TWI806072B - 用於基板處理監視的設定資訊之設定方法、基板處理裝置之監視方法及基板處理裝置 - Google Patents

用於基板處理監視的設定資訊之設定方法、基板處理裝置之監視方法及基板處理裝置 Download PDF

Info

Publication number
TWI806072B
TWI806072B TW110121616A TW110121616A TWI806072B TW I806072 B TWI806072 B TW I806072B TW 110121616 A TW110121616 A TW 110121616A TW 110121616 A TW110121616 A TW 110121616A TW I806072 B TWI806072 B TW I806072B
Authority
TW
Taiwan
Prior art keywords
image data
nozzle
setting
mentioned
monitoring
Prior art date
Application number
TW110121616A
Other languages
English (en)
Chinese (zh)
Other versions
TW202205492A (zh
Inventor
沖田有史
猶原英司
角間央章
増井達哉
出羽裕一
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202205492A publication Critical patent/TW202205492A/zh
Application granted granted Critical
Publication of TWI806072B publication Critical patent/TWI806072B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/12—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW110121616A 2020-06-30 2021-06-15 用於基板處理監視的設定資訊之設定方法、基板處理裝置之監視方法及基板處理裝置 TWI806072B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020112878A JP7441131B2 (ja) 2020-06-30 2020-06-30 基板処理監視に用いる設定情報の設定方法、基板処理装置の監視方法および基板処理装置
JP2020-112878 2020-06-30

Publications (2)

Publication Number Publication Date
TW202205492A TW202205492A (zh) 2022-02-01
TWI806072B true TWI806072B (zh) 2023-06-21

Family

ID=79315983

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110121616A TWI806072B (zh) 2020-06-30 2021-06-15 用於基板處理監視的設定資訊之設定方法、基板處理裝置之監視方法及基板處理裝置

Country Status (5)

Country Link
JP (1) JP7441131B2 (ja)
KR (1) KR20230012578A (ja)
CN (1) CN115769344A (ja)
TW (1) TWI806072B (ja)
WO (1) WO2022004276A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023127237A (ja) * 2022-03-01 2023-09-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理システム並びに基板処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11168078A (ja) * 1997-12-04 1999-06-22 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2018028496A (ja) * 2016-08-19 2018-02-22 株式会社Ｓｃｒｅｅｎホールディングス 変位検出装置、変位検出方法および基板処理装置
JP2020031103A (ja) * 2018-08-21 2020-02-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置および基板処理システム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5045218B2 (ja) 2006-10-25 2012-10-10 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11168078A (ja) * 1997-12-04 1999-06-22 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2018028496A (ja) * 2016-08-19 2018-02-22 株式会社Ｓｃｒｅｅｎホールディングス 変位検出装置、変位検出方法および基板処理装置
JP2020031103A (ja) * 2018-08-21 2020-02-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置および基板処理システム

Also Published As

Publication number Publication date
WO2022004276A1 (ja) 2022-01-06
KR20230012578A (ko) 2023-01-26
TW202205492A (zh) 2022-02-01
JP2022011620A (ja) 2022-01-17
JP7441131B2 (ja) 2024-02-29
CN115769344A (zh) 2023-03-07

Similar Documents

Publication Publication Date Title
JP6423672B2 (ja) 基板処理装置および基板処理方法
JP6278759B2 (ja) 基板処理装置および基板処理方法
JP6251086B2 (ja) 基板処理装置および基板処理方法
CN112639391B (zh) 可动部位置检测方法、基板处理方法、基板处理装置以及基板处理系统
TW202201524A (zh) 基板處理方法及基板處理裝置
TWI806072B (zh) 用於基板處理監視的設定資訊之設定方法、基板處理裝置之監視方法及基板處理裝置
TWI828986B (zh) 基板處理方法及基板處理裝置
JP6397557B2 (ja) 基板処理装置および基板処理方法
TWI744972B (zh) 基板處理裝置以及基板處理方法
JP7248848B2 (ja) 可動部位置検出方法、基板処理方法、基板処理装置および基板処理システム
WO2023100690A1 (ja) 基板処理装置およびガード判定方法
WO2024210135A1 (ja) 基板搬送装置の監視方法、および、基板処理装置
TW202347441A (zh) 狀態檢測方法及狀態檢測裝置