TWI808356B - 電子構件之移除方法以及其裝置 - Google Patents

電子構件之移除方法以及其裝置 Download PDF

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Publication number
TWI808356B
TWI808356B TW109140291A TW109140291A TWI808356B TW I808356 B TWI808356 B TW I808356B TW 109140291 A TW109140291 A TW 109140291A TW 109140291 A TW109140291 A TW 109140291A TW I808356 B TWI808356 B TW I808356B
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TW
Taiwan
Prior art keywords
nozzle
electronic component
heating
electronic components
circuit substrate
Prior art date
Application number
TW109140291A
Other languages
English (en)
Chinese (zh)
Other versions
TW202139806A (zh
Inventor
杉山和弘
佐藤彰
福田光樹
Original Assignee
日商萬達修查股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商萬達修查股份有限公司 filed Critical 日商萬達修查股份有限公司
Publication of TW202139806A publication Critical patent/TW202139806A/zh
Application granted granted Critical
Publication of TWI808356B publication Critical patent/TWI808356B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW109140291A 2019-12-04 2020-11-18 電子構件之移除方法以及其裝置 TWI808356B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2019/047349 WO2021111538A1 (ja) 2019-12-04 2019-12-04 電子部材の取外し方法及びその装置
WOPCT/JP2019/047349 2019-12-04

Publications (2)

Publication Number Publication Date
TW202139806A TW202139806A (zh) 2021-10-16
TWI808356B true TWI808356B (zh) 2023-07-11

Family

ID=76222601

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109140291A TWI808356B (zh) 2019-12-04 2020-11-18 電子構件之移除方法以及其裝置

Country Status (5)

Country Link
JP (1) JP7128994B2 (ko)
KR (1) KR102498034B1 (ko)
CN (1) CN114762466A (ko)
TW (1) TWI808356B (ko)
WO (1) WO2021111538A1 (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6448669A (en) * 1987-06-08 1989-02-23 Metcal Inc Self-adjusting type heater
JPH09330956A (ja) * 1996-06-13 1997-12-22 Nec Corp 半導体装置のリペア方法とリペア装置
JP2007510548A (ja) * 2003-11-07 2007-04-26 デラウェア キャピタル フォーメーション インコーポレイテッド 脱着可能なチップ付き温度自己制御式はんだごて
TW200850092A (en) * 2004-11-29 2008-12-16 Heetronix Platen for use with a thermal attach and detach system which holds components by vacuum suction

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5765771U (ko) * 1980-09-30 1982-04-20
JPS6120790Y2 (ko) * 1980-11-28 1986-06-21
JP3470953B2 (ja) 1999-08-02 2003-11-25 アオイ電子株式会社 プリント配線板に電子部品を着脱する方法
JP2001298268A (ja) * 2000-04-14 2001-10-26 Miyaden Co Ltd 高周波加熱式半田鏝
JP2004186491A (ja) 2002-12-04 2004-07-02 Murata Mfg Co Ltd 電子部品のリペア用吸着ノズルおよびリペア方法
JP2009164310A (ja) * 2007-12-28 2009-07-23 Sharp Corp 電子部品リペア装置および電子部品リペア方法
JP2009200170A (ja) * 2008-02-20 2009-09-03 Fanuc Ltd 端子用加熱装置
KR101751335B1 (ko) * 2015-04-30 2017-06-28 주식회사 다원시스 유도가열 디솔더링 장치
KR102480461B1 (ko) * 2017-11-30 2022-12-21 쌩-고벵 글래스 프랑스 차량용 창유리의 터미널 솔더링 장치 및 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6448669A (en) * 1987-06-08 1989-02-23 Metcal Inc Self-adjusting type heater
JPH09330956A (ja) * 1996-06-13 1997-12-22 Nec Corp 半導体装置のリペア方法とリペア装置
JP2007510548A (ja) * 2003-11-07 2007-04-26 デラウェア キャピタル フォーメーション インコーポレイテッド 脱着可能なチップ付き温度自己制御式はんだごて
TW200850092A (en) * 2004-11-29 2008-12-16 Heetronix Platen for use with a thermal attach and detach system which holds components by vacuum suction

Also Published As

Publication number Publication date
TW202139806A (zh) 2021-10-16
KR102498034B1 (ko) 2023-02-10
JP7128994B2 (ja) 2022-09-01
KR20220112748A (ko) 2022-08-11
CN114762466A (zh) 2022-07-15
JPWO2021111538A1 (ko) 2021-06-10
WO2021111538A1 (ja) 2021-06-10

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