JP7555694B2 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

Info

Publication number
JP7555694B2
JP7555694B2 JP2019022003A JP2019022003A JP7555694B2 JP 7555694 B2 JP7555694 B2 JP 7555694B2 JP 2019022003 A JP2019022003 A JP 2019022003A JP 2019022003 A JP2019022003 A JP 2019022003A JP 7555694 B2 JP7555694 B2 JP 7555694B2
Authority
JP
Japan
Prior art keywords
group
resin composition
mass
resin
manufactured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019022003A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020128501A (ja
Inventor
嘉生 西村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=71999818&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP7555694(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority to JP2019022003A priority Critical patent/JP7555694B2/ja
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to TW109101026A priority patent/TWI843792B/zh
Priority to KR1020200012057A priority patent/KR102888654B1/ko
Priority to CN202010078572.7A priority patent/CN111548625B/zh
Publication of JP2020128501A publication Critical patent/JP2020128501A/ja
Priority to JP2022164319A priority patent/JP7501583B2/ja
Priority to JP2024101334A priority patent/JP2024114775A/ja
Publication of JP7555694B2 publication Critical patent/JP7555694B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00—Properties characterising the ingredient of the composition
    • C08L2207/04—Thermoplastic elastomer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2019022003A 2019-02-08 2019-02-08 樹脂組成物 Active JP7555694B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2019022003A JP7555694B2 (ja) 2019-02-08 2019-02-08 樹脂組成物
TW109101026A TWI843792B (zh) 2019-02-08 2020-01-13 樹脂組成物
KR1020200012057A KR102888654B1 (ko) 2019-02-08 2020-01-31 수지 조성물
CN202010078572.7A CN111548625B (zh) 2019-02-08 2020-02-03 树脂组合物
JP2022164319A JP7501583B2 (ja) 2019-02-08 2022-10-12 樹脂組成物
JP2024101334A JP2024114775A (ja) 2019-02-08 2024-06-24 樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019022003A JP7555694B2 (ja) 2019-02-08 2019-02-08 樹脂組成物

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2022164319A Division JP7501583B2 (ja) 2019-02-08 2022-10-12 樹脂組成物
JP2024101334A Division JP2024114775A (ja) 2019-02-08 2024-06-24 樹脂組成物

Publications (2)

Publication Number Publication Date
JP2020128501A JP2020128501A (ja) 2020-08-27
JP7555694B2 true JP7555694B2 (ja) 2024-09-25

Family

ID=71999818

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2019022003A Active JP7555694B2 (ja) 2019-02-08 2019-02-08 樹脂組成物
JP2022164319A Active JP7501583B2 (ja) 2019-02-08 2022-10-12 樹脂組成物
JP2024101334A Pending JP2024114775A (ja) 2019-02-08 2024-06-24 樹脂組成物

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2022164319A Active JP7501583B2 (ja) 2019-02-08 2022-10-12 樹脂組成物
JP2024101334A Pending JP2024114775A (ja) 2019-02-08 2024-06-24 樹脂組成物

Country Status (4)

Country Link
JP (3) JP7555694B2 (enExample)
KR (1) KR102888654B1 (enExample)
CN (1) CN111548625B (enExample)
TW (1) TWI843792B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114621559B (zh) * 2020-12-09 2023-07-11 广东生益科技股份有限公司 一种热固性树脂组合物及包含其的预浸料、层压板和高频电路基板
JP7636123B2 (ja) * 2020-12-18 2025-02-26 信越化学工業株式会社 熱硬化性マレイミド樹脂組成物
CN114672166B (zh) * 2020-12-24 2023-08-15 广东生益科技股份有限公司 一种无卤阻燃型树脂组合物及其制成的预浸料和印制电路用层压板
JP7774963B2 (ja) * 2021-01-14 2025-11-25 味の素株式会社 樹脂組成物
JP7770771B2 (ja) * 2021-01-14 2025-11-17 味の素株式会社 樹脂組成物
JP2022133794A (ja) * 2021-03-02 2022-09-14 味の素株式会社 樹脂組成物
JP7666047B2 (ja) * 2021-03-22 2025-04-22 味の素株式会社 樹脂シート
JP7655752B2 (ja) * 2021-03-26 2025-04-02 日鉄ケミカル＆マテリアル株式会社 ポリイミド、樹脂組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板
WO2022255137A1 (ja) * 2021-06-02 2022-12-08 信越ポリマー株式会社 接着剤組成物
JP7719658B2 (ja) * 2021-07-30 2025-08-06 帝人株式会社 アリル基含有ポリカーボネート樹脂及び硬化性樹脂組成物
JP7707999B2 (ja) * 2022-04-25 2025-07-15 味の素株式会社 樹脂組成物
TWI805377B (zh) * 2022-05-20 2023-06-11 聯茂電子股份有限公司 熱固性樹脂組合物、使用其的預浸料、層壓板及印刷電路板
JP2023179860A (ja) * 2022-06-08 2023-12-20 日本化薬株式会社 ポリイミド樹脂組成物及びその硬化物
KR20250130297A (ko) * 2022-12-28 2025-09-01 가부시끼가이샤 레조낙 지지체 구비 수지 필름, 그리고 프린트 배선판의 제조 방법 및 반도체 패키지의 제조 방법
JPWO2024143280A1 (enExample) * 2022-12-28 2024-07-04
CN119136980A (zh) * 2022-12-28 2024-12-13 株式会社力森诺科 树脂膜、印刷线路板和半导体封装体
KR20250053459A (ko) * 2023-10-13 2025-04-22 주식회사 두산 열경화성 수지 조성물, 이를 포함하는 프리프레그, 금속박 적층체, 적층 시트 및 인쇄회로기판
WO2025225621A1 (ja) * 2024-04-26 2025-10-30 三菱瓦斯化学株式会社 樹脂組成物、樹脂シート、および、多層体
WO2025253852A1 (ja) * 2024-06-07 2025-12-11 味の素株式会社 樹脂組成物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015224307A (ja) 2014-05-28 2015-12-14 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ
WO2016072404A1 (ja) 2014-11-06 2016-05-12 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、及びプリント配線板
JP2016210852A (ja) 2015-04-30 2016-12-15 味の素株式会社 樹脂組成物
JP2017125128A (ja) 2016-01-14 2017-07-20 日立化成株式会社 ミリ波レーダー用印刷配線板製造用樹脂フィルムの製造方法
WO2018168715A1 (ja) 2017-03-13 2018-09-20 リンテック株式会社 樹脂組成物及び樹脂シート

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009155354A (ja) * 2006-03-30 2009-07-16 Ajinomoto Co Inc 絶縁層用樹脂組成物
JP7102093B2 (ja) * 2016-09-28 2022-07-19 味の素株式会社 樹脂組成物、樹脂シート、回路基板及び半導体チップパッケージ
CN110050018B (zh) 2016-12-09 2022-08-26 松下知识产权经营株式会社 预浸料、覆金属层压板和印刷线路板
TWI758489B (zh) * 2017-06-30 2022-03-21 日商琳得科股份有限公司 樹脂組成物及樹脂薄片
CN111630076B (zh) 2017-12-28 2023-10-27 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板以及布线板
CN108219371B (zh) 2017-12-29 2020-08-18 广东生益科技股份有限公司 环氧树脂组合物、预浸料、层压板和印刷电路板
CN108559209B (zh) 2017-12-29 2019-07-26 广东生益科技股份有限公司 树脂组合物、预浸料、层压板以及覆金属箔层压板
US11365274B2 (en) 2018-03-28 2022-06-21 Panasonic Intellectual Property Management Co., Ltd. Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015224307A (ja) 2014-05-28 2015-12-14 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ
WO2016072404A1 (ja) 2014-11-06 2016-05-12 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、及びプリント配線板
JP2016210852A (ja) 2015-04-30 2016-12-15 味の素株式会社 樹脂組成物
JP2017125128A (ja) 2016-01-14 2017-07-20 日立化成株式会社 ミリ波レーダー用印刷配線板製造用樹脂フィルムの製造方法
WO2018168715A1 (ja) 2017-03-13 2018-09-20 リンテック株式会社 樹脂組成物及び樹脂シート

Also Published As

Publication number Publication date
KR20200097645A (ko) 2020-08-19
JP2023002638A (ja) 2023-01-10
JP2020128501A (ja) 2020-08-27
CN111548625A (zh) 2020-08-18
JP7501583B2 (ja) 2024-06-18
KR102888654B1 (ko) 2025-11-21
TW202035556A (zh) 2020-10-01
CN111548625B (zh) 2024-04-05
TWI843792B (zh) 2024-06-01
JP2024114775A (ja) 2024-08-23

Similar Documents

Publication Publication Date Title
JP7501583B2 (ja) 樹脂組成物
JP7491343B2 (ja) 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置
JP7647827B2 (ja) 樹脂組成物
TW202012533A (zh) 樹脂組成物
JP7505526B2 (ja) 樹脂シート、及び樹脂組成物
JP7761380B2 (ja) 樹脂組成物
JP2020015861A (ja) 樹脂組成物
JP7298383B2 (ja) 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置
JP7585603B2 (ja) 樹脂組成物
TWI801522B (zh) 樹脂組成物
JP2020015860A (ja) 樹脂組成物
JP7414143B2 (ja) 樹脂組成物
JP7272473B2 (ja) 樹脂組成物
JP7552673B2 (ja) 樹脂組成物

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20211020

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20211020

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20220215

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220315

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220510

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20220712

C60 Trial request (containing other claim documents, opposition documents)

Free format text: JAPANESE INTERMEDIATE CODE: C60

Effective date: 20221012

C116 Written invitation by the chief administrative judge to file amendments

Free format text: JAPANESE INTERMEDIATE CODE: C116

Effective date: 20221025

C22 Notice of designation (change) of administrative judge

Free format text: JAPANESE INTERMEDIATE CODE: C22

Effective date: 20221025

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240624

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240911

R150 Certificate of patent or registration of utility model

Ref document number: 7555694

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150