CN100405532C - 半导体部件的钎焊方法及半导体部件的安装构造 - Google Patents

半导体部件的钎焊方法及半导体部件的安装构造 Download PDF

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CN100405532C
CN100405532C CNB2004100560616A CN200410056061A CN100405532C CN 100405532 C CN100405532 C CN 100405532C CN B2004100560616 A CNB2004100560616 A CN B2004100560616A CN 200410056061 A CN200410056061 A CN 200410056061A CN 100405532 C CN100405532 C CN 100405532C
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metal terminal
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terminal pad
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间野昭浩
上野幸宏
浦泽裕德
大石祐树
宫崎祯志
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Niigato Precision Co., Ltd.
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    • H—ELECTRICITY
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
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Abstract

本发明提供一种半导体部件的钎焊方法及半导体部件的安装构造，将在里面及侧面形成有金属端子(2)的半导体部件(1)按照仅该金属端子(2)的里面部与膏状钎焊料(3)接触的方式搭载，通过向金属端子(2)的侧面部照射激光，利用从金属端子(2)的侧面部向里面部的热传导，对金属端子(2)的里面部加热，从而将与该金属端子(2)的里面部接触的膏状钎焊料(3)熔融而进行钎焊。由此，在将耐热保证温度低而不能穿过回流炉的半导体部件高密度安装在电路基板上的情况下，即使在小到只能在半导体部件的里侧部分上印刷焊料的程度的连接盘上，也可以可靠地对半导体部件进行钎焊。

Description

半导体部件的钎焊方法及半导体部件的安装构造
技术领域
本发明涉及半导体部件的钎焊方法及半导体部件的安装构造，特别涉及将耐热保证温度低而不能通过回流炉的半导体部件钎焊在小的连接盘上的方法及利用该方法形成的半导体部件的安装构造。
背景技术
一般来说，当将半导体组件等部件钎焊在电路基板上时，如图3所示，在钎焊用的连接盘4上配置半导体部件1，同时，在该连接盘4上印刷膏状钎焊料3。此时，按照使半导体部件1的电极2和连接盘4电连接的方式来印刷膏状钎焊料3。此后，将像这样搭载了半导体部件1的电路基板穿过回流炉，使膏状钎焊料3熔融来进行钎焊(例如参照专利文献1)。
专利文献1：特开平10-41465号公报
此种回流工艺中，为了避免半导体部件1的热损坏，有必要使其表面温度在耐热保证温度以下。所以，回流工艺中，在将电路基板穿过回流炉之前，需要在半导体部件1上粘贴耐热薄膜或涂布树脂，另外，在穿过回流炉后，还需要剥离耐热薄膜等，因此有回流前后的附加作业较多的缺点。
而且，如果使回流炉的加热温度低至半导体部件1的耐热保证温度以下，则可以避免半导体部件1的热损坏。但是，为了使膏状钎焊料3可靠地熔融，需要使连接盘4的温度在钎焊料熔点温度以上。所以，为了消除膏状钎焊料的加热不足，提出有如下的方案，即，通过将与电路基板的内层图案或外层图案连接的通路孔(via hole)直接连接设置在连接盘上，从而可以使回流炉的热量穿过通路孔而会集在连接盘上(例如参照专利文献2)。
专利文献2：特开平10-229273号公报
而且，还存在有根据组件的构造，耐热保证温度低而根本不能穿过回流炉的组件。在此情况下有效的方法是利用局部加热方式的钎焊工艺。在其中，还存在有使用钎焊丝利用烙铁通过手工焊接来进行钎焊的手工钎焊工艺、通过将聚光的激光向膏状钎焊料照射来进行钎焊的激光工艺等(例如参照专利文献3、4)。
专利文献3：特开平5-69182号公报
专利文献4：特开2000-299239号公报
但是，手工钎焊工艺的情况下，不仅工时数非常多，而且还有因操作者的能力而在钎焊的可靠性上容易产生偏差的缺点。另一方面，对于激光工艺的情况，工时数比较少，基本上也不会因操作者的能力而在钎焊的可靠性上产生偏差。所以，利用激光工艺进行钎焊的情况不少。
但是，近年来，随着对电子机器的高功能化及小型轻量化的要求，半导体部件的高密度安装化不断提高，电路基板的空间变少而不得不缩小连接盘的情况逐渐增多。当连接盘变小时，就无法在要搭载的半导体部件的周围确保足够的连接盘空间，或者只能在半导体部件的大约里侧位置进行钎焊。
发明内容
鉴于所述情况，本发明的目的在于，在将耐热保证温度低而不能穿过回流炉的半导体部件高密度安装在电路基板上的情况下，即使在小到只能在半导体部件的里侧部分上印刷焊料的程度的连接盘上，也可以可靠地对半导体部件进行钎焊。
为了解决所述的问题，本发明中，将在里面及侧面形成有金属端子的半导体部件按照仅该金属端子的里面部与膏状钎焊料接触、并且上述膏状钎焊料的大致整个表面与上述金属端子的里面部接触的方式搭载在连接盘上，通过从上述金属端子的侧面部向上述金属端子的里面部传递的热传导使上述膏状钎焊料熔融，来进行连接盘和半导体部件的钎焊。
根据如上所述构成的本发明，利用从金属端子的侧面部向里面部的热传导，金属端子的里面部被加热，与该金属端子的里面部接触、并且上述膏状钎焊料的大致整个表面与上述金属端子的里面部接触的膏状钎焊料熔融而进行钎焊。这样，在将耐热保证温度低而不能穿过回流炉的半导体部件高密度安装在电路基板上的情况下，即使在小到只能在半导体部件的里侧部分上印刷焊料的程度的连接盘上，也可以可靠地对半导体部件进行钎焊。
附图说明
图1是表示本实施方式的半导体部件的钎焊方法的概要的流程图。
图2是表示本实施方式的半导体部件的安装构造的图。
图3是用于说明半导体部件的以往的钎焊方法的图。
图中：1-半导体部件，2-金属端子，3-膏状钎焊料，4-连接盘，5-电路基板，6-预热台，7-激光二极管。
具体实施方式
下面将参照附图对本发明的一个实施方式进行说明。图1是表示本实施方式的半导体部件的钎焊方法的概要的流程图。另外，图2是表示本实施方式的半导体部件的安装构造的图。
如图1及图2所示，首先，在电路基板5的连接盘4上印刷膏状钎焊料3(步骤S1)，将电路基板5放置在预热台6上。然后，在印刷了膏状钎焊料3的连接盘4上，搭载在里面及侧面形成有金属端子2的半导体部件1(步骤S2)。此时，按照连接盘4的大约全部的区域都与半导体部件1的安装面(里面)相面对，并且仅金属端子2的里面部与膏状钎焊料3接触的方式，将半导体部件1搭载在连接盘4上。
此后，使用例如激光二极管(LD)7，通过向金属端子2的侧面部照射激光，进行半导体部件1和连接盘4的钎焊(步骤S3)。即，当用激光照射金属端子2的侧面部时，由于热传导，金属端子2的里面部被加热，与该里面部接触的膏状钎焊料3熔融，而进行钎焊。
该步骤S3中，最好向半导体部件1的未形成金属端子2的面(例如上面)供给冷风。例如，在半导体部件1的耐热保证温度非常低的情况下，有可能因从金属端子2向组件传导的热而引起热损坏。所以，通过向组件供给冷风，就可以将组件一直维持在耐热保证温度以下，同时加热金属端子2来进行正常的钎焊。
另外，最好按照使被照射激光的金属端子2附近的加热温度和被供给冷风的面附近的组件温度的差在特定温度以内的方式来设定温度条件。这是因为，当施加极大的温度差时，组件(例如陶瓷组件)就有可能破裂。
如上详细说明所示，根据本实施方式，由于将在里面及侧面形成有金属端子2的半导体部件1按照仅金属端子2的里面部与膏状钎焊料3接触的方式搭载，通过向金属端子2的侧面部照射激光来进行半导体部件1的钎焊，因此在将耐热保证温度低而不能穿过回流炉的半导体部件1高密度安装在电路基板5上的情况下，即使在小到只能在半导体部件1的里侧部分上印刷膏状钎焊料3的程度的连接盘4上，也可以可靠地对半导体部件1进行钎焊。
而且，所述实施方式只不过是表示了在实施本发明中的具体化的一个例子而已，本发明的技术范围并不由此而被限定性地解释。即，本发明可以不脱离其精神或其主要的特征，而用各种形式来实施。
(工业上的利用可能性)
本发明对于在耐热保证温度低而不能穿过回流炉的半导体部件的小到只能将焊料印刷在里侧部分上的连接盘上钎焊该半导体部件的高密度安装技术十分有用。

Claims (4)

1.一种半导体部件的钎焊方法，其特征是，具有：
在电路基板的连接盘上印刷膏状钎焊料的工序，
将在里面及侧面上形成有金属端子的半导体部件按照仅该金属端子的里面部与膏状钎焊料接触、并且上述膏状钎焊料的大致整个表面与上述金属端子的里面部接触的方式搭载在所述膏状钎焊料上的工序，以及
通过向所述金属端子的侧面部照射激光，通过从上述金属端子的侧面部向上述金属端子的里面部传递的热传导使上述膏状钎焊料熔融，从而进行所述连接盘和所述半导体部件的钎焊接合的工序。
2.根据权利要求1所述的半导体部件的钎焊方法，其特征是，在进行所述钎焊接合的工序中，向所述半导体部件的未形成所述金属端子的面供给冷风。
3.根据权利要求2所述的半导体部件的钎焊方法，其特征是，按照使被照射所述激光的金属端子附近的温度和被供给所述冷风的面附近的温度的差在规定温度以内的方式来设定温度条件。
4.一种半导体部件的安装构造，其特征是，在电路基板的连接盘上，借助印刷在该连接盘上的膏状钎焊料，将在里面及侧面上具有金属端子的半导体部件按照使所述连接盘的大约全部区域都与所述半导体部件的安装面相面对、并且上述膏状钎焊料的大致整个表面与上述金属端子的里面部接触的方式搭载，通过向所述金属端子的侧面部照射激光来将所述连接盘和所述半导体部件钎焊接合而形成。
CNB2004100560616A 2003-08-11 2004-08-10 半导体部件的钎焊方法及半导体部件的安装构造 Expired - Fee Related CN100405532C (zh)

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US7199329B2 (en) 2007-04-03

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