (ja) * | 2011-06-21 | 2015-12-24 | 住友金属鉱山株式会社 | 酸化ルテニウム粉末、それを用いた厚膜抵抗体用組成物、厚膜抵抗体ペーストおよび厚膜抵抗体 |
| US8815125B2 (en) * | 2012-06-20 | 2014-08-26 | E. I. Du Pont De Nemours And Company | Method of manufacturing a resistor paste |
| EP3329517A4 (en) * | 2015-06-19 | 2019-05-22 | Sun Chemical Corporation | SILVER PASTE AND ITS USE IN SEMICONDUCTOR COMPONENTS |
| JP2018098412A (ja) * | 2016-12-15 | 2018-06-21 | 住友金属鉱山株式会社 | 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、厚膜抵抗体およびこれらの製造方法 |
| JP6966717B2 (ja) * | 2017-08-25 | 2021-11-17 | 住友金属鉱山株式会社 | 厚膜抵抗体組成物及びそれを含む厚膜抵抗ペースト |
| JP7139691B2 (ja) * | 2017-09-22 | 2022-09-21 | 住友金属鉱山株式会社 | 厚膜抵抗体用組成物、厚膜抵抗ペースト及び厚膜抵抗体 |
| JP2023100496A (ja) * | 2022-01-06 | 2023-07-19 | 株式会社三洋物産 | 遊技機 |
| JP2023054195A (ja) * | 2022-07-05 | 2023-04-13 | パイオニア株式会社 | 走行軌跡取得方法 |
-
2021
- 2021-04-30 US US17/921,736 patent/US12304860B2/en active Active
- 2021-04-30 JP JP2022518161A patent/JP7622738B2/ja active Active
- 2021-04-30 KR KR1020227035721A patent/KR102851511B1/ko active Active
- 2021-04-30 WO PCT/JP2021/017300 patent/WO2021221174A1/ja not_active Ceased
- 2021-04-30 CN CN202180031480.6A patent/CN115516578A/zh active Pending
- 2021-05-03 TW TW110115857A patent/TWI871464B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013053030A (ja) * | 2011-09-02 | 2013-03-21 | Sumitomo Metal Mining Co Ltd | 板状酸化ルテニウム粉末とその製造方法、それを用いた厚膜抵抗組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI871464B (zh) | 2025-02-01 |
| JP7622738B2 (ja) | 2025-01-28 |
| KR20230004486A (ko) | 2023-01-06 |
| US12304860B2 (en) | 2025-05-20 |
| CN115516578A (zh) | 2022-12-23 |
| TW202207244A (zh) | 2022-02-16 |
| JPWO2021221174A1 (https=) | 2021-11-04 |
| US20230167011A1 (en) | 2023-06-01 |
| WO2021221174A1 (ja) | 2021-11-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| D22 | Grant of ip right intended |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE) |
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| PE0701 | Decision of registration |
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| F11 | Ip right granted following substantive examination |
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| PR0701 | Registration of establishment |
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| PG1601 | Publication of registration |
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