TWI857019B - 電子零件裝置的製造方法 - Google Patents

電子零件裝置的製造方法 Download PDF

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Publication number
TWI857019B
TWI857019B TW109107382A TW109107382A TWI857019B TW I857019 B TWI857019 B TW I857019B TW 109107382 A TW109107382 A TW 109107382A TW 109107382 A TW109107382 A TW 109107382A TW I857019 B TWI857019 B TW I857019B
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TW
Taiwan
Prior art keywords
hole
conductive
resin layer
sealing resin
substrate
Prior art date
Application number
TW109107382A
Other languages
English (en)
Chinese (zh)
Other versions
TW202044955A (zh
Inventor
柴田智章
小川剛
李欣蓉
Original Assignee
日商力森諾科股份有限公司
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Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202044955A publication Critical patent/TW202044955A/zh
Application granted granted Critical
Publication of TWI857019B publication Critical patent/TWI857019B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H10W20/091—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts by printing or stamping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW109107382A 2019-03-06 2020-03-06 電子零件裝置的製造方法 TWI857019B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-040656 2019-03-06
JP2019040656 2019-03-06

Publications (2)

Publication Number Publication Date
TW202044955A TW202044955A (zh) 2020-12-01
TWI857019B true TWI857019B (zh) 2024-10-01

Family

ID=72337164

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109107382A TWI857019B (zh) 2019-03-06 2020-03-06 電子零件裝置的製造方法

Country Status (4)

Country Link
US (1) US12315760B2 (https=)
JP (1) JPWO2020179874A1 (https=)
TW (1) TWI857019B (https=)
WO (1) WO2020179874A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7714905B2 (ja) * 2021-04-23 2025-07-30 株式会社レゾナック 再配線層を形成する方法、及び、半導体パッケージを製造する方法

Citations (4)

* Cited by examiner, † Cited by third party
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JP2002033562A (ja) * 2000-07-19 2002-01-31 Sony Corp 絶縁層及び接続孔の形成方法、配線構造の形成方法、並びにこれらの方法の実施に使用する型材及びその製造方法
JP2005093767A (ja) * 2003-09-18 2005-04-07 Matsushita Electric Ind Co Ltd 回路基板の製造方法および回路基板
JP2017222930A (ja) * 2009-11-05 2017-12-21 オーメット サーキッツ インク 冶金ネットワーク組成物の調製およびその使用方法
TW201836094A (zh) * 2017-03-21 2018-10-01 日商富士軟片股份有限公司 積層裝置、積層體及積層裝置的製造方法

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US5948533A (en) 1990-02-09 1999-09-07 Ormet Corporation Vertically interconnected electronic assemblies and compositions useful therefor
WO2000059645A1 (en) * 1999-04-01 2000-10-12 Ormet Corporation Methods to produce robust multilayer circuitry for electronic packaging
JP4161909B2 (ja) 2004-01-16 2008-10-08 ソニー株式会社 半導体装置の製造方法
KR101214746B1 (ko) * 2008-09-03 2012-12-21 삼성전기주식회사 웨이퍼 레벨 패키지 및 그 제조방법
JP5645047B2 (ja) 2008-09-29 2014-12-24 日立化成株式会社 半導体素子搭載用パッケージ基板とその製法及び半導体パッケージ
CN103404239B (zh) * 2011-02-15 2015-11-25 株式会社村田制作所 多层配线基板及其制造方法
US8476770B2 (en) * 2011-07-07 2013-07-02 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and methods for forming through vias
JP5884477B2 (ja) 2011-12-27 2016-03-15 日立化成株式会社 半導体装置の製造方法、それにより得られる半導体装置及びそれに用いる熱硬化性樹脂組成物
US9005330B2 (en) * 2012-08-09 2015-04-14 Ormet Circuits, Inc. Electrically conductive compositions comprising non-eutectic solder alloys
KR102229384B1 (ko) * 2013-02-15 2021-03-18 오르멧 서키츠 인코퍼레이티드 다층 전자 기판의 z-축 상호 연결 구조물
US9607964B2 (en) * 2014-03-28 2017-03-28 Intel Corporation Method and materials for warpage thermal and interconnect solutions
US9831206B2 (en) 2014-03-28 2017-11-28 Intel Corporation LPS solder paste based low cost fine pitch pop interconnect solutions
JP6819599B2 (ja) * 2015-09-25 2021-01-27 大日本印刷株式会社 実装部品、配線基板、電子装置、およびその製造方法
JP2017108046A (ja) * 2015-12-11 2017-06-15 ルネサスエレクトロニクス株式会社 半導体装置
CN106384745B (zh) * 2016-11-16 2019-01-08 京东方科技集团股份有限公司 显示基板的制备方法
US10485091B2 (en) * 2016-11-29 2019-11-19 Nxp Usa, Inc. Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof
WO2018105125A1 (ja) * 2016-12-09 2018-06-14 日立化成株式会社 組成物、接着剤、焼結体、接合体及び接合体の製造方法
US10163803B1 (en) 2017-06-20 2018-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated fan-out packages and methods of forming the same
US20200273830A1 (en) * 2019-02-27 2020-08-27 Nepes Co., Ltd. Semiconductor device and method for manufacturing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002033562A (ja) * 2000-07-19 2002-01-31 Sony Corp 絶縁層及び接続孔の形成方法、配線構造の形成方法、並びにこれらの方法の実施に使用する型材及びその製造方法
JP2005093767A (ja) * 2003-09-18 2005-04-07 Matsushita Electric Ind Co Ltd 回路基板の製造方法および回路基板
JP2017222930A (ja) * 2009-11-05 2017-12-21 オーメット サーキッツ インク 冶金ネットワーク組成物の調製およびその使用方法
TW201836094A (zh) * 2017-03-21 2018-10-01 日商富士軟片股份有限公司 積層裝置、積層體及積層裝置的製造方法

Also Published As

Publication number Publication date
JPWO2020179874A1 (https=) 2020-09-10
US12315760B2 (en) 2025-05-27
WO2020179874A1 (ja) 2020-09-10
US20220148914A1 (en) 2022-05-12
TW202044955A (zh) 2020-12-01

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