TWI808351B - 刀片更換裝置、切斷裝置及切斷物的製造方法 - Google Patents

刀片更換裝置、切斷裝置及切斷物的製造方法 Download PDF

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Publication number
TWI808351B
TWI808351B TW109134361A TW109134361A TWI808351B TW I808351 B TWI808351 B TW I808351B TW 109134361 A TW109134361 A TW 109134361A TW 109134361 A TW109134361 A TW 109134361A TW I808351 B TWI808351 B TW I808351B
Authority
TW
Taiwan
Prior art keywords
blade
cutting
adsorption
suction
replacement
Prior art date
Application number
TW109134361A
Other languages
English (en)
Chinese (zh)
Other versions
TW202116483A (zh
Inventor
宇澤秀俊
Original Assignee
日商Ｔｏｗａ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｔｏｗａ股份有限公司 filed Critical 日商Ｔｏｗａ股份有限公司
Publication of TW202116483A publication Critical patent/TW202116483A/zh
Application granted granted Critical
Publication of TWI808351B publication Critical patent/TWI808351B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614—Means for mounting the cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D19/00—Shearing machines or shearing devices cutting by rotary discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D33/00—Accessories for shearing machines or shearing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/08—Protective coverings for parts of machine tools; Splash guards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/155—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling
    • B23Q3/1552—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling parts of devices for automatically inserting or removing tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/155—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling
    • B23Q3/1552—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling parts of devices for automatically inserting or removing tools
    • B23Q3/15526—Storage devices; Drive mechanisms therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/22—Safety devices specially adapted for cutting machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Details Of Cutting Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Automatic Tool Replacement In Machine Tools (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
TW109134361A 2019-10-24 2020-10-05 刀片更換裝置、切斷裝置及切斷物的製造方法 TWI808351B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2019-193762 2019-10-24
JP2019193762A JP7248557B2 (ja) 2019-10-24 2019-10-24 ブレード交換装置、切断装置、及び、切断品の製造方法

Publications (2)

Publication Number Publication Date
TW202116483A TW202116483A (zh) 2021-05-01
TWI808351B true TWI808351B (zh) 2023-07-11

Family

ID=75542964

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109134361A TWI808351B (zh) 2019-10-24 2020-10-05 刀片更換裝置、切斷裝置及切斷物的製造方法

Country Status (4)

Country Link
JP (1) JP7248557B2 (ja)
KR (1) KR102491628B1 (ja)
CN (1) CN112705774B (ja)
TW (1) TWI808351B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023171989A (ja) 2022-05-23 2023-12-06 Ｔｏｗａ株式会社 ブレード交換装置、切断装置及び切断品の製造方法
JP7342291B1 (ja) * 2023-01-25 2023-09-11 大陽日酸株式会社 シリンダキャビネット

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007105861A (ja) * 2005-10-17 2007-04-26 Disco Abrasive Syst Ltd 切削ブレードの交換装置
TWM435328U (en) * 2012-02-17 2012-08-11 She Hong Ind Co Ltd Tool rest for central machine center
JP2014210304A (ja) * 2013-04-18 2014-11-13 株式会社ディスコ 切削装置
JP2017077611A (ja) * 2015-10-21 2017-04-27 株式会社ディスコ 切削装置
JP2017202546A (ja) * 2016-05-11 2017-11-16 株式会社ディスコ 切削装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10359029A1 (de) * 2003-12-12 2005-07-21 Gebr. Heller Maschinenfabrik Gmbh Verfahren und Vorrichtung zum Entfernen von Kühlmittel aus wenigstens einer Kühlmittelbohrung eines Werkzeuges
JP4837973B2 (ja) 2005-10-13 2011-12-14 株式会社ディスコ 切削ブレードの交換装置
CN102601656B (zh) * 2011-01-21 2015-12-16 亚力士电脑机械股份有限公司 加工机的排气式防尘刀库装置
JP5734387B2 (ja) 2013-10-18 2015-06-17 ファナック株式会社 カバーを持つ工具交換装置
JP6376440B2 (ja) 2014-05-20 2018-08-22 エンシュウ株式会社 工作機械
CN204771826U (zh) * 2015-06-05 2015-11-18 厦门大金机械有限公司 一种高速刀库门结构
JP6700800B2 (ja) * 2016-01-15 2020-05-27 株式会社ディスコ ブレードカバー
JP6690294B2 (ja) 2016-02-24 2020-04-28 曙機械工業株式会社 裁断機、刃型交換方法、裁断機の刃型収納部および刃型移送方法
CN105666221B (zh) * 2016-03-11 2018-08-24 深圳春兴数控设备有限责任公司 密封防水气防屑圆盘刀库
JP6560714B2 (ja) * 2017-06-26 2019-08-14 Ｔｏｗａ株式会社 ブレード交換機構、切断装置およびブレード交換方法
JP7114166B2 (ja) * 2018-01-16 2022-08-08 株式会社ディスコ 切削ブレードの管理方法及び切削装置
CN209503613U (zh) * 2018-12-27 2019-10-18 北京精雕科技集团有限公司 一种斗笠式圆盘刀库的防护装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007105861A (ja) * 2005-10-17 2007-04-26 Disco Abrasive Syst Ltd 切削ブレードの交換装置
TWM435328U (en) * 2012-02-17 2012-08-11 She Hong Ind Co Ltd Tool rest for central machine center
JP2014210304A (ja) * 2013-04-18 2014-11-13 株式会社ディスコ 切削装置
JP2017077611A (ja) * 2015-10-21 2017-04-27 株式会社ディスコ 切削装置
JP2017202546A (ja) * 2016-05-11 2017-11-16 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
CN112705774B (zh) 2024-06-21
TW202116483A (zh) 2021-05-01
KR102491628B1 (ko) 2023-01-20
CN112705774A (zh) 2021-04-27
KR20210049013A (ko) 2021-05-04
JP2021065981A (ja) 2021-04-30
JP7248557B2 (ja) 2023-03-29

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