TWI869664B - 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法 - Google Patents

聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法 Download PDF

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TWI869664B
TWI869664B TW111112434A TW111112434A TWI869664B TW I869664 B TWI869664 B TW I869664B TW 111112434 A TW111112434 A TW 111112434A TW 111112434 A TW111112434 A TW 111112434A TW I869664 B TWI869664 B TW I869664B
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Taiwan
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general formula
polyimide
group
polyamide
organic group
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TW111112434A
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English (en)
Chinese (zh)
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TW202246391A (zh
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加藤聡
佐藤雄太
柏田健
金田隆行
頼末友裕
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日商旭化成股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW111112434A 2021-04-02 2022-03-31 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法 TWI869664B (zh)

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JP2021063358 2021-04-02
JP2021063386 2021-04-02
JP2021-063358 2021-04-02
JP2021-063386 2021-04-02
JP2021196485 2021-12-02
JP2021-196485 2021-12-02

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TWI869664B true TWI869664B (zh) 2025-01-11

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TW114104287A TW202523736A (zh) 2021-04-02 2022-03-31 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法

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JP (3) JP7174199B1 (https=)
KR (1) KR20230147181A (https=)
TW (2) TWI869664B (https=)
WO (1) WO2022211086A1 (https=)

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TWI869664B (zh) * 2021-04-02 2025-01-11 日商旭化成股份有限公司 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法
JPWO2023063202A1 (https=) * 2021-10-12 2023-04-20
TWI888904B (zh) * 2022-08-31 2025-07-01 日商旭化成股份有限公司 樹脂組合物
TWI896923B (zh) * 2023-01-04 2025-09-11 亞洲電材股份有限公司 複合膜及其製造方法
JP7774009B2 (ja) * 2023-03-07 2025-11-20 Ｊｆｅケミカル株式会社 ポリイミド前駆体およびポリイミド
JP2025105035A (ja) * 2023-12-28 2025-07-10 日東電工株式会社 ポリアミド酸、ポリイミド前駆体組成物、ポリイミド樹脂、配線回路基板、および、電子機器
JP2025163792A (ja) 2024-04-18 2025-10-30 信越化学工業株式会社 ネガ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品
JP2025173612A (ja) 2024-05-15 2025-11-28 信越化学工業株式会社 ネガ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品
TW202546096A (zh) * 2024-05-17 2025-12-01 日商捷恩智股份有限公司 聚醯亞胺前驅物、熱硬化性樹脂組成物、硬化膜、基板、電子零件及聚醯亞胺前驅物的製造方法
JP2025184287A (ja) 2024-06-06 2025-12-18 信越化学工業株式会社 ネガ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品
WO2026042541A1 (ja) * 2024-08-22 2026-02-26 三菱瓦斯化学株式会社 ポリイミド樹脂前駆体ワニス及びポリイミドフィルム

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TW202246391A (zh) 2022-12-01
JP2022190112A (ja) 2022-12-22
JP7174199B1 (ja) 2022-11-17
JP2024036637A (ja) 2024-03-15
JP7436606B2 (ja) 2024-02-21
KR20230147181A (ko) 2023-10-20
JPWO2022211086A1 (https=) 2022-10-06
WO2022211086A1 (ja) 2022-10-06
TW202523736A (zh) 2025-06-16

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