CN1849854A - 绝缘图案及其形成方法 - Google Patents
绝缘图案及其形成方法 Download PDFInfo
- Publication number
- CN1849854A CN1849854A CNA2004800260639A CN200480026063A CN1849854A CN 1849854 A CN1849854 A CN 1849854A CN A2004800260639 A CNA2004800260639 A CN A2004800260639A CN 200480026063 A CN200480026063 A CN 200480026063A CN 1849854 A CN1849854 A CN 1849854A
- Authority
- CN
- China
- Prior art keywords
- repellents
- pattern
- substrate
- resin composition
- insulating pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
实施例 | 比较例 | |||||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 1 | 2 | |||
表面张力(mN/m) | 形成有电路的FR-4基板上 | 基材上 | 36.0<<37.0 | 36.0<<37.0 | 36.0<<37.0 | 36.0<<37.0 | 36.0<<37.0 | 36.0<<37.0 | 36.0<<37.0 | 36.0<<37.0 | 36.0<<37.0 | 36.0<<37.0 |
铜箔上 | 37.0<<38.0 | 37.0<<38.0 | 37.0<<38.0 | 37.0<<38.0 | 37.0<<38.0 | 37.0<<38.0 | 37.0<<38.0 | 37.0<<38.0 | 37.0<<38.0 | 37.0<<38.0 | ||
固着后的排斥剂上 | <22.6 | <22.6 | <22.6<25.4 | <22.6<25.4 | <25.4<27.3 | <25.4<27.3 | <25.4<27.3 | <25.4<27.3 | - | - | ||
比较组合物上 | - | - | - | - | - | - | - | - | 34.0<<35.0 | 32.0<<33.0 | ||
涂敷PSR-4000CC02时 | 29.8 | 29.8 | 29.8 | 29.8 | 29.8 | 29.8 | 29.8 | 29.8 | 29.8 | 29.8 | ||
绝缘图案的形成性 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | × | × | ||
排斥剂的剥离 | 碱 | 碱 | 碱 | 溶剂 | 碱 | 碱 | 碱 | 不需要 | 不能剥离 | 不能剥离 |
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP319451/2003 | 2003-09-11 | ||
JP2003319451 | 2003-09-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1849854A true CN1849854A (zh) | 2006-10-18 |
CN100525587C CN100525587C (zh) | 2009-08-05 |
Family
ID=34308568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800260639A Expired - Fee Related CN100525587C (zh) | 2003-09-11 | 2004-09-06 | 绝缘图案及其形成方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4563939B2 (zh) |
CN (1) | CN100525587C (zh) |
TW (1) | TWI365691B (zh) |
WO (1) | WO2005027601A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101534612B (zh) * | 2009-04-10 | 2011-03-16 | 深圳市博敏电子有限公司 | Pcb板厚铜线路阻焊叠印工艺 |
CN102673205A (zh) * | 2011-03-10 | 2012-09-19 | 新日铁化学株式会社 | 利用喷墨印刷装置的直线描画方法 |
CN102741991A (zh) * | 2009-10-26 | 2012-10-17 | 赢创高施米特有限公司 | 在衬底上自组装电气、电子或微机械元件的方法 |
TWI496520B (zh) * | 2011-09-16 | 2015-08-11 | Sumitomo Heavy Industries | Substrate manufacturing device |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009071239A (ja) * | 2007-09-18 | 2009-04-02 | Seiko Epson Corp | プリント配線基板の製造方法及びプリント配線基板 |
JP5082706B2 (ja) * | 2007-09-18 | 2012-11-28 | セイコーエプソン株式会社 | プリント配線基板の製造方法 |
FR2925222B1 (fr) * | 2007-12-17 | 2010-04-16 | Commissariat Energie Atomique | Procede de realisation d'une interconnexion electrique entre deux couches conductrices |
JP2010016097A (ja) * | 2008-07-02 | 2010-01-21 | Fujikura Ltd | プリント配線板の製造方法 |
CN102265715B (zh) * | 2008-12-26 | 2014-05-28 | 住友电木株式会社 | 柔性基板和电子器件 |
JP5768574B2 (ja) * | 2011-08-05 | 2015-08-26 | 三菱電機株式会社 | プリント配線板の製造方法 |
WO2015002316A1 (ja) * | 2013-07-05 | 2015-01-08 | コニカミノルタ株式会社 | 絶縁パターンの形成方法 |
JP7150232B2 (ja) | 2017-07-03 | 2022-10-11 | 株式会社弘輝 | フラックス、やに入りはんだ及びソルダペースト |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5952559B2 (ja) * | 1981-07-27 | 1984-12-20 | 大日本スクリ−ン製造株式会社 | プリント配線基板の製造方法 |
JPH05251855A (ja) * | 1992-03-04 | 1993-09-28 | Nec Corp | 印刷配線板の製造方法 |
JPH06237063A (ja) * | 1993-02-12 | 1994-08-23 | Mitsubishi Rayon Co Ltd | プリント配線板の製造方法 |
US6403894B1 (en) * | 1998-05-26 | 2002-06-11 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board with insect repellant |
JP2001332840A (ja) * | 2000-05-24 | 2001-11-30 | Rohm Co Ltd | プリント配線基板の製造方法 |
-
2004
- 2004-09-06 WO PCT/JP2004/012946 patent/WO2005027601A1/ja active Application Filing
- 2004-09-06 JP JP2005513862A patent/JP4563939B2/ja not_active Expired - Fee Related
- 2004-09-06 CN CNB2004800260639A patent/CN100525587C/zh not_active Expired - Fee Related
- 2004-09-09 TW TW093127303A patent/TWI365691B/zh not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101534612B (zh) * | 2009-04-10 | 2011-03-16 | 深圳市博敏电子有限公司 | Pcb板厚铜线路阻焊叠印工艺 |
CN102741991A (zh) * | 2009-10-26 | 2012-10-17 | 赢创高施米特有限公司 | 在衬底上自组装电气、电子或微机械元件的方法 |
CN102741991B (zh) * | 2009-10-26 | 2016-03-23 | 赢创德固赛有限公司 | 在衬底上自组装电气、电子或微机械元件的方法 |
CN102673205A (zh) * | 2011-03-10 | 2012-09-19 | 新日铁化学株式会社 | 利用喷墨印刷装置的直线描画方法 |
CN102673205B (zh) * | 2011-03-10 | 2015-12-09 | 新日铁住金化学株式会社 | 利用喷墨印刷装置的直线描画方法 |
TWI496520B (zh) * | 2011-09-16 | 2015-08-11 | Sumitomo Heavy Industries | Substrate manufacturing device |
Also Published As
Publication number | Publication date |
---|---|
CN100525587C (zh) | 2009-08-05 |
JPWO2005027601A1 (ja) | 2006-11-24 |
TWI365691B (en) | 2012-06-01 |
TW200513161A (en) | 2005-04-01 |
WO2005027601A1 (ja) | 2005-03-24 |
JP4563939B2 (ja) | 2010-10-20 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: TAIYO HOLDINGS CO., LTD. Free format text: FORMER NAME: TAIYO INK MANUFACTURING CO., LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: Taiyo Holding Co., Ltd. Address before: Tokyo, Japan Patentee before: Taiyo Ink Manufacturing Co., Ltd. |
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20061018 Assignee: Taiyo Ink Mfg.Co., Ltd. Assignor: Taiyo Holding Co., Ltd. Contract record no.: 2011990000116 Denomination of invention: Insulating pattern and method of forming the same Granted publication date: 20090805 License type: Common License Record date: 20110302 |
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LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
CF01 | Termination of patent right due to non-payment of annual fee |
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CF01 | Termination of patent right due to non-payment of annual fee |