TWI808356B - 電子構件之移除方法以及其裝置 - Google Patents
電子構件之移除方法以及其裝置 Download PDFInfo
- Publication number
- TWI808356B TWI808356B TW109140291A TW109140291A TWI808356B TW I808356 B TWI808356 B TW I808356B TW 109140291 A TW109140291 A TW 109140291A TW 109140291 A TW109140291 A TW 109140291A TW I808356 B TWI808356 B TW I808356B
- Authority
- TW
- Taiwan
- Prior art keywords
- nozzle
- electronic component
- heating
- electronic components
- circuit substrate
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
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- 238000001179 sorption measurement Methods 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 229910000679 solder Inorganic materials 0.000 claims abstract description 35
- 230000005674 electromagnetic induction Effects 0.000 claims description 26
- 238000005476 soldering Methods 0.000 claims description 18
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- 230000008018 melting Effects 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 3
- 239000000155 melt Substances 0.000 abstract description 4
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- 238000009713 electroplating Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- 230000003685 thermal hair damage Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/047349 WO2021111538A1 (ja) | 2019-12-04 | 2019-12-04 | 電子部材の取外し方法及びその装置 |
| WOPCT/JP2019/047349 | 2019-12-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202139806A TW202139806A (zh) | 2021-10-16 |
| TWI808356B true TWI808356B (zh) | 2023-07-11 |
Family
ID=76222601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109140291A TWI808356B (zh) | 2019-12-04 | 2020-11-18 | 電子構件之移除方法以及其裝置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7128994B2 (enrdf_load_stackoverflow) |
| KR (1) | KR102498034B1 (enrdf_load_stackoverflow) |
| CN (1) | CN114762466A (enrdf_load_stackoverflow) |
| TW (1) | TWI808356B (enrdf_load_stackoverflow) |
| WO (1) | WO2021111538A1 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114641147B (zh) * | 2022-02-25 | 2025-02-18 | 广东粤灿半导体设备有限公司 | 一种定点感应加热的电路板返修方法 |
| CN115116902B (zh) * | 2022-07-05 | 2025-07-22 | 深圳市锐博自动化设备有限公司 | 一种适用芯片独立共晶的吸嘴加热精准固晶头 |
| JP2024132729A (ja) | 2023-03-17 | 2024-10-01 | 株式会社弘輝テック | 噴流はんだ装置の予熱機構及び噴流はんだ装置 |
| KR102842306B1 (ko) | 2023-11-03 | 2025-08-05 | 주식회사 비에스테크닉스 | 유도가열을 이용한 전자기기의 디스플레이 리워크 장비 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6448669A (en) * | 1987-06-08 | 1989-02-23 | Metcal Inc | Self-adjusting type heater |
| JPH09330956A (ja) * | 1996-06-13 | 1997-12-22 | Nec Corp | 半導体装置のリペア方法とリペア装置 |
| JP2007510548A (ja) * | 2003-11-07 | 2007-04-26 | デラウェア キャピタル フォーメーション インコーポレイテッド | 脱着可能なチップ付き温度自己制御式はんだごて |
| TW200850092A (en) * | 2004-11-29 | 2008-12-16 | Heetronix | Platen for use with a thermal attach and detach system which holds components by vacuum suction |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5765771U (enrdf_load_stackoverflow) * | 1980-09-30 | 1982-04-20 | ||
| JPS6120790Y2 (enrdf_load_stackoverflow) * | 1980-11-28 | 1986-06-21 | ||
| JP3470953B2 (ja) | 1999-08-02 | 2003-11-25 | アオイ電子株式会社 | プリント配線板に電子部品を着脱する方法 |
| JP2001298268A (ja) * | 2000-04-14 | 2001-10-26 | Miyaden Co Ltd | 高周波加熱式半田鏝 |
| JP2004186491A (ja) | 2002-12-04 | 2004-07-02 | Murata Mfg Co Ltd | 電子部品のリペア用吸着ノズルおよびリペア方法 |
| JP2009164310A (ja) * | 2007-12-28 | 2009-07-23 | Sharp Corp | 電子部品リペア装置および電子部品リペア方法 |
| JP2009200170A (ja) * | 2008-02-20 | 2009-09-03 | Fanuc Ltd | 端子用加熱装置 |
| KR101751335B1 (ko) * | 2015-04-30 | 2017-06-28 | 주식회사 다원시스 | 유도가열 디솔더링 장치 |
| KR102480461B1 (ko) * | 2017-11-30 | 2022-12-21 | 쌩-고벵 글래스 프랑스 | 차량용 창유리의 터미널 솔더링 장치 및 방법 |
-
2019
- 2019-12-04 CN CN201980102763.8A patent/CN114762466A/zh active Pending
- 2019-12-04 KR KR1020227013988A patent/KR102498034B1/ko active Active
- 2019-12-04 WO PCT/JP2019/047349 patent/WO2021111538A1/ja active Application Filing
- 2019-12-04 JP JP2021562245A patent/JP7128994B2/ja active Active
-
2020
- 2020-11-18 TW TW109140291A patent/TWI808356B/zh not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6448669A (en) * | 1987-06-08 | 1989-02-23 | Metcal Inc | Self-adjusting type heater |
| JPH09330956A (ja) * | 1996-06-13 | 1997-12-22 | Nec Corp | 半導体装置のリペア方法とリペア装置 |
| JP2007510548A (ja) * | 2003-11-07 | 2007-04-26 | デラウェア キャピタル フォーメーション インコーポレイテッド | 脱着可能なチップ付き温度自己制御式はんだごて |
| TW200850092A (en) * | 2004-11-29 | 2008-12-16 | Heetronix | Platen for use with a thermal attach and detach system which holds components by vacuum suction |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102498034B1 (ko) | 2023-02-10 |
| JPWO2021111538A1 (enrdf_load_stackoverflow) | 2021-06-10 |
| CN114762466A (zh) | 2022-07-15 |
| KR20220112748A (ko) | 2022-08-11 |
| WO2021111538A1 (ja) | 2021-06-10 |
| JP7128994B2 (ja) | 2022-09-01 |
| TW202139806A (zh) | 2021-10-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |