JP7067676B1 - 導電ペースト、プリント配線板、プリント配線板の製造方法、プリント回路板の製造方法 - Google Patents

導電ペースト、プリント配線板、プリント配線板の製造方法、プリント回路板の製造方法 Download PDF

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JP7067676B1
JP7067676B1 JP2021545380A JP2021545380A JP7067676B1 JP 7067676 B1 JP7067676 B1 JP 7067676B1 JP 2021545380 A JP2021545380 A JP 2021545380A JP 2021545380 A JP2021545380 A JP 2021545380A JP 7067676 B1 JP7067676 B1 JP 7067676B1
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conductive paste
conductive
film
elastic modulus
storage elastic
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JPWO2022030324A1 (https=
JPWO2022030324A5 (https=
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創 水口
直秀 伊月
いづみ 田島
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Toray Industries Inc
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Toray Industries Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2021545380A 2020-08-07 2021-07-28 導電ペースト、プリント配線板、プリント配線板の製造方法、プリント回路板の製造方法 Active JP7067676B1 (ja)

Priority Applications (1)

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JP2022004121A JP7111267B2 (ja) 2020-08-07 2022-01-14 プリント回路板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020134395 2020-08-07
JP2020134395 2020-08-07
PCT/JP2021/027862 WO2022030324A1 (ja) 2020-08-07 2021-07-28 導電ペースト、プリント配線板、プリント配線板の製造方法、プリント回路板の製造方法

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JPWO2022030324A1 JPWO2022030324A1 (https=) 2022-02-10
JP7067676B1 true JP7067676B1 (ja) 2022-05-16
JPWO2022030324A5 JPWO2022030324A5 (https=) 2022-07-19

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JP2022004121A Active JP7111267B2 (ja) 2020-08-07 2022-01-14 プリント回路板の製造方法

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JP (2) JP7067676B1 (https=)
KR (1) KR102722567B1 (https=)
CN (1) CN115769145A (https=)
TW (1) TWI857240B (https=)
WO (1) WO2022030324A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024252967A1 (ja) 2023-06-05 2024-12-12 東レ株式会社 感光性導電組成物、それを用いた積層体、感光性導電接着剤、パターン付き基板の製造方法およびディスプレイ基板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008089921A (ja) * 2006-09-29 2008-04-17 Toyo Gosei Kogyo Kk 感光性組成物及び高分子複合体
JP2011116968A (ja) * 2009-10-30 2011-06-16 Hitachi Chem Co Ltd 感光性接着剤組成物、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、接着剤層付透明基板、及び半導体装置。
WO2019073926A1 (ja) * 2017-10-11 2019-04-18 東レ株式会社 感光性導電ペーストおよび導電パターン形成用フィルム
WO2019202889A1 (ja) * 2018-04-19 2019-10-24 東レ株式会社 感光性導電ペーストおよびそれを用いたパターン形成グリーンシートの製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012172128A (ja) * 2011-02-24 2012-09-10 Kuraray Co Ltd 異方導電性接着フィルム
US9464198B2 (en) * 2013-01-30 2016-10-11 Dic Corporation Conductive paste, method for forming conductive pattern, and object with printed conductive pattern
JP6396189B2 (ja) * 2014-11-27 2018-09-26 日東電工株式会社 導電性フィルム状接着剤、フィルム状接着剤付きダイシングテープ及び半導体装置の製造方法
WO2016171083A1 (ja) * 2015-04-21 2016-10-27 東レ株式会社 導電パターン形成部材の製造方法
KR102433526B1 (ko) * 2017-03-28 2022-08-17 도요보 가부시키가이샤 카르복실산 기 함유 폴리에스테르계 접착제 조성물
TWI713845B (zh) * 2017-08-07 2020-12-21 日商拓自達電線股份有限公司 導電性接著劑
KR102632465B1 (ko) * 2018-03-29 2024-02-02 미쯔비시 케미컬 주식회사 점착 시트, 그것을 이용한 도전 부재 적층체, 및, 화상 표시 장치
JP2020092159A (ja) 2018-12-05 2020-06-11 株式会社ブイ・テクノロジー マイクロｌｅｄ実装構造、マイクロｌｅｄディスプレイ及びマイクロｌｅｄディスプレイの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008089921A (ja) * 2006-09-29 2008-04-17 Toyo Gosei Kogyo Kk 感光性組成物及び高分子複合体
JP2011116968A (ja) * 2009-10-30 2011-06-16 Hitachi Chem Co Ltd 感光性接着剤組成物、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、接着剤層付透明基板、及び半導体装置。
WO2019073926A1 (ja) * 2017-10-11 2019-04-18 東レ株式会社 感光性導電ペーストおよび導電パターン形成用フィルム
WO2019202889A1 (ja) * 2018-04-19 2019-10-24 東レ株式会社 感光性導電ペーストおよびそれを用いたパターン形成グリーンシートの製造方法

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Publication number Publication date
KR102722567B1 (ko) 2024-10-29
JPWO2022030324A1 (https=) 2022-02-10
TW202223539A (zh) 2022-06-16
TWI857240B (zh) 2024-10-01
KR20230048623A (ko) 2023-04-11
JP2022068144A (ja) 2022-05-09
JP7111267B2 (ja) 2022-08-02
CN115769145A (zh) 2023-03-07
WO2022030324A1 (ja) 2022-02-10

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