TWI365691B - Insulated pattern and its forming method - Google Patents
Insulated pattern and its forming methodInfo
- Publication number
- TWI365691B TWI365691B TW093127303A TW93127303A TWI365691B TW I365691 B TWI365691 B TW I365691B TW 093127303 A TW093127303 A TW 093127303A TW 93127303 A TW93127303 A TW 93127303A TW I365691 B TWI365691 B TW I365691B
- Authority
- TW
- Taiwan
- Prior art keywords
- forming method
- insulated pattern
- insulated
- pattern
- forming
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003319451 | 2003-09-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200513161A TW200513161A (en) | 2005-04-01 |
TWI365691B true TWI365691B (en) | 2012-06-01 |
Family
ID=34308568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093127303A TWI365691B (en) | 2003-09-11 | 2004-09-09 | Insulated pattern and its forming method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4563939B2 (en) |
CN (1) | CN100525587C (en) |
TW (1) | TWI365691B (en) |
WO (1) | WO2005027601A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5082706B2 (en) * | 2007-09-18 | 2012-11-28 | セイコーエプソン株式会社 | Method for manufacturing printed wiring board |
JP2009071239A (en) * | 2007-09-18 | 2009-04-02 | Seiko Epson Corp | Manufacturing method of printed wiring board, and printed circuit board |
FR2925222B1 (en) * | 2007-12-17 | 2010-04-16 | Commissariat Energie Atomique | METHOD FOR PRODUCING AN ELECTRIC INTERCONNECTION BETWEEN TWO CONDUCTIVE LAYERS |
JP2010016097A (en) * | 2008-07-02 | 2010-01-21 | Fujikura Ltd | Method of manufacturing printed wiring board |
CA2748245A1 (en) * | 2008-12-26 | 2010-07-01 | Sumitomo Bakelite Co., Ltd. | Flexible substrate and electronic device |
CN101534612B (en) * | 2009-04-10 | 2011-03-16 | 深圳市博敏电子有限公司 | Resistance welding superposition technology for PCB thick copper lines |
DE102009050703B3 (en) * | 2009-10-26 | 2011-04-21 | Evonik Goldschmidt Gmbh | Method for self-assembly of electrical, electronic or micromechanical components on a substrate and product produced therewith |
JP5581249B2 (en) * | 2011-03-10 | 2014-08-27 | 新日鉄住金化学株式会社 | Line drawing method by ink jet printing apparatus |
JP5768574B2 (en) * | 2011-08-05 | 2015-08-26 | 三菱電機株式会社 | Method for manufacturing printed wiring board |
WO2013039080A1 (en) * | 2011-09-16 | 2013-03-21 | 住友重機械工業株式会社 | Substrate manufacturing device |
WO2015002316A1 (en) * | 2013-07-05 | 2015-01-08 | コニカミノルタ株式会社 | Insulation pattern forming process |
JP7150232B2 (en) | 2017-07-03 | 2022-10-11 | 株式会社弘輝 | Flux, flux cored solder and solder paste |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5952559B2 (en) * | 1981-07-27 | 1984-12-20 | 大日本スクリ−ン製造株式会社 | Printed wiring board manufacturing method |
JPH05251855A (en) * | 1992-03-04 | 1993-09-28 | Nec Corp | Method for manufacturing printed-circuit board |
JPH06237063A (en) * | 1993-02-12 | 1994-08-23 | Mitsubishi Rayon Co Ltd | Manufacture of printed wiring board |
US6403894B1 (en) * | 1998-05-26 | 2002-06-11 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board with insect repellant |
JP2001332840A (en) * | 2000-05-24 | 2001-11-30 | Rohm Co Ltd | Manufacturing method of printed-wiring board |
-
2004
- 2004-09-06 WO PCT/JP2004/012946 patent/WO2005027601A1/en active Application Filing
- 2004-09-06 CN CNB2004800260639A patent/CN100525587C/en not_active Expired - Fee Related
- 2004-09-06 JP JP2005513862A patent/JP4563939B2/en not_active Expired - Fee Related
- 2004-09-09 TW TW093127303A patent/TWI365691B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP4563939B2 (en) | 2010-10-20 |
TW200513161A (en) | 2005-04-01 |
WO2005027601A1 (en) | 2005-03-24 |
CN100525587C (en) | 2009-08-05 |
CN1849854A (en) | 2006-10-18 |
JPWO2005027601A1 (en) | 2006-11-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |