KR102865032B1 - 전자 재료용 불소 함유 에폭시 수지 및 그 제조 방법 - Google Patents

전자 재료용 불소 함유 에폭시 수지 및 그 제조 방법

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Publication number
KR102865032B1
KR102865032B1 KR1020217041328A KR20217041328A KR102865032B1 KR 102865032 B1 KR102865032 B1 KR 102865032B1 KR 1020217041328 A KR1020217041328 A KR 1020217041328A KR 20217041328 A KR20217041328 A KR 20217041328A KR 102865032 B1 KR102865032 B1 KR 102865032B1
Authority
KR
South Korea
Prior art keywords
fluorine
epoxy resin
containing epoxy
formula
present disclosure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
KR1020217041328A
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English (en)
Korean (ko)
Other versions
KR20220010541A (ko
Inventor
요시토 다나카
도모히로 요시다
Original Assignee
다이킨 고교 가부시키가이샤
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Publication of KR20220010541A publication Critical patent/KR20220010541A/ko
Application granted granted Critical
Publication of KR102865032B1 publication Critical patent/KR102865032B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/308—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
KR1020217041328A 2019-06-12 2020-05-27 전자 재료용 불소 함유 에폭시 수지 및 그 제조 방법 Active KR102865032B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-109435 2019-06-12
JP2019109435 2019-06-12
PCT/JP2020/020963 WO2020250684A1 (ja) 2019-06-12 2020-05-27 電材用含フッ素エポキシ樹脂及びその製造方法

Publications (2)

Publication Number Publication Date
KR20220010541A KR20220010541A (ko) 2022-01-25
KR102865032B1 true KR102865032B1 (ko) 2025-09-26

Family

ID=73781962

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217041328A Active KR102865032B1 (ko) 2019-06-12 2020-05-27 전자 재료용 불소 함유 에폭시 수지 및 그 제조 방법

Country Status (7)

Country Link
US (1) US11965060B2 (https=)
EP (1) EP3960788A4 (https=)
JP (1) JP7699541B2 (https=)
KR (1) KR102865032B1 (https=)
CN (1) CN113784999B (https=)
TW (1) TWI850391B (https=)
WO (1) WO2020250684A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4053214A4 (en) * 2019-12-12 2023-11-22 Daikin Industries, Ltd. Composition, curable composition, and cured product
CN116675951A (zh) * 2023-06-06 2023-09-01 山东万亿体育健康服务有限公司 一种高性能碳纤维预浸料用含氟环氧树脂及其制备方法
CN116554437A (zh) * 2023-06-12 2023-08-08 哈尔滨工业大学 一种线性含氟缩水甘油醚及其制备方法和应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003177260A (ja) 2001-12-13 2003-06-27 Showa Denko Kk 光導波路樹脂用組成物
KR100395988B1 (ko) * 1994-12-23 2003-11-14 다우 글로벌 테크놀로지스 인크. 에폭시화합물의제조방법
JP2009167357A (ja) 2008-01-18 2009-07-30 Daikin Ind Ltd 多官能アクリレート
CN106280254A (zh) 2016-08-15 2017-01-04 江苏中鹏新材料股份有限公司 一种低介电常数模塑型环氧底填料及其制备方法与用途

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0830028B2 (ja) * 1987-06-15 1996-03-27 ダイキン工業株式会社 含フッ素脂環式化合物及びその製造法
US5202360A (en) * 1987-06-15 1993-04-13 Daiken Industries, Ltd. Fluorine-containing alicyclic and aromatic cyclic compounds, process thereof and adhesive composition containing the compound
DE3885940T2 (de) * 1987-06-15 1994-05-26 Daikin Ind Ltd Fluor enthaltende alizyklische und aromatische Verbindungen, Verfahren zu ihrer Herstellung und sie enthaltende Kleberzusammensetzungen.
JP2745654B2 (ja) * 1989-03-17 1998-04-28 ダイキン工業株式会社 積層板
US4981941A (en) * 1989-03-27 1991-01-01 The United States Of America As Represented By The Secretary Of The Navy Fluorinated epoxy resins with high glass transition temperatures
JP3203465B2 (ja) * 1993-12-29 2001-08-27 キヤノン株式会社 静電荷像現像用トナー
JP2006233078A (ja) 2005-02-25 2006-09-07 Nippon Kayaku Co Ltd エポキシ樹脂の改質方法
JP2009167354A (ja) * 2008-01-18 2009-07-30 Daikin Ind Ltd 多官能アクリレートを含む硬化性組成物
JP6452335B2 (ja) * 2013-08-09 2019-01-16 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
EP4053214A4 (en) * 2019-12-12 2023-11-22 Daikin Industries, Ltd. Composition, curable composition, and cured product

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100395988B1 (ko) * 1994-12-23 2003-11-14 다우 글로벌 테크놀로지스 인크. 에폭시화합물의제조방법
JP2003177260A (ja) 2001-12-13 2003-06-27 Showa Denko Kk 光導波路樹脂用組成物
JP2009167357A (ja) 2008-01-18 2009-07-30 Daikin Ind Ltd 多官能アクリレート
CN106280254A (zh) 2016-08-15 2017-01-04 江苏中鹏新材料股份有限公司 一种低介电常数模塑型环氧底填料及其制备方法与用途

Also Published As

Publication number Publication date
TW202106747A (zh) 2021-02-16
US11965060B2 (en) 2024-04-23
WO2020250684A1 (ja) 2020-12-17
JPWO2020250684A1 (https=) 2020-12-17
KR20220010541A (ko) 2022-01-25
EP3960788A4 (en) 2023-01-25
US20220081507A1 (en) 2022-03-17
CN113784999B (zh) 2024-09-20
JP7699541B2 (ja) 2025-06-27
EP3960788A1 (en) 2022-03-02
CN113784999A (zh) 2021-12-10
TWI850391B (zh) 2024-08-01

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