JP7699541B2 - 電材用含フッ素エポキシ樹脂及びその製造方法 - Google Patents

電材用含フッ素エポキシ樹脂及びその製造方法 Download PDF

Info

Publication number
JP7699541B2
JP7699541B2 JP2021525984A JP2021525984A JP7699541B2 JP 7699541 B2 JP7699541 B2 JP 7699541B2 JP 2021525984 A JP2021525984 A JP 2021525984A JP 2021525984 A JP2021525984 A JP 2021525984A JP 7699541 B2 JP7699541 B2 JP 7699541B2
Authority
JP
Japan
Prior art keywords
fluorine
epoxy resin
formula
containing epoxy
following formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021525984A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2020250684A1 (https=
JPWO2020250684A5 (https=
Inventor
義人 田中
知弘 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Original Assignee
Daikin Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Industries Ltd filed Critical Daikin Industries Ltd
Publication of JPWO2020250684A1 publication Critical patent/JPWO2020250684A1/ja
Publication of JPWO2020250684A5 publication Critical patent/JPWO2020250684A5/ja
Application granted granted Critical
Publication of JP7699541B2 publication Critical patent/JP7699541B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/308—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
JP2021525984A 2019-06-12 2020-05-27 電材用含フッ素エポキシ樹脂及びその製造方法 Active JP7699541B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019109435 2019-06-12
JP2019109435 2019-06-12
PCT/JP2020/020963 WO2020250684A1 (ja) 2019-06-12 2020-05-27 電材用含フッ素エポキシ樹脂及びその製造方法

Publications (3)

Publication Number Publication Date
JPWO2020250684A1 JPWO2020250684A1 (https=) 2020-12-17
JPWO2020250684A5 JPWO2020250684A5 (https=) 2022-01-20
JP7699541B2 true JP7699541B2 (ja) 2025-06-27

Family

ID=73781962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021525984A Active JP7699541B2 (ja) 2019-06-12 2020-05-27 電材用含フッ素エポキシ樹脂及びその製造方法

Country Status (7)

Country Link
US (1) US11965060B2 (https=)
EP (1) EP3960788A4 (https=)
JP (1) JP7699541B2 (https=)
KR (1) KR102865032B1 (https=)
CN (1) CN113784999B (https=)
TW (1) TWI850391B (https=)
WO (1) WO2020250684A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4053214A4 (en) * 2019-12-12 2023-11-22 Daikin Industries, Ltd. Composition, curable composition, and cured product
CN116675951A (zh) * 2023-06-06 2023-09-01 山东万亿体育健康服务有限公司 一种高性能碳纤维预浸料用含氟环氧树脂及其制备方法
CN116554437A (zh) * 2023-06-12 2023-08-08 哈尔滨工业大学 一种线性含氟缩水甘油醚及其制备方法和应用

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0830028B2 (ja) * 1987-06-15 1996-03-27 ダイキン工業株式会社 含フッ素脂環式化合物及びその製造法
US5202360A (en) * 1987-06-15 1993-04-13 Daiken Industries, Ltd. Fluorine-containing alicyclic and aromatic cyclic compounds, process thereof and adhesive composition containing the compound
DE3885940T2 (de) * 1987-06-15 1994-05-26 Daikin Ind Ltd Fluor enthaltende alizyklische und aromatische Verbindungen, Verfahren zu ihrer Herstellung und sie enthaltende Kleberzusammensetzungen.
JP2745654B2 (ja) * 1989-03-17 1998-04-28 ダイキン工業株式会社 積層板
US4981941A (en) * 1989-03-27 1991-01-01 The United States Of America As Represented By The Secretary Of The Navy Fluorinated epoxy resins with high glass transition temperatures
JP3203465B2 (ja) * 1993-12-29 2001-08-27 キヤノン株式会社 静電荷像現像用トナー
US5578740A (en) * 1994-12-23 1996-11-26 The Dow Chemical Company Process for preparation of epoxy compounds essentially free of organic halides
JP2003177260A (ja) * 2001-12-13 2003-06-27 Showa Denko Kk 光導波路樹脂用組成物
JP2006233078A (ja) 2005-02-25 2006-09-07 Nippon Kayaku Co Ltd エポキシ樹脂の改質方法
JP2009167354A (ja) * 2008-01-18 2009-07-30 Daikin Ind Ltd 多官能アクリレートを含む硬化性組成物
JP5549054B2 (ja) * 2008-01-18 2014-07-16 ダイキン工業株式会社 多官能アクリレート
JP6452335B2 (ja) * 2013-08-09 2019-01-16 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
CN106280254A (zh) * 2016-08-15 2017-01-04 江苏中鹏新材料股份有限公司 一种低介电常数模塑型环氧底填料及其制备方法与用途
EP4053214A4 (en) * 2019-12-12 2023-11-22 Daikin Industries, Ltd. Composition, curable composition, and cured product

Also Published As

Publication number Publication date
TW202106747A (zh) 2021-02-16
US11965060B2 (en) 2024-04-23
WO2020250684A1 (ja) 2020-12-17
KR102865032B1 (ko) 2025-09-26
JPWO2020250684A1 (https=) 2020-12-17
KR20220010541A (ko) 2022-01-25
EP3960788A4 (en) 2023-01-25
US20220081507A1 (en) 2022-03-17
CN113784999B (zh) 2024-09-20
EP3960788A1 (en) 2022-03-02
CN113784999A (zh) 2021-12-10
TWI850391B (zh) 2024-08-01

Similar Documents

Publication Publication Date Title
JP6689475B1 (ja) マレイミド樹脂、硬化性樹脂組成物およびその硬化物
CN101643571B (zh) 热固性树脂组合物及用其制成的半固化片与印制电路用层压板
TWI639628B (zh) 環氧樹脂組成物及其硬化物
US11965060B2 (en) Fluorine-containing epoxy resin for electrical materials and method for manufacturing same
JP2014525496A (ja) エポキシベンジル末端ポリ（アリーレンエーテル）、その調製方法およびそれを含む硬化性組成物
JP7128598B1 (ja) エポキシ樹脂混合物、エポキシ樹脂組成物およびその硬化物
JP6963565B2 (ja) アルケニル基含有樹脂、硬化性樹脂組成物およびその硬化物
JP4144732B2 (ja) 高分子量エポキシ樹脂、電気積層板用樹脂組成物及び電気積層板
JP6715249B2 (ja) エポキシ樹脂、変性エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
JP2024029749A (ja) エポキシ樹脂、硬化性樹脂組成物、及びこれらの硬化物並びに炭素繊維強化複合材料
JP2022033902A (ja) 組成物、硬化性組成物、及び、硬化物
WO2020017141A1 (ja) 反応性希釈剤、組成物、封止材、硬化物、基板、電子部品、エポキシ化合物、及び化合物の製造方法
JP4622036B2 (ja) 熱硬化性樹脂組成物、硬化物、積層板用プリプレグ、及びプリント配線基板
JP7464474B2 (ja) マレイミド樹脂、硬化性樹脂組成物およびその硬化物
JP7307668B2 (ja) エポキシ樹脂、およびエポキシ樹脂組成物
JP2008231428A (ja) 高分子量エポキシ樹脂、電気積層板用樹脂組成物及び電気積層板
JP7437253B2 (ja) フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
JP7132385B1 (ja) エポキシ樹脂、硬化性樹脂組成物、およびその硬化物
TW202532501A (zh) 環氧樹脂混合物、硬化性樹脂組成物及其硬化物
JP2025025222A (ja) エポキシ樹脂、硬化性樹脂組成物、硬化物及び炭素繊維強化複合材料
JP2025118710A (ja) エポキシ樹脂、硬化性樹脂組成物、およびその硬化物
JP2025006753A (ja) 硬化性樹脂組成物、硬化物、電気・電子部品

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211014

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20211014

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20221101

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20230322

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230609

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20230619

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20230901

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250410

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250617

R150 Certificate of patent or registration of utility model

Ref document number: 7699541

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150