TWI857240B - 導電糊、印刷配線板、印刷配線板之製造方法、印刷電路板之製造方法 - Google Patents

導電糊、印刷配線板、印刷配線板之製造方法、印刷電路板之製造方法 Download PDF

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Publication number
TWI857240B
TWI857240B TW110129034A TW110129034A TWI857240B TW I857240 B TWI857240 B TW I857240B TW 110129034 A TW110129034 A TW 110129034A TW 110129034 A TW110129034 A TW 110129034A TW I857240 B TWI857240 B TW I857240B
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Taiwan
Prior art keywords
conductive paste
film
conductive
storage modulus
wiring board
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TW110129034A
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English (en)
Chinese (zh)
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TW202223539A (zh
Inventor
水口創
伊月直秀
田島逸蔦翠
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日商東麗股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW110129034A 2020-08-07 2021-08-06 導電糊、印刷配線板、印刷配線板之製造方法、印刷電路板之製造方法 TWI857240B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-134395 2020-08-07
JP2020134395 2020-08-07

Publications (2)

Publication Number Publication Date
TW202223539A TW202223539A (zh) 2022-06-16
TWI857240B true TWI857240B (zh) 2024-10-01

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TW110129034A TWI857240B (zh) 2020-08-07 2021-08-06 導電糊、印刷配線板、印刷配線板之製造方法、印刷電路板之製造方法

Country Status (5)

Country Link
JP (2) JP7067676B1 (https=)
KR (1) KR102722567B1 (https=)
CN (1) CN115769145A (https=)
TW (1) TWI857240B (https=)
WO (1) WO2022030324A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024252967A1 (ja) 2023-06-05 2024-12-12 東レ株式会社 感光性導電組成物、それを用いた積層体、感光性導電接着剤、パターン付き基板の製造方法およびディスプレイ基板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012172128A (ja) * 2011-02-24 2012-09-10 Kuraray Co Ltd 異方導電性接着フィルム
JP2016103524A (ja) * 2014-11-27 2016-06-02 日東電工株式会社 導電性フィルム状接着剤、フィルム状接着剤付きダイシングテープ及び半導体装置の製造方法
TW201840794A (zh) * 2017-03-28 2018-11-16 日商東洋紡股份有限公司 含有羧酸基之聚酯系黏接劑組成物
TW201910465A (zh) * 2017-08-07 2019-03-16 日商拓自達電線股份有限公司 導電性接著劑
TW201942291A (zh) * 2018-03-29 2019-11-01 日商三菱化學股份有限公司 黏著片、使用其之導電構件積層體、及圖像顯示裝置
TW201945476A (zh) * 2018-04-19 2019-12-01 日商東麗股份有限公司 感光性導電糊及使用其之圖案形成胚片之製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4768569B2 (ja) * 2006-09-29 2011-09-07 東洋合成工業株式会社 感光性組成物及び高分子複合体
JP5732815B2 (ja) 2009-10-30 2015-06-10 日立化成株式会社 感光性接着剤組成物、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、接着剤層付透明基板、及び半導体装置。
US9464198B2 (en) * 2013-01-30 2016-10-11 Dic Corporation Conductive paste, method for forming conductive pattern, and object with printed conductive pattern
WO2016171083A1 (ja) * 2015-04-21 2016-10-27 東レ株式会社 導電パターン形成部材の製造方法
US20200278609A1 (en) * 2017-10-11 2020-09-03 Toray Industries, Inc. Photosensitive conductive paste and film for forming conductive pattern
JP2020092159A (ja) 2018-12-05 2020-06-11 株式会社ブイ・テクノロジー マイクロｌｅｄ実装構造、マイクロｌｅｄディスプレイ及びマイクロｌｅｄディスプレイの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012172128A (ja) * 2011-02-24 2012-09-10 Kuraray Co Ltd 異方導電性接着フィルム
JP2016103524A (ja) * 2014-11-27 2016-06-02 日東電工株式会社 導電性フィルム状接着剤、フィルム状接着剤付きダイシングテープ及び半導体装置の製造方法
TW201840794A (zh) * 2017-03-28 2018-11-16 日商東洋紡股份有限公司 含有羧酸基之聚酯系黏接劑組成物
TW201910465A (zh) * 2017-08-07 2019-03-16 日商拓自達電線股份有限公司 導電性接著劑
TW201942291A (zh) * 2018-03-29 2019-11-01 日商三菱化學股份有限公司 黏著片、使用其之導電構件積層體、及圖像顯示裝置
TW201945476A (zh) * 2018-04-19 2019-12-01 日商東麗股份有限公司 感光性導電糊及使用其之圖案形成胚片之製造方法

Also Published As

Publication number Publication date
KR102722567B1 (ko) 2024-10-29
JPWO2022030324A1 (https=) 2022-02-10
TW202223539A (zh) 2022-06-16
KR20230048623A (ko) 2023-04-11
JP2022068144A (ja) 2022-05-09
JP7111267B2 (ja) 2022-08-02
CN115769145A (zh) 2023-03-07
WO2022030324A1 (ja) 2022-02-10
JP7067676B1 (ja) 2022-05-16

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