TWI835831B - 配線電路基板集合體片材及其製造方法 - Google Patents

配線電路基板集合體片材及其製造方法 Download PDF

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Publication number
TWI835831B
TWI835831B TW108128033A TW108128033A TWI835831B TW I835831 B TWI835831 B TW I835831B TW 108128033 A TW108128033 A TW 108128033A TW 108128033 A TW108128033 A TW 108128033A TW I835831 B TWI835831 B TW I835831B
Authority
TW
Taiwan
Prior art keywords
circuit board
wiring
assembly sheet
area
dummy
Prior art date
Application number
TW108128033A
Other languages
English (en)
Chinese (zh)
Other versions
TW202010362A (zh
Inventor
谷内卓也
垣内良平
柴田直樹
大薮恭也
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202010362A publication Critical patent/TW202010362A/zh
Application granted granted Critical
Publication of TWI835831B publication Critical patent/TWI835831B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW108128033A 2018-08-10 2019-08-07 配線電路基板集合體片材及其製造方法 TWI835831B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018151348A JP7003012B2 (ja) 2018-08-10 2018-08-10 配線回路基板集合体シートおよびその製造方法
JP2018-151348 2018-08-10

Publications (2)

Publication Number Publication Date
TW202010362A TW202010362A (zh) 2020-03-01
TWI835831B true TWI835831B (zh) 2024-03-21

Family

ID=69413804

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108128033A TWI835831B (zh) 2018-08-10 2019-08-07 配線電路基板集合體片材及其製造方法

Country Status (5)

Country Link
US (1) US11503716B2 (enExample)
JP (1) JP7003012B2 (enExample)
CN (1) CN112544125B (enExample)
TW (1) TWI835831B (enExample)
WO (1) WO2020031615A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6970230B2 (ja) * 2020-03-24 2021-11-24 日東電工株式会社 配線回路基板集合体シート
JP6979486B1 (ja) * 2020-06-25 2021-12-15 日東電工株式会社 配線回路基板集合体シートおよびその製造方法
CN118648383A (zh) * 2022-02-24 2024-09-13 住友电气工业株式会社 传输基板的制造方法
WO2025022857A1 (ja) * 2023-07-26 2025-01-30 日本発條株式会社 剥離フィルム付き回路パターン集合体の製造方法、回路基板の製造方法、及び剥離フィルム付き回路パターン集合体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994894A (ja) * 1982-11-22 1984-05-31 日本電気株式会社 薄膜パタ−ンの形成方法
JP2004140587A (ja) * 2002-10-17 2004-05-13 Toyo Aluminium Kk アンテナ回路構成体およびそれを備えた機能カード
JP2012019027A (ja) * 2010-07-07 2012-01-26 Ngk Spark Plug Co Ltd 配線基板の中間製品及び配線基板の製造方法
JP2012038914A (ja) * 2010-08-06 2012-02-23 Nitto Denko Corp 配線回路基板集合体シートおよびその製造方法
TW201637524A (zh) * 2015-01-30 2016-10-16 Ibiden Co Ltd 印刷布線板及其製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000200957A (ja) * 1999-01-07 2000-07-18 Sharp Corp プリント基板の製造方法
JP2000208881A (ja) * 1999-01-12 2000-07-28 Nitto Denko Corp プリント配線板の導体パタ―ン形成方法およびプリント配線板
JP3172509B2 (ja) * 1999-07-02 2001-06-04 日本特殊陶業株式会社 配線基板集合体の製造方法
JP4572096B2 (ja) * 2004-08-02 2010-10-27 Ｎｅｃ液晶テクノロジー株式会社 積層金属膜パターン形成方法
JP2006120867A (ja) * 2004-10-21 2006-05-11 Nitto Denko Corp 配線回路基板の製造方法
JP4515276B2 (ja) * 2005-01-31 2010-07-28 日東電工株式会社 配線回路基板集合体
JP2007048963A (ja) 2005-08-10 2007-02-22 Sharp Corp プリント配線板の製造方法、プリント配線板用フォトマスク、およびフォトマスク作成プログラム
KR100797682B1 (ko) * 2007-02-07 2008-01-23 삼성전기주식회사 인쇄회로기판의 제조방법
KR20090054817A (ko) * 2007-11-27 2009-06-01 삼성전기주식회사 인쇄회로기판
JP2010192530A (ja) * 2009-02-16 2010-09-02 Hitachi Cable Ltd 半導体装置用テープキャリアの製造方法
KR101066642B1 (ko) * 2009-08-31 2011-09-22 삼성전기주식회사 인쇄회로기판 제조방법
JP2011135153A (ja) * 2009-12-22 2011-07-07 Toppan Printing Co Ltd アンテナシートおよびアンテナシートを備えた非接触ｉｃ媒体
KR101048717B1 (ko) * 2010-01-19 2011-07-14 삼성전기주식회사 인쇄회로기판 스트립 및 전자소자 내장형 인쇄회로기판 제조방법
JP5565182B2 (ja) * 2010-08-05 2014-08-06 大日本印刷株式会社 支持枠付サスペンション用基板およびその製造方法
KR20120036446A (ko) * 2010-10-08 2012-04-18 삼성전자주식회사 보드 온 칩 패키지용 인쇄회로기판, 이를 포함하는 보드 온 칩 패키지 및 이의 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994894A (ja) * 1982-11-22 1984-05-31 日本電気株式会社 薄膜パタ−ンの形成方法
JP2004140587A (ja) * 2002-10-17 2004-05-13 Toyo Aluminium Kk アンテナ回路構成体およびそれを備えた機能カード
JP2012019027A (ja) * 2010-07-07 2012-01-26 Ngk Spark Plug Co Ltd 配線基板の中間製品及び配線基板の製造方法
JP2012038914A (ja) * 2010-08-06 2012-02-23 Nitto Denko Corp 配線回路基板集合体シートおよびその製造方法
TW201637524A (zh) * 2015-01-30 2016-10-16 Ibiden Co Ltd 印刷布線板及其製造方法

Also Published As

Publication number Publication date
CN112544125B (zh) 2025-10-17
WO2020031615A1 (ja) 2020-02-13
CN112544125A (zh) 2021-03-23
US11503716B2 (en) 2022-11-15
JP7003012B2 (ja) 2022-02-04
JP2020027848A (ja) 2020-02-20
TW202010362A (zh) 2020-03-01
US20210185826A1 (en) 2021-06-17

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