JP4384724B2 - プローブカードの製造方法 - Google Patents
プローブカードの製造方法 Download PDFInfo
- Publication number
- JP4384724B2 JP4384724B2 JP2005278087A JP2005278087A JP4384724B2 JP 4384724 B2 JP4384724 B2 JP 4384724B2 JP 2005278087 A JP2005278087 A JP 2005278087A JP 2005278087 A JP2005278087 A JP 2005278087A JP 4384724 B2 JP4384724 B2 JP 4384724B2
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- JP
- Japan
- Prior art keywords
- contact
- bonding
- probe
- electrode pad
- contact probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
Description
10 コンタクトプローブ
11 コンタクト部
12 接合部
13 接合界面
20 コンタクト基板
21 配線パターン
22 電極パッド
23 接合界面
30 ブロック体
31 対向面
40 プローブカード製造装置
41 真空チャンバ
42 マニピュレータ
43 イオン照射装置
44 排気口
50 金属原子
51 結合手
Claims (1)
- 基板表面に形成された電極パッドに、検査対象物に接触させる複数のコンタクトプローブを接合してプローブカードを製造するプローブカードの製造方法において、
上記コンタクトプローブ及び上記電極パッドの各接合界面を、同一の金属材料により形成する界面形成ステップと、
上記コンタクトプローブとは異なる金属材料であって、薬品により溶解し得る金属材料で上記複数のコンタクトプローブの周囲が固められることにより、上記複数のコンタクトプローブの相対位置が変化しないように内部に上記複数のコンタクトプローブが固定され、上記複数のコンタクトプローブの接合界面が露出したブロック体を準備するステップと、
上記コンタクトプローブ及び上記電極パッドの各接合界面に付着している不純物を真空中で除去して、各接合界面を活性化させる界面活性化ステップと、
上記界面活性化ステップ後も真空状態に維持されたまま、上記コンタクトプローブ及び上記電極パッドの各接合界面を会合させることにより接合する界面接合ステップと、
上記接合界面の接合後に、上記コンタクトプローブの周囲の金属材料を薬品により溶解するステップとを備えたことを特徴とするプローブカードの製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005278087A JP4384724B2 (ja) | 2005-09-26 | 2005-09-26 | プローブカードの製造方法 |
KR1020087000474A KR20080058319A (ko) | 2005-09-26 | 2006-09-08 | 프로브 카드 및 그 제조 방법 |
PCT/JP2006/317891 WO2007034697A1 (ja) | 2005-09-26 | 2006-09-08 | プローブカード及びその製造方法 |
US11/992,485 US20090174422A1 (en) | 2005-09-26 | 2006-09-08 | Probe Card and Manufacturing Method Thereof |
CNA2006800316277A CN101258410A (zh) | 2005-09-26 | 2006-09-08 | 探针卡及其制造方法 |
TW095133667A TW200728733A (en) | 2005-09-26 | 2006-09-12 | Probe card and method for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005278087A JP4384724B2 (ja) | 2005-09-26 | 2005-09-26 | プローブカードの製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007145079A Division JP2007232740A (ja) | 2007-05-31 | 2007-05-31 | プローブカードの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007086013A JP2007086013A (ja) | 2007-04-05 |
JP4384724B2 true JP4384724B2 (ja) | 2009-12-16 |
Family
ID=37888748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005278087A Active JP4384724B2 (ja) | 2005-09-26 | 2005-09-26 | プローブカードの製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090174422A1 (ja) |
JP (1) | JP4384724B2 (ja) |
KR (1) | KR20080058319A (ja) |
CN (1) | CN101258410A (ja) |
TW (1) | TW200728733A (ja) |
WO (1) | WO2007034697A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101624946B1 (ko) | 2015-04-24 | 2016-05-27 | 김진호 | 탄성블록을 갖는 프로브장치 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8629836B2 (en) | 2004-04-30 | 2014-01-14 | Hillcrest Laboratories, Inc. | 3D pointing devices with orientation compensation and improved usability |
JP2010286252A (ja) * | 2009-06-09 | 2010-12-24 | Sumitomo Electric Ind Ltd | コンタクトプローブの製造方法およびコンタクトプローブ |
KR101136534B1 (ko) * | 2010-09-07 | 2012-04-17 | 한국기계연구원 | 프로브 카드 및 이의 제조 방법 |
CN102854344A (zh) * | 2012-07-31 | 2013-01-02 | 苏州柏德纳科技有限公司 | 一种探针卡插线治具 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2701709B2 (ja) * | 1993-02-16 | 1998-01-21 | 株式会社デンソー | 2つの材料の直接接合方法及び材料直接接合装置 |
JPH0935230A (ja) * | 1995-07-13 | 1997-02-07 | Hitachi Ltd | 磁気ディスク装置 |
US6578264B1 (en) * | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
JP4527267B2 (ja) * | 2000-11-13 | 2010-08-18 | 東京エレクトロン株式会社 | コンタクタの製造方法 |
JP2004102218A (ja) * | 2002-07-19 | 2004-04-02 | Kyocera Corp | 光アイソレータ用素子とその製造方法及びこれを用いた光アイソレータ |
JP3773201B2 (ja) * | 2003-04-17 | 2006-05-10 | 東レエンジニアリング株式会社 | 被接合物の受け渡し方法および装置 |
JP2004364041A (ja) * | 2003-06-05 | 2004-12-24 | Fujitsu Media Device Kk | 弾性表面波デバイス及びその製造方法 |
-
2005
- 2005-09-26 JP JP2005278087A patent/JP4384724B2/ja active Active
-
2006
- 2006-09-08 CN CNA2006800316277A patent/CN101258410A/zh active Pending
- 2006-09-08 US US11/992,485 patent/US20090174422A1/en not_active Abandoned
- 2006-09-08 WO PCT/JP2006/317891 patent/WO2007034697A1/ja active Application Filing
- 2006-09-08 KR KR1020087000474A patent/KR20080058319A/ko not_active Application Discontinuation
- 2006-09-12 TW TW095133667A patent/TW200728733A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101624946B1 (ko) | 2015-04-24 | 2016-05-27 | 김진호 | 탄성블록을 갖는 프로브장치 |
Also Published As
Publication number | Publication date |
---|---|
WO2007034697A1 (ja) | 2007-03-29 |
TW200728733A (en) | 2007-08-01 |
CN101258410A (zh) | 2008-09-03 |
US20090174422A1 (en) | 2009-07-09 |
KR20080058319A (ko) | 2008-06-25 |
JP2007086013A (ja) | 2007-04-05 |
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