CN101340772A - 软性电路板基板 - Google Patents
软性电路板基板 Download PDFInfo
- Publication number
- CN101340772A CN101340772A CN200710076393.4A CN200710076393A CN101340772A CN 101340772 A CN101340772 A CN 101340772A CN 200710076393 A CN200710076393 A CN 200710076393A CN 101340772 A CN101340772 A CN 101340772A
- Authority
- CN
- China
- Prior art keywords
- circuit
- support
- flexible substrate
- circuit board
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710076393.4A CN100574555C (zh) | 2007-07-04 | 2007-07-04 | 软性电路板基板 |
US11/960,659 US7989048B2 (en) | 2007-07-04 | 2007-12-19 | Flexible base for manufacturing flexible printed circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710076393.4A CN100574555C (zh) | 2007-07-04 | 2007-07-04 | 软性电路板基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101340772A true CN101340772A (zh) | 2009-01-07 |
CN100574555C CN100574555C (zh) | 2009-12-23 |
Family
ID=40214694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200710076393.4A Expired - Fee Related CN100574555C (zh) | 2007-07-04 | 2007-07-04 | 软性电路板基板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7989048B2 (zh) |
CN (1) | CN100574555C (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102300713A (zh) * | 2009-01-30 | 2011-12-28 | 惠普开发有限公司 | 柔性电路 |
TWI631882B (zh) * | 2015-12-24 | 2018-08-01 | 宏達國際電子股份有限公司 | 軟性電路板、承載座以及控制器 |
US10292268B2 (en) | 2015-12-24 | 2019-05-14 | Htc Corporation | Flexible printed circuit board, supporting holder and controller |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101148099B1 (ko) | 2010-10-01 | 2012-05-23 | 엘지이노텍 주식회사 | 탭 테이프 및 그 제조방법 |
CN207305037U (zh) * | 2017-08-23 | 2018-05-01 | 昆山国显光电有限公司 | 定位孔结构和柔性电路板 |
TWI706530B (zh) * | 2018-06-12 | 2020-10-01 | 南茂科技股份有限公司 | 可撓性線路基板及薄膜覆晶封裝結構 |
CN112654133B (zh) * | 2020-10-29 | 2022-04-12 | 东莞市东华鑫达精密电路有限公司 | 一种稳定的印刷线路板 |
TWI766532B (zh) * | 2021-01-06 | 2022-06-01 | 南茂科技股份有限公司 | 可撓性線路基板 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5237201A (en) * | 1989-07-21 | 1993-08-17 | Kabushiki Kaisha Toshiba | TAB type semiconductor device and method of manufacturing the same |
JP4117892B2 (ja) * | 2004-09-29 | 2008-07-16 | 三井金属鉱業株式会社 | 電子部品実装用フィルムキャリアテープ及びフレキシブル基板 |
-
2007
- 2007-07-04 CN CN200710076393.4A patent/CN100574555C/zh not_active Expired - Fee Related
- 2007-12-19 US US11/960,659 patent/US7989048B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102300713A (zh) * | 2009-01-30 | 2011-12-28 | 惠普开发有限公司 | 柔性电路 |
CN102300713B (zh) * | 2009-01-30 | 2014-05-07 | 惠普开发有限公司 | 柔性电路 |
TWI631882B (zh) * | 2015-12-24 | 2018-08-01 | 宏達國際電子股份有限公司 | 軟性電路板、承載座以及控制器 |
US10292268B2 (en) | 2015-12-24 | 2019-05-14 | Htc Corporation | Flexible printed circuit board, supporting holder and controller |
Also Published As
Publication number | Publication date |
---|---|
CN100574555C (zh) | 2009-12-23 |
US20090011186A1 (en) | 2009-01-08 |
US7989048B2 (en) | 2011-08-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518103 Guangdong city of Shenzhen province Baoan District Fuyong Zhen Tang Wei Cun Xinyuan Industrial Zone Co-patentee after: Zhending Technology Co., Ltd. Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Address before: 518103 Guangdong city of Shenzhen province Baoan District Fuyong Zhen Tang Wei Cun Xinyuan Industrial Zone Co-patentee before: Honsentech Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091223 Termination date: 20160704 |