JPWO2022211086A1 - - Google Patents

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Publication number
JPWO2022211086A1
JPWO2022211086A1 JP2022528651A JP2022528651A JPWO2022211086A1 JP WO2022211086 A1 JPWO2022211086 A1 JP WO2022211086A1 JP 2022528651 A JP2022528651 A JP 2022528651A JP 2022528651 A JP2022528651 A JP 2022528651A JP WO2022211086 A1 JPWO2022211086 A1 JP WO2022211086A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2022528651A
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Japanese (ja)
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JP7174199B1 (ja
JPWO2022211086A5 (https=
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Publication of JPWO2022211086A1 publication Critical patent/JPWO2022211086A1/ja
Priority to JP2022176853A priority Critical patent/JP7436606B2/ja
Application granted granted Critical
Publication of JP7174199B1 publication Critical patent/JP7174199B1/ja
Publication of JPWO2022211086A5 publication Critical patent/JPWO2022211086A5/ja
Priority to JP2024017752A priority patent/JP2024036637A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14Polyamide-imides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445Five-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2022528651A 2021-04-02 2022-03-31 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法 Active JP7174199B1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022176853A JP7436606B2 (ja) 2021-04-02 2022-11-04 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法
JP2024017752A JP2024036637A (ja) 2021-04-02 2024-02-08 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2021063358 2021-04-02
JP2021063386 2021-04-02
JP2021063358 2021-04-02
JP2021063386 2021-04-02
JP2021196485 2021-12-02
JP2021196485 2021-12-02
PCT/JP2022/016837 WO2022211086A1 (ja) 2021-04-02 2022-03-31 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022176853A Division JP7436606B2 (ja) 2021-04-02 2022-11-04 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法

Publications (3)

Publication Number Publication Date
JPWO2022211086A1 true JPWO2022211086A1 (https=) 2022-10-06
JP7174199B1 JP7174199B1 (ja) 2022-11-17
JPWO2022211086A5 JPWO2022211086A5 (https=) 2023-02-28

Family

ID=83459655

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2022528651A Active JP7174199B1 (ja) 2021-04-02 2022-03-31 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法
JP2022176853A Active JP7436606B2 (ja) 2021-04-02 2022-11-04 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法
JP2024017752A Pending JP2024036637A (ja) 2021-04-02 2024-02-08 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2022176853A Active JP7436606B2 (ja) 2021-04-02 2022-11-04 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法
JP2024017752A Pending JP2024036637A (ja) 2021-04-02 2024-02-08 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法

Country Status (4)

Country Link
JP (3) JP7174199B1 (https=)
KR (1) KR20230147181A (https=)
TW (2) TWI869664B (https=)
WO (1) WO2022211086A1 (https=)

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JP2022159241A (ja) * 2021-04-02 2022-10-17 旭化成株式会社 ポリイミドブロック共重合系高分子、ポリイミドブロック共重合系フィルム、ポリアミド酸-イミド共重合体、及び、樹脂組成物
TWI869664B (zh) * 2021-04-02 2025-01-11 日商旭化成股份有限公司 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法
JPWO2023063202A1 (https=) * 2021-10-12 2023-04-20
TWI888904B (zh) * 2022-08-31 2025-07-01 日商旭化成股份有限公司 樹脂組合物
TWI896923B (zh) * 2023-01-04 2025-09-11 亞洲電材股份有限公司 複合膜及其製造方法
JP7774009B2 (ja) * 2023-03-07 2025-11-20 Jfeケミカル株式会社 ポリイミド前駆体およびポリイミド
JP2025105035A (ja) * 2023-12-28 2025-07-10 日東電工株式会社 ポリアミド酸、ポリイミド前駆体組成物、ポリイミド樹脂、配線回路基板、および、電子機器
JP2025163792A (ja) 2024-04-18 2025-10-30 信越化学工業株式会社 ネガ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品
JP2025173612A (ja) 2024-05-15 2025-11-28 信越化学工業株式会社 ネガ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品
TW202546096A (zh) * 2024-05-17 2025-12-01 日商捷恩智股份有限公司 聚醯亞胺前驅物、熱硬化性樹脂組成物、硬化膜、基板、電子零件及聚醯亞胺前驅物的製造方法
JP2025184287A (ja) 2024-06-06 2025-12-18 信越化学工業株式会社 ネガ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品
WO2026042541A1 (ja) * 2024-08-22 2026-02-26 三菱瓦斯化学株式会社 ポリイミド樹脂前駆体ワニス及びポリイミドフィルム

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JPS63101424A (ja) 1986-10-17 1988-05-06 Tosoh Corp ポリイミド樹脂
JPS63110219A (ja) 1986-10-28 1988-05-14 Tosoh Corp ポリイミド樹脂の製造方法
JPS6443579U (https=) 1987-09-09 1989-03-15
US5202412A (en) * 1990-10-02 1993-04-13 E. I. Du Pont De Nemours And Company Polyimide copolymer precursors
US6444783B1 (en) * 2000-12-21 2002-09-03 E. I. Du Pont De Nemours And Company Melt-processible semicrystalline block copolyimides
JP4870173B2 (ja) * 2003-04-07 2012-02-08 三井化学株式会社 ポリイミド金属積層板
JP2009167235A (ja) * 2008-01-11 2009-07-30 Ube Ind Ltd ポリイミドフィルムの製造方法
JP2010134116A (ja) * 2008-12-03 2010-06-17 Asahi Kasei E-Materials Corp ポジ型感光性樹脂組成物
JP5362385B2 (ja) * 2009-02-23 2013-12-11 旭化成イーマテリアルズ株式会社 ポリアミド酸ワニス組成物及びそれを用いたポリイミド金属積層板
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JP6593021B2 (ja) * 2015-08-07 2019-10-23 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶表示素子
JP6444522B2 (ja) * 2015-09-24 2018-12-26 旭化成株式会社 ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法
WO2019106952A1 (ja) * 2017-11-30 2019-06-06 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶素子
CN112041371B (zh) 2018-05-01 2023-05-02 三菱瓦斯化学株式会社 聚酰亚胺树脂、聚酰亚胺清漆及聚酰亚胺薄膜
JP7392660B2 (ja) * 2018-12-28 2023-12-06 三菱瓦斯化学株式会社 イミド-アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム
TWI819102B (zh) * 2019-01-17 2023-10-21 日商Jsr股份有限公司 液晶配向劑、液晶配向膜、液晶元件及其製造方法
EP3919548A4 (en) * 2019-02-01 2022-10-12 Wingo Technology Co., Ltd. POLYIMIDE COMPOUND AND MOLDED ARTICLE CONTAINING SUCH POLYIMIDE COMPOUND
CN113613904A (zh) * 2019-03-20 2021-11-05 株式会社钟化 聚酰胺酸组合物及其制造方法、聚酰胺酸溶液、聚酰亚胺、聚酰亚胺膜、层叠体及其制造方法、以及柔性器件及其制造方法
US11603440B2 (en) * 2019-09-12 2023-03-14 Dupont Electronics, Inc. Polyimide films and electronic devices
CN115380058B (zh) * 2020-04-16 2024-07-09 三菱瓦斯化学株式会社 酰亚胺-酰胺酸共聚物和其制造方法、清漆以及聚酰亚胺薄膜
CN115380059B (zh) * 2020-04-16 2024-05-24 三菱瓦斯化学株式会社 酰亚胺-酰胺酸共聚物和其制造方法、清漆以及聚酰亚胺薄膜
JP7519812B2 (ja) * 2020-05-28 2024-07-22 太陽ホールディングス株式会社 ポリアミド酸、ポリイミド及びポリイミドフィルム
TWI869664B (zh) 2021-04-02 2025-01-11 日商旭化成股份有限公司 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法

Also Published As

Publication number Publication date
TW202246391A (zh) 2022-12-01
JP2022190112A (ja) 2022-12-22
JP7174199B1 (ja) 2022-11-17
JP2024036637A (ja) 2024-03-15
TWI869664B (zh) 2025-01-11
JP7436606B2 (ja) 2024-02-21
KR20230147181A (ko) 2023-10-20
WO2022211086A1 (ja) 2022-10-06
TW202523736A (zh) 2025-06-16

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