WO2021111538A1 - 電子部材の取外し方法及びその装置 - Google Patents

電子部材の取外し方法及びその装置 Download PDF

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Publication number
WO2021111538A1
WO2021111538A1 PCT/JP2019/047349 JP2019047349W WO2021111538A1 WO 2021111538 A1 WO2021111538 A1 WO 2021111538A1 JP 2019047349 W JP2019047349 W JP 2019047349W WO 2021111538 A1 WO2021111538 A1 WO 2021111538A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
nozzle
heating element
heating
suction
Prior art date
Application number
PCT/JP2019/047349
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
杉山　和弘
佐藤　彰
光樹 福田
Original Assignee
株式会社ワンダーフューチャーコーポレーション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ワンダーフューチャーコーポレーション filed Critical 株式会社ワンダーフューチャーコーポレーション
Priority to JP2021562245A priority Critical patent/JP7128994B2/ja
Priority to PCT/JP2019/047349 priority patent/WO2021111538A1/ja
Priority to CN201980102763.8A priority patent/CN114762466A/zh
Priority to KR1020227013988A priority patent/KR102498034B1/ko
Priority to TW109140291A priority patent/TWI808356B/zh
Publication of WO2021111538A1 publication Critical patent/WO2021111538A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention relates to a technique for removing an electronic component mounted on a substrate by electromagnetic induction heating.
  • solder joining is performed by arranging the solder between the objects to be joined and then heating and melting the solder.
  • the removal technology by supplying hot air can be applied to a substrate made of heat-resistant resin such as polyamide-imide or polyimide, but it is difficult to apply it to a substrate made of non-heat-resistant material such as thermoplastic resin or paper or cloth.
  • heat-resistant resin such as polyamide-imide or polyimide
  • non-heat-resistant material such as thermoplastic resin or paper or cloth.
  • non-heat resistant thermoplastic resins include ABS resin, acrylic, polycarbonate, polyester, polybutylene, polyurethane, and PET (polyethylene terephthalate).
  • electromagnetic induction heating as a technology for spot heating.
  • the electronic components mounted on the substrate can also be removed by electromagnetic induction heating (for example, Patent Document 2).
  • FIG. 7 is a conceptual diagram relating to the basic principle of electromagnetic induction heating.
  • the electromagnetic induction heating device is composed of an induction coil, a power supply, and a control device.
  • induction heating When an alternating current is passed through the induction coil, magnetic field lines with varying strength are generated. When a substance that conducts electricity (specifically, it is a bonding object and is usually formed of metal) is placed near it, eddy currents flow in the metal under the influence of these changing magnetic field lines. Since metals usually have electrical resistance, when an electric current flows through the metal, Joule heat is generated and the metal self-heats. This phenomenon is called induction heating.
  • the calorific value Q due to electromagnetic induction is expressed by the following formula.
  • a predetermined Joule heat can be obtained within a uniform magnetic field, so that the bonding accuracy is high. Further, if it is in a uniform magnetic field, a plurality of bonds can be formed at one time.
  • the metal terminals on the circuit board side generate heat, the heat is transferred to the solder, and the solder melts. When removing, the solder is melted in the same way as when joining.
  • the method of removing the electronic components mounted on the circuit board by electromagnetic induction heating can cope with the miniaturization of the electronic components. It can also be applied to a substrate made of a non-heat resistant material.
  • the area of the metal terminal that is the target of heat generation will also become smaller.
  • the metal terminal area is It becomes even narrower.
  • the resistance R becomes large, and a sufficient amount of heat generation cannot be secured (the denominator of the above theoretical formula becomes large).
  • the calorific value Q can be secured by increasing the applied voltage V or increasing the applied time t.
  • solder there are several types of solder, and generally, high-temperature solder (for example, SnAgCu-based solder, melting point of about 220 ° C.) to low-temperature solder (for example, SnBi solder, melting point of about 140 ° C.) are used. .. Even if the target is solder bonding with low-temperature solder, the above-mentioned problems occur.
  • high-temperature solder for example, SnAgCu-based solder, melting point of about 220 ° C.
  • low-temperature solder for example, SnBi solder, melting point of about 140 ° C.
  • the size of the circuit side terminal corresponding to the micro LED is about 25 ⁇ m ⁇ 25 ⁇ m to 50 ⁇ m ⁇ 50 ⁇ m, and a method of removing only the defective micro LED has not been established.
  • the inventor of the present application is considering application to the removal of electronic components of this size in the future, and there is a high possibility that the above-mentioned defects will become apparent.
  • the present invention solves the above problems, and an object of the present invention is to provide a technique for removing an electronic member that can be used even when the metal terminal area is small.
  • the present invention that solves the above problems is a device that removes an electronic member mounted on a circuit board by solder bonding from the circuit board.
  • the device includes a suction nozzle having a hollow shape, includes a suction means for sucking the electronic member at the tip of the suction nozzle, and a heating element provided under the suction nozzle, and heats the heating element by electromagnetic induction heating.
  • a heating means and a conduction means for conducting the heat generated by the heating element to the tip of the suction nozzle are provided.
  • the heat generated by the heating means is transferred to the electronic parts and the solder via the conduction means, and the solder melts. During that time, the suction means maintains the suction state of the nozzle and the electronic component. Even if the metal terminal area is small and the amount of heat generated is insufficient, the heating element generates heat. As a result, the electronic member mounted on the circuit board by solder bonding can be removed from the circuit board.
  • the heating element is preferably larger than the terminal of the circuit board.
  • the terminal size of the circuit board is preferably 500 ⁇ 500 ⁇ m or less. It is more preferably 250 ⁇ m ⁇ 250 ⁇ m or less, and further preferably 100 ⁇ m ⁇ 100 ⁇ m or less.
  • the terminal size is 1 mm ⁇ 1 mm or less, problems such as insufficient calorific value in electromagnetic induction heating are occasionally seen, and when it is 500 ⁇ 500 ⁇ m or less, the problems become remarkable.
  • a ferrite core outer to the heating element is further provided.
  • the amount of heat generated by the heating element increases, and the amount of heat generated by the metal terminals also increases.
  • the synergistic effect ensures that the solder melts.
  • the present invention that solves the above problems is a method of removing an electronic member mounted on a circuit board by solder bonding from the circuit board.
  • the heating element is heated by the heating means, the heat generated by the heating element is conducted to the tip of the suction nozzle by the conduction means, the solder is melted, and the solder is melted at the tip of the suction nozzle by the suction means.
  • the electronic member is attracted and the electronic member mounted on the circuit board by solder bonding is removed from the circuit board.
  • the heating element generates heat even when the metal terminal area is small and the amount of heat generated is insufficient. As a result, the electronic member mounted on the circuit board by solder bonding can be removed from the circuit board.
  • the present invention that solves the above problems is a device that removes an electronic member mounted on a circuit board by solder bonding from the circuit board.
  • the device includes a suction nozzle having a hollow shape and formed of metal, and a suction means for sucking the electronic member at the tip of the suction nozzle, a heating means for heating the tip of the suction nozzle by electromagnetic induction heating, and the like. To be equipped.
  • the present invention that solves the above problems is a device that removes an electronic member mounted on a circuit board by solder bonding from the circuit board.
  • the device includes a suction nozzle having a hollow shape and formed of ferrite, and includes a suction means for sucking the electronic member at the tip of the suction nozzle and a heating element attached to the tip of the suction nozzle to generate heat. It is provided with a heating means for heating the body by electromagnetic induction heating.
  • the heating element generates heat even when the metal terminal area is small and the amount of heat generated is insufficient. As a result, the electronic member mounted on the circuit board by solder bonding can be removed from the circuit board.
  • the present invention that solves the above problems is a method of removing an electronic member mounted on a circuit board by solder bonding from the circuit board.
  • the tip of the suction nozzle is heated by the heating means to melt the solder, the electronic member is sucked by the tip of the suction nozzle by the suction means, and the electrons mounted on the circuit board by solder bonding. The member is removed from the circuit board.
  • the present invention that solves the above problems is a device that removes an electronic member mounted on a circuit board from the circuit board by means capable of melting by heat.
  • the device includes a suction nozzle having a hollow shape, includes a suction means for sucking the electronic member at the tip of the suction nozzle, and a heating element provided under the suction nozzle, and heats the heating element by electromagnetic induction heating.
  • a heating means and a conduction means for conducting the heat generated by the heating element to the tip of the suction nozzle are provided.
  • the present application can be applied not only to solder bonding but also to release bonding by means capable of hot melting.
  • the electronic member can be removed from the circuit board by releasing the AFC (conductive conductive film) bonding or the bonding with the conductive adhesive.
  • the electronic member can be removed from the circuit board even when the metal terminal area is small.
  • FIG. 1 is a perspective view of an outline of the device according to the first embodiment
  • FIG. 2 is a cross-sectional view.
  • the device includes a nozzle 50, a suction device 60, a heating device 70, and a control device 80 (see FIG. 3).
  • the main part (or all) of the nozzle 50 is made of a material having high heat resistance and high thermal conductivity.
  • a material having high heat resistance and high thermal conductivity For example, ceramics, ruby, sapphire, diamond and the like can be mentioned.
  • 2019, in ceramics there is a ceramic processing accuracy of a minimum pore diameter of 10 ⁇ m, and the present invention can be sufficiently realized.
  • the nozzle 50 has a hollow 51. Electronic components are attracted at one end of the hollow 51, and the other end of the hollow 51 is continuous with the suction device 60. As a result, the nozzle 50 can be sucked through the hollow 51. It is preferable that the tip of the nozzle 50 is tapered like a weight so as to correspond to a minute electronic component.
  • a heating element 71 is provided at the bottom of the nozzle 50 so as to wind around the nozzle 50.
  • the heating element 71 is generally made of a metal material. Metal materials include gold, silver, copper, aluminum, nickel and chromium. Examples of the method of arranging the heating element 71 below the nozzle 50 include those by vapor deposition and plating, and those in which the nozzle 50 is fitted to the tubular heating element 71.
  • a coil 72 is arranged on the outer circumference of the nozzle 50. Conversely, the nozzle 50 is arranged in the coil internal space.
  • the heating element 71, the coil 72, and the power supply (see FIG. 7) constitute a heating device (heating means) 70. When a current is supplied to the coil 72 from the power source, a magnetic field is generated, and the heating element 71 in the magnetic field range generates heat.
  • FIG. 3 is an operation explanatory view according to the first embodiment.
  • the heating element 71 is provided in the nozzle trunk portion
  • the heating element 71 is provided in the nozzle weight portion, which is slightly changed. It is preferable that the heating element 71 is provided on the nozzle weight so as to be closer to the solder, but if it is difficult to provide the heating element 71 on the nozzle weight, the heating element 71 may be provided on the nozzle trunk.
  • the operating principle is common.
  • a plurality of electronic components (for example, LEDs) 20 are mounted on the circuit board 10. Specifically, a wiring circuit 11 (not shown) and a circuit-side terminal 12 are formed on the circuit board 10.
  • the electronic component 20 has an electronic component side terminal 22.
  • the circuit side terminal 12 and the electronic component side terminal 22 are joined via solder 30.
  • the suction device 60 and the heating device 70 are interlocked by the control device 80.
  • the suction device 60 When the suction device 60 is activated, a negative pressure is generated in the nozzle hollow 51. When the nozzle 50 is brought close to the electronic component 20 in this state, the tip of the nozzle 50 adheres to the surface of the electronic component 20. Here, the suction device 60, the hollow nozzle 51, and the tip of the nozzle 50 form a suction means.
  • the heat generated by the heating device 70 is conducted from the heating element 71 to the electronic component 20 and the solder 30 via the nozzle 50 having excellent thermal conductivity.
  • the nozzle 50 itself constitutes the conduction means.
  • the solder 30 is melted, and the connection between the circuit side terminal 12 and the electronic component side terminal 21 is released.
  • the suction state between the electronic component 20 and the nozzle 50 is maintained, and when the nozzle 50 is moved away from the circuit board 10, the electronic member 20 can be removed from the circuit board 10. Further, when the suction device 60 is stopped, the suction state between the electronic component 20 and the nozzle 50 is released, and the electronic component 20 can be recovered.
  • the problem of the present application is that the area of the terminal 12 is small and it is not possible to secure a sufficient amount of heat generated by the terminal 12.
  • electromagnetic induction heating does not mean that the terminal 12 does not generate heat at all.
  • the heat generated at the terminal 12 is also conducted to the solder 30. Therefore, it is preferable that the terminal 12 is also made of metal.
  • the terminal 12 itself is not expected to generate heat at all, a conductive polymer, conductive carbon, or the like may be used. Further, the wiring is thinner than the size of the terminal 12, and does not contribute to electromagnetic induction heating, so it is not considered.
  • the wiring and the terminal 12 are made of a conductive material. Generally, it is a metal-based material containing gold, silver, copper, aluminum, nickel, chromium and the like.
  • the wiring and the terminal 12 are formed by a general conventional method (printing, etching, metal deposition, plating, silver salt, etc.).
  • the metal terminal area is 1 mm ⁇ 1 mm or less, preferably 500 ⁇ m ⁇ 500 ⁇ m or less, more preferably 250 ⁇ m ⁇ 250 ⁇ m or less, and further preferably 100 ⁇ m ⁇ 100 ⁇ m or less.
  • a plurality of electronic components 20 are mounted on the circuit board 10.
  • the electronic component spacing is equivalent to the electronic component size. In the above example, the interval is 1 mm.
  • the nozzle diameter is 3 mm or more ( ⁇ electronic component size + spacing between adjacent electronic components), there is a risk of affecting adjacent electronic components. Therefore, it is preferable that the nozzle diameter is less than 3 mm ( ⁇ electronic component size + spacing between both sides).
  • the nozzle diameter is preferably about 1 mm (corresponding to the size of the electronic component) or larger.
  • the diameter of the suction hole (hollow 51) is preferably about 100 to 200 ⁇ m.
  • the circumferential length of the heating element 71 is about 3 mm. If the axial length of the heating element 71 is 2.5 mm (about 10 times the metal terminal size), the area of the heating element is 120 times the metal terminal area, and a sufficient area can be secured. That is, the heating element 71 is sufficiently larger than the metal terminal 12.
  • a plurality of electronic components 20 are mounted on the circuit board 10.
  • the electronic component spacing is equivalent to the electronic component size. In the above example, the interval is 200 ⁇ m.
  • the nozzle diameter is 600 ⁇ m ( ⁇ electronic component size + spacing between adjacent electronic components) or more, there is a risk that the adjacent electronic components will be affected. Therefore, it is preferable that the nozzle diameter is less than 600 ⁇ m ( ⁇ electronic component size + spacing between both sides).
  • the nozzle diameter is preferably about 200 ⁇ m (corresponding to the size of the electronic component) or larger.
  • the diameter of the suction hole (hollow 51) is preferably about 20 to 40 ⁇ m. As of 2019, in ceramics, there is a ceramic processing accuracy of a minimum pore diameter of 10 ⁇ m, and the present invention can be sufficiently realized.
  • the circumferential length of the heating element 71 is about 0.9 mm. If the axial length of the heating element 71 is 1.2 mm (about 24 times the metal terminal size), the area of the heating element is 432 times the metal terminal area, and a sufficient area can be secured. That is, the heating element 71 is sufficiently larger than the metal terminal 12.
  • FIG. 4 is an operation explanatory view according to the second embodiment. At the same time, the outline configuration will be described.
  • the second embodiment is a modification of the first embodiment.
  • the ferrite core 73 is exteriorized around the nozzle 50 and the heating element 71.
  • the heating element 71, the coil 72, the ferrite core 73, and the power supply constitute a heating device (heating means) 70.
  • FIG. 5 is a cross-sectional view of an outline of the device according to the third embodiment.
  • the first and second embodiments in order to secure the hollow 51 of the micropores, ceramics or the like having high processing accuracy was used for the main portion of the nozzle.
  • the main part (or all) of the nozzle 55 is made of metal.
  • the third embodiment can be applied when the same level of metal processing accuracy as that of ceramics can be obtained, or when micropores as small as those of the first and second embodiments cannot be obtained.
  • the metal nozzle 55, the coil 72, and the power supply constitute a heating device (heating means) 70.
  • a current is supplied to the coil 72 from the power source, a magnetic field is generated, and the metal nozzle 55 in the magnetic field range generates heat.
  • the heat generated by the nozzle 55 is conducted to the electronic component 20 and the solder 30 via the tip of the nozzle 55. As a result, the solder 30 is melted.
  • FIG. 6 is a cross-sectional view of an outline of the device according to the fourth embodiment. It is a combination of the technical idea according to the second embodiment and the technical idea according to the third embodiment.
  • the main part of the nozzle 56 is composed of a ferrite core.
  • a metal heat generating attachment 74 is fitted to the tip of the nozzle 56.
  • the heat generation attachment 74 has an insertion portion and a contact portion.
  • the heat generation attachment 74 insertion portion is inserted into the hollow 51.
  • the heat generation attachment 74 contact portion can come into contact with an electronic component at the nozzle tip position.
  • the ferrite core nozzle 56, the coil 72, the heat generating attachment 74, and the power supply constitute a heating device (heating means) 70.
  • a current is supplied to the coil 72 from the power source, a magnetic field is generated, and the magnetic field is focused along the ferrite core 56.
  • the heat generation attachment 74 in the magnetic field range generates heat.
  • the heat generated by the heat generation attachment 74 is conducted to the electronic component 20 and the solder 30. As a result, the solder 30 is melted.
  • the present application can be applied to release bonding by means that can be melted by heat.
  • the electronic member can be removed from the circuit board by releasing the AFC (conductive conductive film) bonding or the bonding with the conductive adhesive.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
PCT/JP2019/047349 2019-12-04 2019-12-04 電子部材の取外し方法及びその装置 WO2021111538A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021562245A JP7128994B2 (ja) 2019-12-04 2019-12-04 電子部材の取外し方法及びその装置
PCT/JP2019/047349 WO2021111538A1 (ja) 2019-12-04 2019-12-04 電子部材の取外し方法及びその装置
CN201980102763.8A CN114762466A (zh) 2019-12-04 2019-12-04 电子部件的移除方法及其装置
KR1020227013988A KR102498034B1 (ko) 2019-12-04 2019-12-04 전자 부재의 제거 방법 및 그 장치
TW109140291A TWI808356B (zh) 2019-12-04 2020-11-18 電子構件之移除方法以及其裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/047349 WO2021111538A1 (ja) 2019-12-04 2019-12-04 電子部材の取外し方法及びその装置

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WO2021111538A1 true WO2021111538A1 (ja) 2021-06-10

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JP (1) JP7128994B2 (enrdf_load_stackoverflow)
KR (1) KR102498034B1 (enrdf_load_stackoverflow)
CN (1) CN114762466A (enrdf_load_stackoverflow)
TW (1) TWI808356B (enrdf_load_stackoverflow)
WO (1) WO2021111538A1 (enrdf_load_stackoverflow)

Cited By (2)

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CN114641147A (zh) * 2022-02-25 2022-06-17 广东粤灿半导体设备有限公司 一种定点感应加热的电路板返修方法
CN115116902A (zh) * 2022-07-05 2022-09-27 深圳市锐博自动化设备有限公司 一种适用芯片独立共晶的吸嘴加热精准固晶头

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JP2024132729A (ja) 2023-03-17 2024-10-01 株式会社弘輝テック 噴流はんだ装置の予熱機構及び噴流はんだ装置
KR102842306B1 (ko) 2023-11-03 2025-08-05 주식회사 비에스테크닉스 유도가열을 이용한 전자기기의 디스플레이 리워크 장비

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Publication number Priority date Publication date Assignee Title
CN114641147A (zh) * 2022-02-25 2022-06-17 广东粤灿半导体设备有限公司 一种定点感应加热的电路板返修方法
CN114641147B (zh) * 2022-02-25 2025-02-18 广东粤灿半导体设备有限公司 一种定点感应加热的电路板返修方法
CN115116902A (zh) * 2022-07-05 2022-09-27 深圳市锐博自动化设备有限公司 一种适用芯片独立共晶的吸嘴加热精准固晶头
CN115116902B (zh) * 2022-07-05 2025-07-22 深圳市锐博自动化设备有限公司 一种适用芯片独立共晶的吸嘴加热精准固晶头

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KR102498034B1 (ko) 2023-02-10
JPWO2021111538A1 (enrdf_load_stackoverflow) 2021-06-10
CN114762466A (zh) 2022-07-15
TWI808356B (zh) 2023-07-11
KR20220112748A (ko) 2022-08-11
JP7128994B2 (ja) 2022-09-01
TW202139806A (zh) 2021-10-16

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