TWI815509B - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
TWI815509B
TWI815509B TW111122808A TW111122808A TWI815509B TW I815509 B TWI815509 B TW I815509B TW 111122808 A TW111122808 A TW 111122808A TW 111122808 A TW111122808 A TW 111122808A TW I815509 B TWI815509 B TW I815509B
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Taiwan
Prior art keywords
resin composition
resin
mass
insulating layer
less
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TW111122808A
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English (en)
Chinese (zh)
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TW202237741A (zh
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阪內啓之
池平秀
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日商味之素股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C09D163/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5445—Silicon-containing compounds containing nitrogen containing at least one Si-N bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/18—Fireproof paints including high temperature resistant paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224—Magnesium hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Graft Or Block Polymers (AREA)
  • Laminated Bodies (AREA)
TW111122808A 2017-09-11 2018-08-21 樹脂組成物 TWI815509B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017174369A JP6852627B2 (ja) 2017-09-11 2017-09-11 樹脂組成物
JP2017-174369 2017-09-11

Publications (2)

Publication Number Publication Date
TW202237741A TW202237741A (zh) 2022-10-01
TWI815509B true TWI815509B (zh) 2023-09-11

Family

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TW111122808A TWI815509B (zh) 2017-09-11 2018-08-21 樹脂組成物
TW107129072A TWI772495B (zh) 2017-09-11 2018-08-21 樹脂組成物

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TW107129072A TWI772495B (zh) 2017-09-11 2018-08-21 樹脂組成物

Country Status (4)

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JP (3) JP6852627B2 (ja)
KR (1) KR102566064B1 (ja)
CN (1) CN109486363A (ja)
TW (2) TWI815509B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6852627B2 (ja) * 2017-09-11 2021-03-31 味の素株式会社 樹脂組成物
JP7283274B2 (ja) * 2019-07-02 2023-05-30 味の素株式会社 樹脂組成物
JP7267870B2 (ja) * 2019-08-09 2023-05-02 株式会社日立産機システム 樹脂組成物、電気機器および樹脂組成物の製造方法
WO2021029045A1 (ja) * 2019-08-14 2021-02-18 昭和電工マテリアルズ株式会社 接着剤セット、構造体及びその製造方法
JP7184002B2 (ja) * 2019-09-13 2022-12-06 味の素株式会社 樹脂組成物
JP7298466B2 (ja) * 2019-12-11 2023-06-27 味の素株式会社 樹脂組成物
JP7388235B2 (ja) * 2020-02-20 2023-11-29 味の素株式会社 樹脂組成物
JPWO2022185832A1 (ja) * 2021-03-02 2022-09-09

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007031551A (ja) * 2005-07-26 2007-02-08 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
CN103649219A (zh) * 2011-07-14 2014-03-19 三菱瓦斯化学株式会社 印刷电路板用树脂组合物
TW201512290A (zh) * 2013-06-12 2015-04-01 Ajinomoto Kk 樹脂組成物

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JP2511282B2 (ja) * 1987-10-15 1996-06-26 株式会社日立製作所 エポキシ樹脂組成物
JPH09241483A (ja) * 1996-03-13 1997-09-16 Toray Ind Inc エポキシ樹脂組成物
DE19810549A1 (de) * 1998-03-11 1999-09-16 Delo Industrieklebstoffe Gmbh Polymerisierbare fluorhaltige Zubereitung, ihre Verwendung und Verfahren zur Herstellung ausgehärteter Polymermassen aus dieser Zubereitung
JP2000302948A (ja) * 1999-04-19 2000-10-31 Toshiba Chem Corp 封止用樹脂組成物および半導体封止装置
JP4779270B2 (ja) * 2001-09-18 2011-09-28 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物の製造方法
JP4220794B2 (ja) * 2002-02-01 2009-02-04 積水化学工業株式会社 絶縁基板用材料、プリント基板、積層板、樹脂付き銅箔、銅張積層板、ポリイミドフィルム、ｔａｂ用フィルム及びプリプレグ
WO2006006592A1 (ja) * 2004-07-13 2006-01-19 Hitachi Chemical Co., Ltd. 封止用エポキシ樹脂成形材料及び電子部品装置
JP2006028274A (ja) 2004-07-14 2006-02-02 Tokai Rubber Ind Ltd エポキシ樹脂組成物およびこれを用いたプリプレグ
CN1803923A (zh) * 2004-10-15 2006-07-19 味之素株式会社 树脂组合物
JP2010222391A (ja) 2009-03-19 2010-10-07 Sekisui Chem Co Ltd エポキシ樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板及び多層積層板
CN102634167B (zh) * 2011-02-10 2014-05-07 台光电子材料股份有限公司 树脂组合物
JP2013023666A (ja) 2011-07-25 2013-02-04 Sekisui Chem Co Ltd エポキシ樹脂材料、硬化物及びプラズマ粗化処理硬化物
CN102504532B (zh) * 2011-10-18 2013-09-18 广东生益科技股份有限公司 无卤低介电树脂组合物及使用其制作的预浸料与覆铜箔层压板
JP2014028880A (ja) * 2012-07-31 2014-02-13 Ajinomoto Co Inc 樹脂組成物
JP6123243B2 (ja) * 2012-11-12 2017-05-10 味の素株式会社 絶縁樹脂材料
JP6409362B2 (ja) * 2014-06-25 2018-10-24 味の素株式会社 樹脂組成物
JP2016035969A (ja) * 2014-08-01 2016-03-17 味の素株式会社 回路基板及びその製造方法
KR20160150602A (ko) 2015-06-22 2016-12-30 아지노모토 가부시키가이샤 몰드 언드필용 수지 조성물
JP6710955B2 (ja) * 2015-12-16 2020-06-17 味の素株式会社 プリプレグ
JP6852627B2 (ja) 2017-09-11 2021-03-31 味の素株式会社 樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007031551A (ja) * 2005-07-26 2007-02-08 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
CN103649219A (zh) * 2011-07-14 2014-03-19 三菱瓦斯化学株式会社 印刷电路板用树脂组合物
TW201512290A (zh) * 2013-06-12 2015-04-01 Ajinomoto Kk 樹脂組成物

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Publication number Publication date
KR20190029460A (ko) 2019-03-20
TW202237741A (zh) 2022-10-01
JP2019048952A (ja) 2019-03-28
JP7439888B2 (ja) 2024-02-28
TWI772495B (zh) 2022-08-01
KR102566064B1 (ko) 2023-08-14
JP6852627B2 (ja) 2021-03-31
TW201930451A (zh) 2019-08-01
CN109486363A (zh) 2019-03-19
JP2021095577A (ja) 2021-06-24
JP2023024510A (ja) 2023-02-16

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