TWI850391B - 高頻用印刷基板、含氟環氧樹脂之製造方法及硬化性組成物 - Google Patents

高頻用印刷基板、含氟環氧樹脂之製造方法及硬化性組成物 Download PDF

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Publication number
TWI850391B
TWI850391B TW109118063A TW109118063A TWI850391B TW I850391 B TWI850391 B TW I850391B TW 109118063 A TW109118063 A TW 109118063A TW 109118063 A TW109118063 A TW 109118063A TW I850391 B TWI850391 B TW I850391B
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Taiwan
Prior art keywords
epoxy resin
fluorine
following formula
represented
formula
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TW109118063A
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English (en)
Chinese (zh)
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TW202106747A (zh
Inventor
田中義人
吉田知弘
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日商大金工業股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/308—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
TW109118063A 2019-06-12 2020-05-29 高頻用印刷基板、含氟環氧樹脂之製造方法及硬化性組成物 TWI850391B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2019-109435 2019-06-12
JP2019109435 2019-06-12

Publications (2)

Publication Number Publication Date
TW202106747A TW202106747A (zh) 2021-02-16
TWI850391B true TWI850391B (zh) 2024-08-01

Family

ID=73781962

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TW109118063A TWI850391B (zh) 2019-06-12 2020-05-29 高頻用印刷基板、含氟環氧樹脂之製造方法及硬化性組成物

Country Status (7)

Country Link
US (1) US11965060B2 (https=)
EP (1) EP3960788A4 (https=)
JP (1) JP7699541B2 (https=)
KR (1) KR102865032B1 (https=)
CN (1) CN113784999B (https=)
TW (1) TWI850391B (https=)
WO (1) WO2020250684A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4053214A4 (en) * 2019-12-12 2023-11-22 Daikin Industries, Ltd. Composition, curable composition, and cured product
CN116675951A (zh) * 2023-06-06 2023-09-01 山东万亿体育健康服务有限公司 一种高性能碳纤维预浸料用含氟环氧树脂及其制备方法
CN116554437A (zh) * 2023-06-12 2023-08-08 哈尔滨工业大学 一种线性含氟缩水甘油醚及其制备方法和应用

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0830028B2 (ja) * 1987-06-15 1996-03-27 ダイキン工業株式会社 含フッ素脂環式化合物及びその製造法
US5202360A (en) * 1987-06-15 1993-04-13 Daiken Industries, Ltd. Fluorine-containing alicyclic and aromatic cyclic compounds, process thereof and adhesive composition containing the compound
DE3885940T2 (de) * 1987-06-15 1994-05-26 Daikin Ind Ltd Fluor enthaltende alizyklische und aromatische Verbindungen, Verfahren zu ihrer Herstellung und sie enthaltende Kleberzusammensetzungen.
JP2745654B2 (ja) * 1989-03-17 1998-04-28 ダイキン工業株式会社 積層板
US4981941A (en) * 1989-03-27 1991-01-01 The United States Of America As Represented By The Secretary Of The Navy Fluorinated epoxy resins with high glass transition temperatures
JP3203465B2 (ja) * 1993-12-29 2001-08-27 キヤノン株式会社 静電荷像現像用トナー
US5578740A (en) * 1994-12-23 1996-11-26 The Dow Chemical Company Process for preparation of epoxy compounds essentially free of organic halides
JP2003177260A (ja) * 2001-12-13 2003-06-27 Showa Denko Kk 光導波路樹脂用組成物
JP2006233078A (ja) 2005-02-25 2006-09-07 Nippon Kayaku Co Ltd エポキシ樹脂の改質方法
JP2009167354A (ja) * 2008-01-18 2009-07-30 Daikin Ind Ltd 多官能アクリレートを含む硬化性組成物
JP5549054B2 (ja) * 2008-01-18 2014-07-16 ダイキン工業株式会社 多官能アクリレート
JP6452335B2 (ja) * 2013-08-09 2019-01-16 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
CN106280254A (zh) * 2016-08-15 2017-01-04 江苏中鹏新材料股份有限公司 一种低介电常数模塑型环氧底填料及其制备方法与用途
EP4053214A4 (en) * 2019-12-12 2023-11-22 Daikin Industries, Ltd. Composition, curable composition, and cured product

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
期刊 T. Maruno, K. Nakamura, and N. Murata Synthesisand Properties of a Novel Fluorine-Containing AlicyclicDiepoxide Macromolecules Synthesisand Properties of a Novel Fluorine-Containing AlicyclicDiepoxide Macromolecules Vol 29 1996 Murata Synthesisand Properties of a Novel Fluorine-Containing AlicyclicDiepoxide Macromolecules 1996 1996

Also Published As

Publication number Publication date
TW202106747A (zh) 2021-02-16
US11965060B2 (en) 2024-04-23
WO2020250684A1 (ja) 2020-12-17
KR102865032B1 (ko) 2025-09-26
JPWO2020250684A1 (https=) 2020-12-17
KR20220010541A (ko) 2022-01-25
EP3960788A4 (en) 2023-01-25
US20220081507A1 (en) 2022-03-17
CN113784999B (zh) 2024-09-20
JP7699541B2 (ja) 2025-06-27
EP3960788A1 (en) 2022-03-02
CN113784999A (zh) 2021-12-10

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