JP2023083345A - 樹脂組成物 - Google Patents
樹脂組成物 Download PDFInfo
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- JP2023083345A JP2023083345A JP2023062063A JP2023062063A JP2023083345A JP 2023083345 A JP2023083345 A JP 2023083345A JP 2023062063 A JP2023062063 A JP 2023062063A JP 2023062063 A JP2023062063 A JP 2023062063A JP 2023083345 A JP2023083345 A JP 2023083345A
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- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- BDAGIHXWWSANSR-NJFSPNSNSA-N hydroxyformaldehyde Chemical compound O[14CH]=O BDAGIHXWWSANSR-NJFSPNSNSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 150000002505 iron Chemical class 0.000 description 1
- AQBLLJNPHDIAPN-LNTINUHCSA-K iron(3+);(z)-4-oxopent-2-en-2-olate Chemical compound [Fe+3].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O AQBLLJNPHDIAPN-LNTINUHCSA-K 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 150000002696 manganese Chemical class 0.000 description 1
- ZQZQURFYFJBOCE-FDGPNNRMSA-L manganese(2+);(z)-4-oxopent-2-en-2-olate Chemical compound [Mn+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O ZQZQURFYFJBOCE-FDGPNNRMSA-L 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
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- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000004682 monohydrates Chemical class 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- FZZQNEVOYIYFPF-UHFFFAOYSA-N naphthalene-1,6-diol Chemical compound OC1=CC=CC2=CC(O)=CC=C21 FZZQNEVOYIYFPF-UHFFFAOYSA-N 0.000 description 1
- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
- DFQICHCWIIJABH-UHFFFAOYSA-N naphthalene-2,7-diol Chemical compound C1=CC(O)=CC2=CC(O)=CC=C21 DFQICHCWIIJABH-UHFFFAOYSA-N 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
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- 150000002815 nickel Chemical class 0.000 description 1
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- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000006611 nonyloxy group Chemical group 0.000 description 1
- JFOJYGMDZRCSPA-UHFFFAOYSA-J octadecanoate;tin(4+) Chemical compound [Sn+4].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O JFOJYGMDZRCSPA-UHFFFAOYSA-J 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
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- 125000004043 oxo group Chemical group O=* 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- PRCNQQRRDGMPKS-UHFFFAOYSA-N pentane-2,4-dione;zinc Chemical compound [Zn].CC(=O)CC(C)=O.CC(=O)CC(C)=O PRCNQQRRDGMPKS-UHFFFAOYSA-N 0.000 description 1
- FTDXCHCAMNRNNY-UHFFFAOYSA-N phenol Chemical class OC1=CC=CC=C1.OC1=CC=CC=C1 FTDXCHCAMNRNNY-UHFFFAOYSA-N 0.000 description 1
- CUQCMXFWIMOWRP-UHFFFAOYSA-N phenyl biguanide Chemical compound NC(N)=NC(N)=NC1=CC=CC=C1 CUQCMXFWIMOWRP-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- LYKRPDCJKSXAHS-UHFFFAOYSA-N phenyl-(2,3,4,5-tetrahydroxyphenyl)methanone Chemical compound OC1=C(O)C(O)=CC(C(=O)C=2C=CC=CC=2)=C1O LYKRPDCJKSXAHS-UHFFFAOYSA-N 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 229910000018 strontium carbonate Inorganic materials 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- GHPYAGKTTCKKDF-UHFFFAOYSA-M tetraphenylphosphanium;thiocyanate Chemical compound [S-]C#N.C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 GHPYAGKTTCKKDF-UHFFFAOYSA-M 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical class SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
[1] (A)エポキシ樹脂、及び
(B)下記式(1)~(3)で表される基の少なくともいずれかを有する活性エステル化合物、を含有する樹脂組成物。
[2] (B)成分が、下記一般式(b-1)で表される活性エステル系化合物である、[1]に記載の樹脂組成物。
Ar11は、それぞれ独立に式(1)で表される基、式(2)で表される基、又は式(3)で表される基を表し、
Ar12は、それぞれ独立に、置換基を有していてもよい2価の芳香族炭化水素基を表し、
Ar13は、それぞれ独立に、置換基を有していてもよい2価の芳香族炭化水素基、置換基を有していてもよい2価の脂肪族炭化水素基、酸素原子、硫黄原子、又はこれらの組み合わせからなる2価の基を表す。aは1~6の整数を表し、bは0~10の整数を表す。)
[3] 一般式(b-1)中のAr13が、それぞれ独立に置換基を有していてもよい2価の芳香族炭化水素基及び酸素原子を組み合わせた2価の基を表す、[2]に記載の樹脂組成物。
[4] (B)成分が、下記一般式(b-3)で表される活性エステル系化合物である、[1]~[3]のいずれかに記載の樹脂組成物。
Ar31は、それぞれ独立に式(1)で表される基、式(2)で表される基、又は式(3)で表される基を表す。a2は1~6の整数を表し、c2は1~5の整数を表し、dはそれぞれ独立に0~6の整数を表す。)
[5] さらに、(C)無機充填材を含有する、[1]~[4]のいずれかに記載の樹脂組成物。
[6] 絶縁層形成用である、[1]~[5]のいずれかに記載の樹脂組成物。
[7] 導体層を形成するための絶縁層形成用である、[1]~[6]のいずれかに記載の樹脂組成物。
[8] 支持体と、該支持体上に設けられた、[1]~[7]のいずれかに記載の樹脂組成物を含む樹脂組成物層とを含む、樹脂シート。
[9] [1]~[7]のいずれかに記載の樹脂組成物の硬化物により形成された絶縁層を含む、プリント配線板。
[10] [9]に記載のプリント配線板を含む、半導体装置。
本発明の樹脂組成物は、(A)エポキシ樹脂、及び(B)下記式(1)~(3)で表される基の少なくともいずれかを有する活性エステル化合物、を含有する。(B)成分を樹脂組成物に含有させることで、樹脂組成物を含む樹脂組成物層をラミネートした場合に生じ得るラミネート後のムラの発生を抑制できる。また、本発明では、通常、めっきピール強度、銅箔密着性、及びHAST後の銅箔密着性にも優れ、さらに、誘電特性が低く、算術平均粗さ(Ra)が低い硬化物を得ることもできる。
樹脂組成物は、(A)成分として(A)エポキシ樹脂を含有する。(A)成分としては、例えば、ビキシレノール型エポキシ樹脂、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、ビスフェノールAF型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、トリスフェノール型エポキシ樹脂、ナフトールノボラック型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、tert-ブチル-カテコール型エポキシ樹脂、ナフタレン型エポキシ樹脂、ナフトール型エポキシ樹脂、アントラセン型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、グリシジルエステル型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、線状脂肪族エポキシ樹脂、ブタジエン構造を有するエポキシ樹脂、脂環式エポキシ樹脂、複素環式エポキシ樹脂、スピロ環含有エポキシ樹脂、シクロヘキサン型エポキシ樹脂、シクロヘキサンジメタノール型エポキシ樹脂、ナフチレンエーテル型エポキシ樹脂、トリメチロール型エポキシ樹脂、テトラフェニルエタン型エポキシ樹脂等が挙げられる。エポキシ樹脂は、1種類単独で用いてもよく、2種類以上を組み合わせて用いてもよい。
樹脂の重量平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)法により、ポリスチレン換算の値として測定できる。
なお、本発明において、樹脂組成物中の各成分の含有量は、別途明示のない限り、樹脂組成物中の不揮発成分を100質量%としたときの値である。
樹脂組成物は、(B)成分として、下記式(1)~(3)で表される基の少なくともいずれかを有する活性エステル化合物を含有する。(B)成分を樹脂組成物に含有させることで、ラミネート後のムラの発生を抑制することが可能となる。また、(B)成分を樹脂組成物に含有させることで、通常、めっきピール強度、銅箔密着性、及びHAST後の銅箔密着性にも優れ、さらに、誘電特性が低く、算術平均粗さ(Ra)が低い硬化物を得ることもできる。
(B)成分は、下記一般式(b-1)で表される化合物であることが好ましい。
樹脂組成物は、上述した成分以外に、任意の成分として、更に、(C)成分として無機充填材を含有していてもよい。(C)無機充填材を用いることにより、樹脂組成物の硬化物の誘電特性及び絶縁性能を向上させることができる。
樹脂組成物は、上述した成分以外に、任意の成分として、更に、(D)成分として硬化剤を含有していてもよい。但し、(B)成分に該当するものは除く。
一般式(D-9)中、M4、M6及びM7はそれぞれ独立に置換基を有していてもよい炭素原子数が5以上のアルキレン基を表し、M5はそれぞれ独立に置換基を有していてもよい芳香環を有する2価の基を表し、R41及びR42はそれぞれ独立に炭素原子数が5以上のアルキル基を表す。t2は0~10の整数を表し、u1及びu2はそれぞれ独立に0~4の整数を表す。
樹脂組成物は、上述した成分以外に、任意の成分として、更に、(E)成分として硬化促進剤を含有していてもよい。
樹脂組成物は、上述した成分以外に、任意の成分として、更にその他の添加剤を含んでいてもよい。このような添加剤としては、例えば、熱可塑性樹脂、難燃剤、増粘剤、消泡剤、レベリング剤、密着性付与剤等の樹脂添加剤などが挙げられる。これらの添加剤は、1種類単独で用いてもよく、2種類以上を組み合わせて用いてもよい。それぞれの含有量は当業者であれば適宜設定できる。
樹脂組成物は、(A)成分及び(B)成分を含む。これにより、樹脂組成物を含む樹脂組成物層をラミネートした場合に生じるムラの発生を抑制できる。また、本発明では、通常、めっきピール強度、銅箔密着性、及びHAST後の銅箔密着性にも優れ、さらに、誘電特性が低く、算術平均粗さ(Ra)が低い硬化物を得ることもできる。
(1)基材に仮固定フィルムを積層する工程、
(2)半導体チップを、仮固定フィルム上に仮固定する工程、
(3)半導体チップ上に封止層を形成する工程、
(4)基材及び仮固定フィルムを半導体チップから剥離する工程、
(5)半導体チップの基材及び仮固定フィルムを剥離した面に、絶縁層としての再配線形成層を形成する工程、及び
(6)再配線形成層上に、導体層としての再配線層を形成する工程
本発明の樹脂シートは、支持体と、該支持体上に設けられた、本発明の樹脂組成物で形成された樹脂組成物層を含む。
本発明のプリント配線板は、本発明の樹脂組成物の硬化物により形成された絶縁層を含む。
(I)内層基板上に、樹脂シートの樹脂組成物層が内層基板と接合するように積層する工程
(II)樹脂組成物層を熱硬化して絶縁層を形成する工程
本発明の半導体装置は、本発明のプリント配線板を含む。本発明の半導体装置は、本発明のプリント配線板を用いて製造することができる。
温度計、滴下ロート、冷却管、分留管、撹拌器を取り付けたフラスコに、2,7-ジヒドロキシナフタレン320g(2.0モル)、ベンジルアルコール184g(1.7モル)、パラトルエンスルホン酸・1水和物5.0gを仕込み、室温下、窒素を吹き込みながら撹拌した。その後、150℃に昇温し、生成する水を系外に留去しながら4時間攪拌した。反応終了後、メチルイソブチルケトン900g、20%水酸化ナトリウム水溶液5.4gを添加して中和した後、分液により水層を除去し、水280gで3回水洗を行い、メチルイソブチルケトンを減圧下除去してベンジル変性ナフタレン化合物(A-1)を460g得た。得られたベンジル変性ナフタレン化合物(A-1)は黒色固体であり、水酸基当量は180グラム/当量であった。
温度計、滴下ロート、冷却管、分留管、撹拌器を取り付けたフラスコに、イソフタル酸クロリド203.0g(酸クロリド基のモル数:2.0モル)とトルエン1400gを仕込み、系内を減圧窒素置換し溶解させた。次いで、オルトフェニルフェノール113.9g(0.67モル)、ベンジル変性ナフタレン化合物(A-1)240g(フェノール性水酸基のモル数:1.33モル)を仕込み、系内を減圧窒素置換し溶解させた。その後、テトラブチルアンモニウムブロマイド0.70gを溶解させ、窒素ガスパージを施しながら、系内を60℃以下に制御して、20%水酸化ナトリウム水溶液400gを3時間かけて滴下した。次いでこの条件下で1.0時間撹拌を続けた。反応終了後、静置分液し、水層を取り除いた。更に反応物が溶解しているトルエン層に水を投入して15分間撹拌混合し、静置分液して水層を取り除いた。水層のpHが7になるまでこの操作を繰り返した。その後、デカンタ脱水で水分を除去し不揮発分65質量%のトルエン溶液状態にある活性エステル化合物(B-2)を得た。得られた活性エステル化合物(B-2)の活性エステル当量は、206g/eq.であった。
温度計、滴下ロート、冷却管、分留管、撹拌器を取り付けたフラスコに、イソフタル酸クロリド203.0g(酸クロリド基のモル数:2.0モル)とトルエン1400gを仕込み、系内を減圧窒素置換し溶解させた。次いで、スチレン化フェノールフェノール132.7g(0.67モル)、ベンジル変性ナフタレン化合物(A-1)240g(フェノール性水酸基のモル数:1.33モル)を仕込み、系内を減圧窒素置換し溶解させた。その後、テトラブチルアンモニウムブロマイド0.70gを溶解させ、窒素ガスパージを施しながら、系内を60℃以下に制御して、20%水酸化ナトリウム水溶液400gを3時間かけて滴下した。次いでこの条件下で1.0時間撹拌を続けた。反応終了後、静置分液し、水層を取り除いた。更に反応物が溶解しているトルエン層に水を投入して15分間撹拌混合し、静置分液して水層を取り除いた。水層のpHが7になるまでこの操作を繰り返した。その後、デカンタ脱水で水分を除去し不揮発分65質量%のトルエン溶液状態にある活性エステル化合物(B-3)を得た。得られた活性エステル化合物(B-3)の活性エステル当量は、259g/eq.であった。
(A)成分としてのエポキシ樹脂「ESN475V」(日鉄ケミカル&マテリアル社製、エポキシ当量:約330g/eq.)3部と、(A)成分としてのエポキシ樹脂「HP-4032-SS」(DIC社製、エポキシ当量:約144g/eq.)7部を、メチルエチルケトン(MEK)10部に溶解させ、エポキシ樹脂溶液Aを得た。
当該エポキシ樹脂溶液Aへ、(B)成分として活性エステル化合物(B-1)25部、(C)成分としての、アミン系アルコキシシラン化合物(信越化学工業社製「KBM573」)で表面処理された球形シリカ(平均粒径0.77μm、アドマテックス社製「SO-C2」)(以下、「無機充填材A」ともいう)65部、(E)成分としてのイミダゾール化合物「1B2PZ」(四国化成社製)0.2部を加え、高速回転ミキサーで均一に分散して樹脂ワニスAを調製した。
無機充填材Aの平均粒径は0.5μmであり、比表面積が5.9m2/gであった。
実施例1において、活性エステル化合物(B-1)25部を、活性エステル化合物(B-2)25部に変えた。
以上の事項以外は実施例1と同様に樹脂組成物2を調製した。
実施例1において、活性エステル化合物(B-1)25部を、活性エステル化合物(B-3)25部に変えた。
以上の事項以外は実施例1と同様に樹脂組成物3を調製した。
実施例1において、
活性エステル化合物(B-1)の量を25部から22部に変え、
イミダゾール化合物(四国化成工業社製1B2PZ)の量を0.2部から0.02部に変え、
トリアジン含有クレゾールノボラック樹脂(DIC製「LA-3018-50P」、固形分50質量%のメトキシプロパノール溶液)2部、カルボジイミド系樹脂(日清紡ケミカル社製「V-03」、活性基当量約216、固形分50質量%のトルエン溶液)1部を用いた。
以上の事項以外は実施例1と同様に樹脂組成物4を調製した。
実施例2において、
活性エステル化合物(B-2)の量を25部から22部に変え、
イミダゾール化合物(四国化成工業社製1B2PZ)の量を0.2部から0.02部に変え、
トリアジン含有クレゾールノボラック樹脂(DIC製「LA-3018-50P」、固形分50質量%のメトキシプロパノール溶液)2部、カルボジイミド系樹脂(日清紡ケミカル社製「V-03」、活性基当量約216、固形分50質量%のトルエン溶液)1部を用いた。
以上の事項以外は実施例2と同様に樹脂組成物5を調製した。
実施例3において、
活性エステル化合物(B-3)の量を25部から22部に変え、
イミダゾール化合物(四国化成工業社製1B2PZ)の量を0.2部から0.02部に変え、
トリアジン含有クレゾールノボラック樹脂(DIC製「LA-3018-50P」、固形分50質量%のメトキシプロパノール溶液)2部、カルボジイミド系樹脂(日清紡ケミカル社製「V-03」、活性基当量約216、固形分50質量%のトルエン溶液)1部を用いた。
以上の事項以外は実施例3と同様に樹脂組成物6を調製した。
実施例1において、
活性エステル化合物(B-1)の量を25部から22部に変え、
イミダゾール化合物(四国化成工業社製1B2PZ)の量を0.2部から0.02部に変え、
トリアジン含有クレゾールノボラック樹脂(DIC製「LA-3018-50P」、固形分50質量%のメトキシプロパノール溶液)2部を用い、
ビニルベンジル樹脂(三菱瓦斯化学社製「OPE-2St」、固形分65質量%のトルエン溶液)2部を用いた。
以上の事項以外は実施例1と同様に樹脂組成物7を調製した。
実施例7において、
ビニルベンジル樹脂(三菱ガス化学社製「OPE-2St」、固形分65質量%のトルエン溶液)2部を、マレイミド樹脂(日本化薬社製「MIR-3000-70MT」、固形分70質量%のトルエン・MEK溶液)2部に変えた。
以上の事項以外は実施例7と同様に樹脂組成物8を調製した。
実施例7において、
ビニルベンジル樹脂(三菱ガス化学社製「OPE-2St」、固形分65質量%のトルエン溶液)2部を、マレイミド樹脂(DMI社製「BMI-689」)1部に変えた。
以上の事項以外は実施例7と同様に樹脂組成物9を調製した。
実施例7において、
ビニルベンジル樹脂(三菱ガス化学社製「OPE-2St」、固形分65質量%のトルエン溶液)2部を、マレイミド系樹脂(DMI社製「BMI-1500」)1部に変えた。
以上の事項以外は実施例7と同様に樹脂組成物10を調製した。
実施例1において、活性エステル化合物(B-1)25部を、その他の硬化剤(活性エステル系硬化剤、DIC社製、「HPC8150-62T」、固形分62%のトルエン溶液)25部に変えた。
以上の事項以外は実施例1と同様に樹脂組成物11を調製した。
実施例1において、活性エステル化合物(B-1)25部を、その他の硬化剤(活性エステル系硬化剤、DIC社製、「HPC8000-65T」、固形分65%のトルエン溶液)23部に変えた。
以上の事項以外は実施例1と同様に樹脂組成物12を調製した。
実施例4において、活性エステル化合物(B-1)22部を、その他の硬化剤(活性エステル系硬化剤、DIC社製、「HPC8150-62T」、固形分62%のトルエン溶液22部に変えた。
以上の事項以外は実施例4と同様に樹脂組成物13を調製した。
実施例3において、活性エステル化合物(B-2)22部を、その他の硬化剤(活性エステル系硬化剤、DIC社製、「HPC8000-65T」、固形分65%のトルエン溶液)21部に変えた。
以上の事項以外は実施例3と同様に樹脂組成物14を調製した。
(1)樹脂組成物層の厚さが40μmの樹脂シートAの作製
支持体として、離型層を備えたポリエチレンテレフタレートフィルム(リンテック社製「AL5」、厚さ38μm)を用意した。この支持体の離型層上に、実施例及び比較例で得られた樹脂組成物を、乾燥後の樹脂組成物層の厚さが40μmとなるように均一に塗布した。その後、樹脂組成物を80℃~100℃(平均90℃)で4分間乾燥させて、支持体及び樹脂組成物層を含む樹脂シートAを得た。
内層回路を形成したガラス布基材エポキシ樹脂両面銅張積層板(銅箔の厚さ18μm、基板の厚さ0.4mm、パナソニック社製「R1515A」)の両面をマイクロエッチング剤(メック社製「CZ8101」)にて1μmエッチングして銅表面の粗化処理を行った。
バッチ式真空加圧ラミネーター(ニッコー・マテリアルズ社製、2ステージビルドアップラミネーター「CVP700」)を用いて、樹脂組成物層が内層基板と接するように、内層基板の両面にラミネートした。ラミネートは、30秒間減圧して気圧を13hPa以下に調整した後、120℃、圧力0.74MPaにて30秒間圧着させることにより実施した。次いで、100℃、圧力0.5MPaにて60秒間熱プレスを行った。
その後、樹脂シートAがラミネートされた内層基板を、130℃のオーブンに投入して30分間加熱し、次いで170℃のオーブンに移し替えて30分間加熱して、樹脂組成物層を熱硬化させて、絶縁層を形成した。その後、支持体を剥離して、絶縁層、内層基板及び絶縁層をこの順に有する硬化基板Aを得た。
硬化基板Aの両面について、樹脂シートAがラミネートされた部分(積層板とは反対側の表面)の表面均一性の観察を目視にて行い、下記のように評価した。
〇:ムラが全く観察されず、完全に均一な表面である。
×:樹脂シートがラミネートされた部分に、不均一な部分が観察される。
硬化基板Aに、粗化処理としてのデスミア処理を行った。デスミア処理としては、下記の湿式デスミア処理を実施した。
硬化基板Aを、膨潤液(アトテックジャパン社製「スウェリング・ディップ・セキュリガントP」、ジエチレングリコールモノブチルエーテル及び水酸化ナトリウムの水溶液)に60℃で5分間浸漬し、次いで、酸化剤溶液(アトテックジャパン社製「コンセントレート・コンパクトCP」、過マンガン酸カリウム濃度約6%、水酸化ナトリウム濃度約4%の水溶液)に80℃で20分間浸漬した。次いで、中和液(アトテックジャパン社製「リダクションソリューション・セキュリガントP」、硫酸水溶液)に40℃で5分間浸漬した後、80℃で15分間乾燥した。
粗化処理後の絶縁層表面の算術平均粗さ(Ra)を、非接触型表面粗さ計(ブルカー社製WYKO NT3300)を用いて、VSIモード、50倍レンズにより測定範囲を121μm×92μmとして得られる数値により求めた。それぞれ10点の平均値を求めることにより測定した。
セミアディティブ法に従って、絶縁層の粗化面に導体層を形成した。すなわち、粗化処理後の基板を、PdCl2を含む無電解めっき液に40℃で5分間浸漬した後、無電解銅めっき液に25℃で20分間浸漬した。次いで、150℃にて30分間加熱してアニール処理を行った後に、エッチングレジストを形成し、エッチングによりパターン形成した。その後、硫酸銅電解めっきを行い、厚さ25μmの導体層を形成し、アニール処理を190℃にて60分間行った。得られた基板を「評価基板B」と称する。
絶縁層と導体層のピール強度の測定は、日本工業規格(JIS C6481)に準拠して行った。具体的には、評価基板Bの導体層に、幅10mm、長さ100mmの部分の切込みをいれ、この一端を剥がしてつかみ具で掴み、室温中にて、50mm/分の速度で垂直方向に35mmを引き剥がした時の荷重(kgf/cm)を測定し、剥離強度を求めた。測定には、引っ張り試験機(TSE社製「AC-50C-SL」)を使用した。
誘電特性の評価は、誘電正接(Df)の値を測定することにより行った。具体的には、以下のようにして、評価用硬化物Bを作製し、誘電正接(Df)を測定した。
(1)密着評価用基板の作製
内層基板として、表面に銅箔を有するガラス布基材エポキシ樹脂両面銅張積層板(銅箔の厚さ18μm、基板の厚さ0.8mm、パナソニック社製「R1515A」)を用意した。この内層基板の表面の銅箔を、すべてエッチングして除去した。その後、190℃にて30分乾燥を行った。
前記の評価基板Cを用いて、粗化銅箔と絶縁層との間のピール強度の測定を行った。このピール強度の測定は、JIS C6481に準拠して行った。具体的には、下記の操作によって、ピール強度の測定を行った。
Claims (11)
- (A)エポキシ樹脂、
(B)下記一般式(b-1)で表される活性エステル化合物、及び
(C)無機充填材
を含有する樹脂組成物であって、当該樹脂組成物を190℃90分で硬化した硬化物の空洞共振摂動法による測定周波数5.8GHz、測定温度23℃における誘電正接の値が0.002以下である、樹脂組成物。
Ar11は、それぞれ独立に式(1)で表される基、式(2)で表される基、又は式(3)で表される基を表し、
Ar12は、それぞれ独立に、置換基を有していてもよい2価の芳香族炭化水素基を表し、
Ar13は、それぞれ独立に、置換基を有していてもよい2価の芳香族炭化水素基、置換基を有していてもよい2価の脂肪族炭化水素基、酸素原子、硫黄原子、又はこれらの組み合わせからなる2価の基を表す。aは1~6の整数を表し、bは0~10の整数を表す。) - (A)エポキシ樹脂、
(B)下記一般式(b-1)で表される活性エステル化合物、及び
(C)無機充填材
を含有する樹脂組成物であって、当該樹脂組成物で形成された樹脂組成物層に、粗化処理を行った銅箔を、銅箔の粗化処理を施された面が樹脂組成物層に接合するように、温度100℃、圧力0.74MPaにて30秒間圧着して複層体とし、当該複層体を、100℃30分次いで170℃30分、さらに200℃90分加熱して樹脂組成物層を熱硬化した上で、さらにHAST試験(130℃、湿度85%RH、100時間)に付した後におけるJIS C6481に準拠して測定される樹脂組成物層の硬化物と銅箔との間のピール強度が0.3kgf/cm以上である樹脂組成物。
Ar11は、それぞれ独立に式(1)で表される基、式(2)で表される基、又は式(3)で表される基を表し、
Ar12は、それぞれ独立に、置換基を有していてもよい2価の芳香族炭化水素基を表し、
Ar13は、それぞれ独立に、置換基を有していてもよい2価の芳香族炭化水素基、置換基を有していてもよい2価の脂肪族炭化水素基、酸素原子、硫黄原子、又はこれらの組み合わせからなる2価の基を表す。aは1~6の整数を表し、bは0~10の整数を表す。) - 一般式(b-1)中のAr13が、それぞれ独立に置換基を有していてもよい2価の芳香族炭化水素基及び酸素原子を組み合わせた2価の基を表す、請求項1又は2に記載の樹脂組成物。
- 絶縁層形成用である、請求項1、2又は5に記載の樹脂組成物。
- 導体層を形成するための絶縁層形成用である、請求項1、2又は5に記載の樹脂組成物。
- 支持体と、該支持体上に設けられた、請求項1、2又は5に記載の樹脂組成物を含む樹脂組成物層とを含む、樹脂シート。
- 請求項1、2又は5に記載の樹脂組成物の硬化物により形成された絶縁層を含む、プリント配線板。
- 請求項9に記載のプリント配線板を含む、半導体装置。
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