TWI843792B - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
TWI843792B
TWI843792B TW109101026A TW109101026A TWI843792B TW I843792 B TWI843792 B TW I843792B TW 109101026 A TW109101026 A TW 109101026A TW 109101026 A TW109101026 A TW 109101026A TW I843792 B TWI843792 B TW I843792B
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TW
Taiwan
Prior art keywords
resin
resin composition
group
manufactured
mass
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TW109101026A
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English (en)
Chinese (zh)
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TW202035556A (zh
Inventor
西村嘉生
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日商味之素股份有限公司
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=71999818&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI843792(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW202035556A publication Critical patent/TW202035556A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00—Properties characterising the ingredient of the composition
    • C08L2207/04—Thermoplastic elastomer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW109101026A 2019-02-08 2020-01-13 樹脂組成物 TWI843792B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-022003 2019-02-08
JP2019022003A JP7555694B2 (ja) 2019-02-08 2019-02-08 樹脂組成物

Publications (2)

Publication Number Publication Date
TW202035556A TW202035556A (zh) 2020-10-01
TWI843792B true TWI843792B (zh) 2024-06-01

Family

ID=71999818

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109101026A TWI843792B (zh) 2019-02-08 2020-01-13 樹脂組成物

Country Status (4)

Country Link
JP (3) JP7555694B2 (enExample)
KR (1) KR102888654B1 (enExample)
CN (1) CN111548625B (enExample)
TW (1) TWI843792B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114621559B (zh) * 2020-12-09 2023-07-11 广东生益科技股份有限公司 一种热固性树脂组合物及包含其的预浸料、层压板和高频电路基板
JP7636123B2 (ja) * 2020-12-18 2025-02-26 信越化学工業株式会社 熱硬化性マレイミド樹脂組成物
CN114672166B (zh) * 2020-12-24 2023-08-15 广东生益科技股份有限公司 一种无卤阻燃型树脂组合物及其制成的预浸料和印制电路用层压板
JP7774963B2 (ja) * 2021-01-14 2025-11-25 味の素株式会社 樹脂組成物
JP7770771B2 (ja) * 2021-01-14 2025-11-17 味の素株式会社 樹脂組成物
JP2022133794A (ja) * 2021-03-02 2022-09-14 味の素株式会社 樹脂組成物
JP7666047B2 (ja) * 2021-03-22 2025-04-22 味の素株式会社 樹脂シート
JP7655752B2 (ja) * 2021-03-26 2025-04-02 日鉄ケミカル＆マテリアル株式会社 ポリイミド、樹脂組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板
WO2022255137A1 (ja) * 2021-06-02 2022-12-08 信越ポリマー株式会社 接着剤組成物
JP7719658B2 (ja) * 2021-07-30 2025-08-06 帝人株式会社 アリル基含有ポリカーボネート樹脂及び硬化性樹脂組成物
JP7707999B2 (ja) * 2022-04-25 2025-07-15 味の素株式会社 樹脂組成物
TWI805377B (zh) * 2022-05-20 2023-06-11 聯茂電子股份有限公司 熱固性樹脂組合物、使用其的預浸料、層壓板及印刷電路板
JP2023179860A (ja) * 2022-06-08 2023-12-20 日本化薬株式会社 ポリイミド樹脂組成物及びその硬化物
KR20250130297A (ko) * 2022-12-28 2025-09-01 가부시끼가이샤 레조낙 지지체 구비 수지 필름, 그리고 프린트 배선판의 제조 방법 및 반도체 패키지의 제조 방법
JPWO2024143280A1 (enExample) * 2022-12-28 2024-07-04
CN119136980A (zh) * 2022-12-28 2024-12-13 株式会社力森诺科 树脂膜、印刷线路板和半导体封装体
KR20250053459A (ko) * 2023-10-13 2025-04-22 주식회사 두산 열경화성 수지 조성물, 이를 포함하는 프리프레그, 금속박 적층체, 적층 시트 및 인쇄회로기판
WO2025225621A1 (ja) * 2024-04-26 2025-10-30 三菱瓦斯化学株式会社 樹脂組成物、樹脂シート、および、多層体
WO2025253852A1 (ja) * 2024-06-07 2025-12-11 味の素株式会社 樹脂組成物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016210852A (ja) * 2015-04-30 2016-12-15 味の素株式会社 樹脂組成物
TW201826450A (zh) * 2016-09-28 2018-07-16 日商味之素股份有限公司 樹脂組成物
CN109206903A (zh) * 2017-06-30 2019-01-15 琳得科株式会社 树脂组合物及树脂片

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009155354A (ja) * 2006-03-30 2009-07-16 Ajinomoto Co Inc 絶縁層用樹脂組成物
JP6369134B2 (ja) 2014-05-28 2018-08-08 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ
KR101776560B1 (ko) 2014-11-06 2017-09-19 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판
JP6708947B2 (ja) 2016-01-14 2020-06-10 日立化成株式会社 ミリ波レーダー用印刷配線板製造用樹脂フィルムの製造方法
CN110050018B (zh) 2016-12-09 2022-08-26 松下知识产权经营株式会社 预浸料、覆金属层压板和印刷线路板
WO2018168715A1 (ja) 2017-03-13 2018-09-20 リンテック株式会社 樹脂組成物及び樹脂シート
CN111630076B (zh) 2017-12-28 2023-10-27 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板以及布线板
CN108219371B (zh) 2017-12-29 2020-08-18 广东生益科技股份有限公司 环氧树脂组合物、预浸料、层压板和印刷电路板
CN108559209B (zh) 2017-12-29 2019-07-26 广东生益科技股份有限公司 树脂组合物、预浸料、层压板以及覆金属箔层压板
US11365274B2 (en) 2018-03-28 2022-06-21 Panasonic Intellectual Property Management Co., Ltd. Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016210852A (ja) * 2015-04-30 2016-12-15 味の素株式会社 樹脂組成物
TW201826450A (zh) * 2016-09-28 2018-07-16 日商味之素股份有限公司 樹脂組成物
CN109206903A (zh) * 2017-06-30 2019-01-15 琳得科株式会社 树脂组合物及树脂片

Also Published As

Publication number Publication date
JP7555694B2 (ja) 2024-09-25
KR20200097645A (ko) 2020-08-19
JP2023002638A (ja) 2023-01-10
JP2020128501A (ja) 2020-08-27
CN111548625A (zh) 2020-08-18
JP7501583B2 (ja) 2024-06-18
KR102888654B1 (ko) 2025-11-21
TW202035556A (zh) 2020-10-01
CN111548625B (zh) 2024-04-05
JP2024114775A (ja) 2024-08-23

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