TWI806072B - Setting method of setting information used for monitoring substrate processing, monitoring method of substrate processing apparatus, and substrate processing apparatus - Google Patents

Abstract

The object of the present invention is to provide a technology capable of automatically setting an appropriate position of a monitoring object used for monitoring processing. The setting method of the setting information used for substrate processing monitoring in the present invention includes: a setup recipe (setup recipe) step S12, which controls the movement mechanism that moves the first monitoring object in the substrate processing apparatus, so that the first monitoring object Move to the first stop position; set the shooting step, which is executed in parallel with the setting recipe step S12, and the first monitoring object is photographed by the camera; And including the first image data of the first monitoring object stopped at the first stop position, and the first reference image data representing at least a part of the first monitoring object, to detect the first image data in the first image data The position of the object is monitored, and this position is set as an appropriate position relative to the above-mentioned first stop position.

Description

Setting method of setting information for substrate processing monitoring, monitoring method of substrate processing apparatus, and substrate processing apparatus

The present invention relates to a setting method of setting information for substrate processing monitoring, a monitoring method of a substrate processing device, and a substrate processing device.

Conventionally, various processing liquids such as pure water, photoresist liquid, and etching liquid are supplied to the substrate in the process of manufacturing semiconductor devices, and various substrate treatments such as cleaning processing and resist coating processing are performed. As an apparatus for performing such substrate processing, a substrate processing apparatus that discharges a processing liquid from a nozzle to the surface of the substrate while rotating the substrate in a horizontal posture is widely used.

The nozzle is connected to a processing liquid supply source through a pipe, and a valve is provided in the pipe. By opening the valve, the treatment liquid is discharged from the nozzle, and by closing the valve, the discharge of the treatment liquid from the nozzle is stopped.

In addition, the substrate processing apparatus is provided with a nozzle moving mechanism for moving the nozzle. The nozzle moving mechanism moves the nozzle between a processing position above the substrate and a standby position outside the substrate.

By opening the valve with the nozzle stopped at the processing position, the processing liquid is supplied from the nozzle to the main surface of the substrate. Thereby, the substrate is processed. After a predetermined discharge time elapses from the start of discharging the treatment liquid, the valve is closed to stop the supply of the treatment liquid.

In such a substrate processing apparatus, it may be monitored whether or not the processing liquid has been discharged from the nozzle. That is, there are cases where the discharge state of the processing liquid from the nozzle is monitored. For example, in Patent Document 1, it is proposed to install imaging means such as a camera to directly monitor the discharge of the processing liquid from the nozzle. [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2008-135679

(Problem to be solved by the invention)

As the monitoring object of the substrate processing, in addition to the discharge state of the processing liquid being discharged from the nozzle, the position of the nozzle may also be used. That is, there are cases where the substrate processing apparatus judges whether or not the position of the nozzle is appropriate based on the image data acquired by the imaging means.

Specifically, the substrate processing device detects the coordinate position of the nozzle in the image data by processing the image data including the nozzle stopped at the processing position, and according to the coordinate position of the nozzle and the preset Appropriate position (set coordinate position) to judge whether the coordinate position of the nozzle is appropriate.

The set coordinate position is the coordinate position of the nozzle in the image data captured when the nozzle stops at a proper position. The set coordinate position is manually set by an operator during, for example, installation of a substrate processing apparatus. Specifically, firstly, image data is obtained by means of photographing in a state where the nozzle moving mechanism moves the nozzle to the processing position. The substrate processing device displays the image data on the display of the user interface. Secondly, the operator visually recognizes the image data displayed on the display, and inputs the coordinate position of the region including the nozzle in the image data to the user interface. The coordinate position of the substrate processing device will be input into the user interface, and set as the set coordinate position of the nozzle. Thereby, the proper position of the nozzle in the image data can be set.

However, such manual setting not only leads to an increase in working time, but also causes unevenness in setting due to differences in the proficiency of workers.

Therefore, this invention was made in view of the said subject, and it aims at providing the technique which can automatically set the appropriate position of the monitoring object which can be used for a monitoring process. (technical means to solve the problem)

The first aspect of the setting method of setting information for substrate processing monitoring includes: a setup recipe step of controlling a moving mechanism that moves a first monitoring object in a substrate processing apparatus so that the first monitoring object The object moves to the first stop position; the setting shooting step is executed in parallel with the above-mentioned setting recipe step, and the camera shoots the above-mentioned first monitoring object; and the setting step is based on the above-mentioned setting shooting step. The camera obtains and includes the first image data of the first monitoring object stopped at the first stop position, and the first reference image data representing at least a part of the first monitoring object, to detect the first 1 position of the above-mentioned first monitoring object in the image data, and set this position as an appropriate position related to the above-mentioned first stop position.

The second aspect of the setting method of setting information for substrate processing monitoring is the setting method of setting information for substrate processing monitoring of the first aspect, wherein, in the above setting step, according to the control of the above moving mechanism A signal to identify the first image data of the first monitoring object stopped at the first stop position among the plurality of image data sequentially acquired by the camera in the step of setting and shooting.

The third aspect of the setting method of setting information for substrate processing monitoring is the setting method of setting information for substrate processing monitoring of the first or second aspect, wherein, in the above-mentioned step of setting the recipe, the above-mentioned The nozzle for supplying the processing liquid to the main surface of the substrate held in the substrate processing apparatus is moved to the first stop position as the first monitoring object.

The fourth aspect of the setting method of setting information for substrate processing monitoring is the setting method of setting information for substrate processing monitoring of the third aspect, wherein in the step of setting the recipe, the nozzles are moved sequentially To the above-mentioned first stop position and a second stop position different from the above-mentioned first stop position at least in the depth direction when viewed from the above-mentioned camera, and the above-mentioned setting step includes: a detection step, which is based on the above-mentioned setting in the shooting step. The camera obtains and includes the second image data of the nozzle stopped at the second stop position, and the first reference image data, to detect the position and size of the nozzle in the second image data; and determine The area setting step is based on the first relative relationship predetermined in advance with respect to the position and size of the nozzle in the first image data, and the size of the nozzle in the second image data with respect to the discharge determination area. The magnification of the size of the nozzle in the first image data is used to set the second relative relationship that defines the discharge determination area with respect to the position and size of the nozzle in the second image data.

The fifth aspect of the setting method of setting information for substrate processing monitoring is the setting method of setting information for substrate processing monitoring of the first or second aspect, wherein, in the above-mentioned step of setting the recipe, the above-mentioned The processing cup of the substrate holding unit in the substrate processing apparatus is moved in the vertical direction and stopped at the first stop position as the first monitoring object.

The sixth aspect of the setting method of setting information for substrate processing monitoring is the setting method of setting information for substrate processing monitoring of any one of the first to third, and fifth aspects, wherein, in In the step of setting the formula above, the first monitoring object is sequentially moved to the first stop position and the second stop position different from the first stop position, and in the step of setting, according to the step of shooting in the step of setting The second image data including the first monitoring object stopped at the second stop position and the first reference image data acquired in the second image data to detect the first monitoring object in the second image data position of the object, and set this position to an appropriate position relative to the above-mentioned second stop position.

The seventh aspect of the setting method of setting information for substrate processing monitoring is the setting method of setting information for substrate processing monitoring of any one of the first to sixth aspects, wherein, in the above-mentioned setting recipe step In the above-mentioned substrate processing apparatus, the second monitored object different from the first monitored object is moved to the third stop position, and in the above-mentioned setting step, according to The third image data of the second monitoring object at the third stop position and the second reference image data representing at least a part of the second monitoring object are used to detect the above-mentioned first monitoring object in the third image data. 2. Monitoring the position of the object, and setting the position as an appropriate position relative to the third stop position of the second monitoring object.

The first aspect of the monitoring method of a substrate processing apparatus includes: a setting step of setting the setting information for substrate processing monitoring described in any one of the first to seventh aspects; and a holding step of The substrate is held by the substrate holding part in the substrate processing apparatus; the processing recipe step is to control the moving mechanism in the state where the substrate holding part holds the substrate, so that the first monitoring object moves to the first stop position; processing a photographing step of photographing the first monitoring object by the camera in parallel with the processing recipe step; Stop position of the fourth image data of the first monitoring object and the first reference image data to detect the position of the first monitoring object in the fourth image data, and based on the above-mentioned first The above-mentioned appropriate position related to the stop position is used to judge whether the position is appropriate.

The first aspect of the substrate processing device is for processing substrates; it is equipped with: a chamber; a moving mechanism that moves the object to be monitored in the chamber to a predetermined stop position; a camera that monitors the object including the object to be monitored area to obtain image data; a storage medium storing reference image data representing at least a part of the surveillance object; The image data of the object and the reference image data are used to detect the position of the monitoring object in the image data and set the position as an appropriate position related to the stop position. (compared to the effect of previous technology)

According to the setting method of the setting information used for substrate processing monitoring and the substrate processing apparatus, an appropriate position can be automatically set.

According to the monitoring method of the substrate processing apparatus of the present invention, the position of the monitoring object can be monitored.

Embodiments will be described below with reference to the attached drawings. In addition, the drawings are schematically shown, and omission of configuration or simplification of configuration are appropriately given for convenience of description. In addition, the relationship between the size and position of the configuration shown in the drawings is not necessarily described accurately, but can be appropriately changed.

In addition, in the following description, the same symbol is attached|subjected and shown to the same component, and the name and function of these are also assumed to be the same. Therefore, in order to avoid repetition, such detailed descriptions may be omitted.

In addition, in the description described below, even if there are cases where ordinal numbers such as "first" or "second" are used, these terms are used for convenience in order to facilitate understanding of the content of the embodiment, and are not limited. In the order generated by these ordinal numbers, etc.

Expressions indicating relative or absolute positional relationships (such as "towards one direction", "along one direction", "parallel", "orthogonal", "center", "concentric", "coaxial", etc.), as long as they are not In particular, the positional relationship is not only strictly expressed, but also indicates the relative displacement of the angle or distance within the tolerance or within the range where the same degree of function can be obtained. Expressions indicating equal states (such as "same", "equal", "homogeneous", etc.), unless otherwise specified, not only quantitatively and strictly express equal states, but also indicate that the same degree can be obtained within tolerance or existence The poor state of the function. Expressions indicating shapes (such as "square shape" or "cylindrical shape"), unless otherwise specified, not only mean the shape strictly geometrically, but also mean that it has the same effect within the scope of obtaining the same degree. Such as concave-convex or chamfered shape. The expression "has", "has", "has", "comprises" or "has" one constituent element is not an exclusive expression that excludes the existence of other constituent elements. The expressions of "at least any one of A, B and C" include only A, only B, only C, any two of A, B and C, and A, B and C all.

<Overall configuration of substrate processing equipment> FIG. 1 is a schematic plan view for explaining an example of an internal arrangement of a substrate processing apparatus 100 according to the present embodiment. As illustrated in FIG. 1 , the substrate processing apparatus 100 is a single-wafer processing apparatus that processes substrates W to be processed one at a time.

In the substrate processing apparatus 100 of this embodiment, the substrate W, which is a circular thin-plate-shaped silicon substrate, is cleaned using a rinse solution such as a chemical solution and pure water, and then dried.

As the above-mentioned chemical solution, for example, a mixed solution of ammonia and aqueous hydrogen peroxide (SC1), a mixed aqueous solution of hydrochloric acid and aqueous hydrogen peroxide (SC2), or a DHF solution (dilute hydrofluoric acid) can be used.

In the following description, chemical liquid, rinsing liquid, and organic solvent are collectively referred to as "treatment liquid". In addition, not only the cleaning treatment, but also a chemical solution for removing unnecessary films, a chemical solution for etching, and the like may be included in the "treatment liquid".

The substrate processing apparatus 100 includes a plurality of processing units 1 , a load port LP, an index robot 102 , a main transfer robot 103 , a control unit 9 , and a user interface 90 .

As shown in FIG. 1 , a plurality of load ports LP are arranged side by side. The carrier C is carried into each load port LP. As the carrier C, a FOUP (Front Opening Unified Pod), a SMIF (Standard Mechanical Inter Face) transfer box in which the substrate W is stored in a closed space, or an exposed substrate W can also be used. OC (Open Wafer Cassette; Open Cassette) in the external air. Also, the index robot 102 transfers the substrate W between the carrier C and the main transfer robot 103 .

The processing unit 1 performs liquid processing and drying processing on one substrate W. Twelve processing units 1 having the same configuration are arranged in the substrate processing apparatus 100 according to this embodiment.

Specifically, four towers each including three processing units 1 stacked in the vertical direction are arranged so as to surround the main transfer robot 103 .

In FIG. 1 , one processing unit 1 stacked in three layers is schematically shown. Furthermore, the number of processing units 1 in the substrate processing apparatus 100 is not limited to 12, but can also be appropriately changed.

The main transfer robot 103 is installed in the center of the four towers stacked by the processing unit 1 . The main transfer robot 103 carries the substrate W to be processed received from the index robot 102 into each processing unit. Also, the main transport robot 103 unloads the processed substrate W from each processing unit 1 and hands it to the index robot 102 . The control unit 9 controls the operation of each component of the substrate processing apparatus 100 .

The user interface 90 includes, for example, a display unit such as a liquid crystal display, and input devices such as a mouse and a keyboard. The operator can input various information to the user interface 90 . The user interface 90 outputs the input information to the control unit 9 .

Hereinafter, one of the 12 processing units 1 mounted in the substrate processing apparatus 100 will be described, but the other processing units 1 have the same configuration except for the arrangement relationship of nozzles.

<Processing Unit> FIG. 2 is a plan view schematically showing an example of the configuration of the processing unit 1 . 3 is a longitudinal cross-sectional view schematically showing an example of the configuration of the processing unit 1 .

The processing unit 1 includes a spin chuck 20 as an example of a substrate holding unit, a first nozzle 30 , a second nozzle 60 , a third nozzle 65 , a processing cup 40 , and a camera 70 in the chamber 10 .

The chamber 10 includes side walls 11 along the vertical direction, a top wall 12 closing the upper side of a space surrounded by the side walls 11 , and a bottom wall 13 closing the lower side. The space surrounded by the side wall 11, the top wall 12, and the bottom wall 13 becomes a processing space. In addition, a part of the side wall 11 of the chamber 10 is provided with a loading and unloading port for the main transfer robot 103 to load and unload the substrate W and a gate (both not shown) for opening and closing the loading and unloading port.

A fan filter unit (FFU; Fan Filter Unit) 14 is installed on the top wall 12 of the chamber 10 to further purify the air in the clean room provided with the substrate processing apparatus 100 before supplying it to the processing space in the chamber 10. . The fan filter unit 14 is provided with a fan and a filter (for example, a HEPA (High Efficiency Particulate Air) filter) for taking in and sending out the air in the clean room into the chamber 10, and in the chamber 10 The inner processing space forms a downflow of purified air. In order to evenly disperse the purified air supplied from the fan filter unit 14 , a perforated plate with a plurality of blowout holes can also be provided directly under the top wall 12 .

The spin chuck 20 holds the substrate W in a horizontal posture. The horizontal posture is a posture in which the normal line of the substrate W is along the vertical direction. The spin chuck 20 includes a disc-shaped spin base 21 fixed to the upper end of a rotating shaft 24 extending in the vertical direction in a horizontal posture. A rotation motor 22 for rotating a rotation shaft 24 is provided below the rotation base 21 . The rotation motor 22 rotates the rotation base 21 in the horizontal plane via the rotation shaft 24 . Moreover, the cylindrical cover member 23 is provided so that the periphery of the rotation motor 22 and the rotation shaft 24 may be surrounded.

The outer diameter of the disk-shaped spin base 21 is slightly larger than the diameter of the circular substrate W held by the spin chuck 20 . Therefore, the spin base 21 has an upper surface 21 a facing the entire lower surface of the substrate W to be held.

On the peripheral portion of the upper surface 21a of the rotary base 21, a plurality of (four in this embodiment) clamp pins 26 are erected. The plurality of clip pins 26 are arranged at equal intervals along the circumference corresponding to the periphery of the circular substrate W (if there are four clip pins 26 as in the present embodiment, the intervals are 90°). Each clip pin 26 is drivably provided between a holding position abutting against the periphery of the substrate W and an opening position away from the periphery of the substrate W. As shown in FIG. The plurality of clamp pins 26 are interlocked and driven by a link mechanism (not shown) accommodated in the rotary base 21 . The spin chuck 20 can hold the substrate W above the spin base 21 in a horizontal posture close to the upper surface 21a by stopping the plurality of clamp pins 26 at respective contact positions (see FIG. 3 ), and The holding of the substrate W can be released by stopping the plurality of clamp pins 26 at the respective open positions.

The lower end of the cover member 23 covering the rotary motor 22 is fixed to the bottom wall 13 of the chamber 10 , and the upper end reaches directly below the rotary base 21 . On the upper end portion of the cover member 23, there is provided a brim member 25 protruding substantially horizontally outward from the cover member 23 and extending curved downward. In the state where the spin chuck 20 is holding the substrate W by holding the substrate W with a plurality of clamp pins 26, the rotation motor 22 rotates the rotation shaft 24, whereby the substrate W can be rotated around a vertical axis passing through the center of the substrate W. The direction of rotation axis CX rotates. Furthermore, the drive of the rotary motor 22 is controlled by the control unit 9 .

The first nozzle 30 is constituted by attaching the discharge head 31 to the front end of the nozzle arm 32 . The base end side of the nozzle arm 32 is fixed and connected to the nozzle base 33 . The nozzle base 33 is rotatable about an axis along the vertical direction by a motor (not shown). By the rotation of the nozzle base 33 , as shown by the arrow AR34 in FIG. 2 , the first nozzle 30 moves in an arc shape in the space above the spin chuck 20 . The nozzle arm 32 , the nozzle base 33 and the motor are examples of the nozzle moving mechanism 37 that moves the first nozzle 30 .

FIG. 4 is a plan view schematically showing an example of the moving path of the first nozzle 30 . As shown in FIG. 4 , the discharge head 31 of the first nozzle 30 moves along the circumferential direction centering on the nozzle base 33 by the rotation of the nozzle base 33 . The first nozzle 30 can be stopped at an appropriate stop position. In the example of FIG. 4, the 1st nozzle 30 can stop at each of center position P31, peripheral position P32, and standby position P33.

The central position P31 is a position where the discharge head 31 and the central portion of the substrate W held by the spin chuck 20 face each other in the vertical direction. The processing liquid can be supplied to the entire upper surface of the substrate W by discharging the processing liquid toward the upper surface of the rotating substrate W from the first nozzle 30 located at the central position P31. Thereby, the whole upper surface of the board|substrate W can be processed.

The standby position P33 is a position where the discharge head 31 and the substrate W held by the spin chuck 20 do not face each other in the vertical direction. A standby box for accommodating the discharge head 31 of the first nozzle 30 may be provided at the standby position P33.

The peripheral position P32 is a position between the central position P31 and the standby position P33, and is a position where the discharge head 31 and the peripheral portion of the substrate W held by the spin chuck 20 face each other in the vertical direction. The first nozzle 30 can also discharge the processing liquid toward the upper surface of the rotating substrate W while being located at the peripheral edge position P32. Thereby, the processing liquid can be discharged only toward the peripheral portion of the upper surface of the substrate W, and only the peripheral portion of the substrate W can be processed (so-called bevel processing).

In addition, the first nozzle 30 may discharge the processing liquid toward the upper surface of the rotating substrate W while reciprocating between the central position P31 and the peripheral position P32. In this case, the entire upper surface of the substrate W may also be processed.

The peripheral position P34 is located on the opposite side to the peripheral position P32 relative to the center position P31, and is a position where the discharge head 31 and the peripheral portion of the substrate W held by the spin chuck 20 face each other in the vertical direction. The first nozzle 30 can also discharge the processing liquid toward the upper surface of the rotating substrate W while being located at the peripheral edge position P34. Thereby, the processing liquid can be discharged only toward the peripheral portion of the upper surface of the substrate W, and only the peripheral portion of the substrate W can be processed (so-called bevel processing).

In addition, the first nozzle 30 may discharge the processing liquid toward the upper surface of the rotating substrate W while reciprocating between the center position P31 and the peripheral edge position P34. In this case, the entire upper surface of the substrate W may also be processed.

In addition, the nozzle base 33 may also include a nozzle lifting mechanism (not shown) for raising and lowering the first nozzle 30 . The nozzle lifting mechanism includes, for example, a ball screw mechanism or a cylinder or the like. When the nozzle lifting mechanism is provided, the first nozzles 30 can be stopped at different stop positions in the vertical direction. For example, the first nozzle 30 may be stopped at a stop position vertically above the center position P31.

As shown in FIG. 3 , the first nozzle 30 is connected to a processing liquid supply source 36 via a supply pipe 34 . A valve 35 is provided in the supply pipe 34 . The valve 35 opens and closes the flow path of the supply pipe 34 . When the valve 35 is opened, the processing liquid supply source 36 supplies the processing liquid to the first nozzle 30 through the supply pipe 34 . Furthermore, the first nozzle 30 may be configured to be supplied with a plurality of processing liquids (including at least pure water).

In addition, the processing unit 1 of the present embodiment is further provided with a second nozzle 60 and a third nozzle 65 in addition to the above-mentioned first nozzle 30 . The second nozzle 60 and the third nozzle 65 of this embodiment have the same configuration as the above-mentioned first nozzle 30 . That is, the second nozzle 60 is constituted by attaching the discharge head 61 to the front end of the nozzle arm 62 . The second nozzle 60 moves in an arc shape in the space above the spin chuck 20 as indicated by the arrow AR64 by the nozzle base 63 connected to the base end side of the nozzle arm 62 . The relative positional relationship between the central position P61, the peripheral position P62, the standby position P63 and the peripheral position P64 on the moving path of the second nozzle 60, and the relative positional relationship between the central position P31, the peripheral position P32, the standby position P33 and the peripheral position P34 same.

Similarly, the third nozzle 65 is constituted by attaching the discharge head 66 to the front end of the nozzle arm 67 . The third nozzle 65 moves in an arc shape in the space above the spin chuck 20 as indicated by the arrow AR69 by the nozzle base 68 connected to the base end side of the nozzle arm 67 . It moves in an arc shape between the processing position and the standby position outside the processing cup 40 . The relative positional relationship between the central position P66, the peripheral position P67, the standby position P68 and the peripheral position P69 on the moving path of the third nozzle 65, and the relative positional relationship between the central position P31, the peripheral position P32, the standby position P33 and the peripheral position P34 same.

Moreover, the 2nd nozzle 60 and the 3rd nozzle 65 may be liftable. For example, the second nozzle 60 and the third nozzle 65 are raised and lowered by a nozzle base 63 and a nozzle elevating mechanism (not shown) built in the nozzle base 68 .

Each of the second nozzle 60 and the third nozzle 65 is also connected to a processing liquid supply source (not shown) through a supply pipe (not shown) in the same manner as the first nozzle 30 . Each supply pipe is provided with a valve (not shown), and the supply/stop of the treatment liquid can be switched by opening and closing the valve.

In addition, each of the 1st nozzle 30, the 2nd nozzle 60, and the 3rd nozzle 65 may be comprised so that several types of processing liquid may be supplied. In addition, at least any one of the first nozzle 30, the second nozzle 60, and the third nozzle 65 may be a two-fluid nozzle. The two-fluid nozzle mixes a cleaning liquid such as pure water with pressurized gas to generate a liquid. droplet, and spray the mixed fluid of the droplet and gas toward the substrate W. In addition, the number of nozzles provided in the processing unit 1 is not limited to three, but may be one or more.

The processing cup 40 surrounding the spin chuck 20 includes an inner cup 41 , a middle cup 42 and an outer cup 43 that can be raised and lowered independently of each other. The inner cup 41 surrounds the spin chuck 20 and has a substantially rotationally symmetrical shape with respect to the rotation axis CX passing through the center of the substrate W held by the spin chuck 20 . The inner cup 41 integrally includes an annular bottom 44 in plan view, a cylindrical inner wall 45 rising upward from the inner periphery of the bottom 44 , and a cylinder rising upward from the outer periphery of the bottom 44. Shaped outer wall portion 46 stands up from between the inner wall portion 45 and the outer wall portion 46, and the upper end portion draws a smooth arc while facing the center side (the direction close to the rotation axis CX of the substrate W held by the spin chuck 20). ) the first guide portion 47 extending obliquely upward, and the cylindrical middle wall portion 48 standing upward from between the first guide portion 47 and the outer wall portion 46 .

The inner wall part 45 is formed in such a length that it is accommodated with an appropriate gap between the cover member 23 and the collar member 25 in a state where the inner cup 41 is raised to the highest position. The middle wall portion 48 is formed with such a length that an appropriate gap is left between the second guide portion 52 described later in the middle cup 42 and the treatment liquid separation wall 53 in a state where the inner cup 41 and the middle cup 42 are closest to each other. And was taken in.

The first guide portion 47 has an upper end portion 47b extending obliquely upward toward the center side (direction close to the rotation axis CX of the substrate W) while drawing a smooth arc. Furthermore, a disposal groove 49 for collecting and discarding the used treatment liquid is provided between the inner wall portion 45 and the first guide portion 47 . Between the first guide portion 47 and the middle wall portion 48 is provided an annular inner recovery groove 50 for collecting and recovering the used treatment liquid. In addition, an annular outer recovery groove 51 for collecting and recovering a different type of treatment liquid from the inner recovery groove 50 is provided between the middle wall portion 48 and the outer wall portion 46 .

An exhaust and liquid discharge mechanism (not shown) is connected to the disposal ditch 49 for discharging the treatment liquid collected in the disposal ditch 49 and forcibly exhausting the inside of the disposal ditch 49 . For example, four exhaust and liquid discharge mechanisms are provided at equal intervals along the circumferential direction of the waste groove 49 . Also, a recovery mechanism (both for recycling the treatment liquid collected in the inner recovery groove 50 and the outer recovery groove 51 to the recovery groove provided outside the processing unit 1) is connected to the inner recovery groove 50 and the outer recovery groove 51. illustration omitted). Furthermore, the bottoms of the inner recovery ditch 50 and the outer recovery ditch 51 are inclined at a slight angle relative to the horizontal direction, and a recovery mechanism is connected at the lowest position. Thereby, the treatment liquid flowing into the inner recovery groove 50 and the outer recovery groove 51 is recovered smoothly.

The middle cup 42 surrounds the periphery of the spin chuck 20 and has a substantially rotationally symmetrical shape with respect to the rotation axis CX passing through the center of the substrate W held by the spin chuck 20 . The middle cup 42 integrally includes a second guide part 52 and a cylindrical processing liquid separation wall 53 connected to the second guide part 52 .

The second guide part 52 is on the outer side of the first guide part 47 of the inner cup 41, has a coaxial cylindrical lower end part 52a with the lower end part of the first guide part 47, and draws smoothly from the upper end of the lower end part 52a. The upper end portion 52b extending obliquely upward toward the center side (the direction close to the rotation axis CX of the substrate W) and the folded portion 52c formed by folding the front end portion of the upper end portion 52b downward. The lower end portion 52a is accommodated in the inner recovery groove 50 with an appropriate gap between the first guide portion 47 and the middle wall portion 48 when the inner cup 41 and the middle cup 42 are closest to each other. Also, the upper end portion 52b is set to overlap with the upper end portion 47b of the first guide portion 47 of the inner cup 41 along the vertical direction, and in the state where the inner cup 41 and the middle cup 42 are closest to each other, a very small gap is kept. It is close to the upper end portion 47b of the first guide portion 47 . In addition, the folded portion 52c formed by folding the front end of the upper end portion 52b downward is set to the following length: when the inner cup 41 and the middle cup 42 are closest to each other, the folded portion 52c and the upper end of the first guide portion 47 The front ends of the portions 47b overlap in the horizontal direction.

In addition, the upper end portion 52b of the second guide portion 52 is formed to become thicker toward the lower side, and the processing liquid separation wall 53 has a cylindrical shape extending downward from the lower end outer peripheral edge portion of the upper end portion 52b. The processing liquid separation wall 53 is accommodated in the outer recovery groove 51 with an appropriate gap between the middle wall portion 48 and the outer cup 43 when the inner cup 41 and the middle cup 42 are closest to each other.

The outer cup 43 surrounds the periphery of the spin chuck 20 on the outside of the second guide portion 52 of the middle cup 42 , and has a substantially rotationally symmetrical shape with respect to the rotation axis CX passing through the center of the substrate W held on the spin chuck 20 . The outer cup 43 functions as a third guide. The outer cup 43 has a lower end portion 43a coaxial with the lower end portion 52a of the second guide portion 52. The upper end of the lower end portion 43a draws a smooth arc while moving toward the center side (closer to the rotation axis CX of the substrate W). direction) and the upper end portion 43b extending obliquely upward, and the folded portion 43c formed by folding the front end portion of the upper end portion 43b downward.

When the inner cup 41 and the outer cup 43 are closest to each other, the lower end 43a is accommodated in the outer recovery groove 51 with an appropriate gap between the treatment liquid separation wall 53 of the middle cup 42 and the outer wall 46 of the inner cup 41. . Also, the upper end portion 43b is set to overlap with the second guide portion 52 of the middle cup 42 along the vertical direction, and when the middle cup 42 and the outer cup 43 are closest to each other, a very small distance is kept close to the second guide portion. The upper end portion 52b of the lead portion 52. In addition, the folded portion 43c formed by folding the front end portion of the upper end portion 43b downward is formed so that the folded portion 43c and the folded portion 52c of the second guide portion 52 are formed when the middle cup 42 and the outer cup 43 are closest to each other. Overlap horizontally.

Moreover, the inner cup 41, the middle cup 42, and the outer cup 43 are set so that they may move up and down independently of each other. That is, each of the inner cup 41, the middle cup 42, and the outer cup 43 is individually provided with a cup moving mechanism 59, and can thereby be independently raised and lowered. As such a cup moving mechanism 59, various well-known mechanisms, such as a ball screw mechanism and an air cylinder, can be employ|adopted, for example.

The partition plate 15 is provided to vertically partition the inner space of the chamber 10 around the processing cup 40 . The partition plate 15 may be a single plate-shaped member surrounding the processing cup 40, or may be formed by joining a plurality of plate-shaped members. In addition, the partition plate 15 may also be formed with a through hole or notch penetrating in the thickness direction, and in this embodiment, the nozzle base 33 for supporting the first nozzle 30 and the nozzle of the second nozzle 60 are formed. A through hole through which the support shafts of the base 63 and the nozzle base 68 of the third nozzle 65 pass.

The outer peripheral end of the partition plate 15 is connected to the side wall 11 of the chamber 10 . Also, the edge portion of the partition plate 15 surrounding the processing cup 40 is formed in a circular shape having a diameter larger than the outer diameter of the outer cup 43 . Therefore, the partition plate 15 will not be an obstacle to the lifting of the outer cup 43 .

In addition, an exhaust pipe 18 is provided on a part of the side wall 11 of the chamber 10 and near the bottom wall 13 . The exhaust pipe 18 is communicated with an exhaust mechanism (not shown). Of the purified air supplied from the fan filter unit 14 and flowing downward in the chamber 10 , the air that has passed between the processing cup 40 and the partition plate 15 is exhausted from the exhaust pipe 18 to the outside of the apparatus.

The camera 70 is disposed in the chamber 10 and above the partition plate 15 . The camera 70 includes, for example, a CCD (Charge Coupled Device) which is one of solid-state imaging devices, and an optical system such as a lens. The camera 70 is installed to monitor a monitoring object in the chamber 10 described later. Specific examples of objects to be monitored will be described in detail later. The camera 70 is arranged at a position including a monitoring object within the imaging area. The shooting area includes, for example, the substrate W and the space above the substrate W. The camera 70 captures the photographed area to obtain photographed image data, and sequentially outputs the obtained photographed image data to the control unit 9 .

As shown in FIG. 3 , an illumination unit 71 is provided in the chamber 10 at a position above the partition plate 15 . When the chamber 10 is a dark room, the control unit 9 may control the lighting unit 71 so that the lighting unit 71 emits light when the camera 70 takes pictures.

The configuration of the hardware as the control unit 9 provided in the substrate processing apparatus 100 is the same as that of a general computer. That is, the control unit 9 is configured to be equipped with a processing unit such as a CPU (Central Processing Unit; Central Processing Unit) that performs various calculations, and a ROM (read only memory) as a memory dedicated to reading the basic program. Temporary storage media such as Read Only Memory), RAM (Random Access Memory; Random Access Memory) as a freely read-write memory that stores various information, and disks that store software or data for control in advance, etc. non-transitory storage media. The CPU of the control unit 9 executes a predetermined processing program, and each operating mechanism of the substrate processing apparatus 100 is controlled by the control unit 9 to perform processing in the substrate processing apparatus 100 . Furthermore, the realization of the functions of the control unit 9 can also be realized by a dedicated hardware circuit that does not require software.

FIG. 5 is a functional block diagram schematically showing an example of the internal configuration of the control unit 9 . The control unit 9 includes a monitor processing unit 91 , a setup unit 92 , and a processing control unit 93 .

The process control unit 93 controls various components in the chamber 10 . Specifically, the processing control unit 93 controls the rotary motor 22 , various valves such as the valves 35 and 82 , the motors of the nozzle bases 33 , 63 , and 68 , the nozzle lifting mechanism, the cup moving mechanism 59 , and the fan filter unit 14 . The processing unit 1 can process the substrate W by controlling these components in a predetermined order by the processing control unit 93 .

The monitoring processing unit 91 performs monitoring processing on the monitoring object based on the captured image data captured by the camera 70 in the chamber 10 . The monitoring processing unit 91 monitors the position of the monitoring object. Various nozzles, such as the 1st nozzle 30, the 2nd nozzle 60, and the 3rd nozzle 65, can be employ|adopted as a monitoring object, for example. In addition, the monitoring processing unit 91 may monitor the discharge state of the processing liquid from various nozzles. A specific example of monitoring processing will be described in detail later.

The setting unit 92 sets processing information used for monitoring processing. For example, the setting unit 92 sets an appropriate position (hereinafter referred to as a set coordinate position) of a monitoring object in the captured image data. In addition, the setting unit 92 may also set a judgment area for monitoring the discharge state of the processing liquid of various nozzles in the captured image data. An example of a specific setting method will be described in detail later.

＜Example of substrate processing flow＞ ＜Overall flow＞ FIG. 6 is a flow chart showing an example of the flow of substrate processing. First, the main transfer robot 103 carries the unprocessed substrate W into the processing unit 1 (step S1: carrying-in step). Next, the spin chuck 20 holds the substrate W in a horizontal posture (step S2: holding step). Specifically, the substrate W is held by the plurality of clamp pins 26 as the plurality of clamp pins 26 move to their contact positions.

Next, the rotation motor 22 starts rotation of the substrate W (step S3: rotation step). Specifically, the spin chuck 20 is rotated by the rotation motor 22 to rotate the substrate W held on the spin chuck 20 . Next, the cup elevating mechanism raises the processing cup 40 (step S4: cup elevating step). Thereby, the processing cup 40 stops at the upper position.

Next, the processing liquid is sequentially supplied to the substrate W (step S5: processing recipe step). In this processing recipe step (step S5 ), the cup moving mechanism 59 switches the cup to be lifted appropriately according to the type of processing liquid supplied to the substrate W, but for simplification of description, the description is omitted below.

In the processing recipe step (step S5 ), the first nozzle 30 , the second nozzle 60 , and the third nozzle 65 sequentially discharge the processing liquid onto the upper surface of the rotating substrate W, respectively, as necessary. Here, as an example, the first nozzle 30 and the second nozzle 60 sequentially discharge the processing liquid. First, the nozzle moving mechanism 37 moves the first nozzle 30 from the standby position P33 to the center position P31. Next, the processing liquid is discharged from the first nozzle 30 toward the upper surface of the substrate W by opening the valve 35 . The processing liquid that has been discharged and contacted the upper surface of the substrate W is diffused by the centrifugal force, and is scattered from the peripheral edge of the substrate W toward the outside. Thereby, the upper surface of the substrate W can be treated according to the treatment liquid. For example, the valve 35 is closed when a predetermined time elapses from the supply of the treatment liquid. Thereby, the discharge of the treatment liquid from the first nozzle 30 is stopped. Next, the nozzle moving mechanism 37 moves the first nozzle 30 from the center position P31 to the standby position P33.

Next, the nozzle moving mechanism (nozzle base 63 ) moves the second nozzle 60 from the standby position P63 to the center position P61. Next, the processing liquid is discharged from the second nozzle 60 toward the upper surface of the substrate W by opening the valve for the second nozzle 60 . The treatment liquid that is discharged and contacts the upper surface of the substrate W is diffused by the centrifugal force, and scattered from the peripheral edge of the substrate W toward the outside. The processing liquid is, for example, a rinse liquid such as pure water. In this case, the rinsing liquid washes away the processing liquid on the upper surface of the substrate W, so that the processing liquid on the upper surface of the substrate W is replaced by the rinsing liquid. For example, when a predetermined time elapses from the supply of the flushing liquid, the valve is closed. Thereby, the discharge of the rinse liquid from the second nozzle 60 is stopped. Next, the nozzle base 63 moves the second nozzle 60 from the central position P61 to the standby position P63.

The first nozzle 30, the second nozzle 60, and the third nozzle 65 may also sequentially move to a predetermined stop position as necessary, and discharge the processing liquid. When the discharge of the processing liquid from the first nozzle 30, the second nozzle 60, and the third nozzle 65 is completed, the processing recipe step (step S5) is completed.

Referring again to FIG. 6 , after the processing recipe step (step S5 ), the processing unit 1 dries the substrate W (step S6 : drying step). For example, the rotation motor 22 increases the rotation speed of the substrate W to dry the substrate W (so-called spin drying).

Next, the cup moving mechanism 59 lowers the processing cup 40 (step S7: cup lowering step).

Next, the spin motor 22 ends the rotation of the spin chuck 20 and the substrate W, and the spin chuck 20 releases the holding of the substrate W (step S8: holding releasing step). Specifically, the holding is released by moving the plurality of clip pins 26 to their respective open positions.

Next, the main transport robot 103 unloads the processed substrate W from the processing unit 1 (step S9: unloading step).

Thereby, the processing of the substrate W is performed.

＜Monitoring object＞ <Nozzle position> In the above-mentioned processing recipe step (step S5), the first nozzle 30, the second nozzle 60, and the third nozzle 65 are appropriately moved as necessary. For example, the first nozzle 30 moves from the standby position P33 to the center position P31. At this time, the first nozzle 30 may be shifted from the center position P31 due to various reasons such as motor abnormality of the nozzle base 33 and may stop. In this case, the processing by the processing liquid from the first nozzle 30 may end inappropriately.

Therefore, the position of the nozzle should be monitored. In the following, position monitoring of nozzles will be described.

＜Setting process＞ First, the setting process for setting the setting information used in the monitoring process will be described. This installation process is performed, for example, when the substrate processing apparatus 100 is installed at an installation location (for example, a factory). FIG. 7 is a flowchart showing an example of setting processing.

First, the operator inputs necessary items to the user interface 90 (step S11: input step). For example, the operator performs an input designating the first nozzle 30 , the second nozzle 60 , and the third nozzle 65 as monitoring objects, and performs an input designating a plurality of positions as stop positions of the respective nozzles. For example, the operator inputs a plurality of stop positions such as the central position P31 , the peripheral position P32 , and the peripheral position P34 as the stop positions of the first nozzle 30 . The same applies to the second nozzle 60 and the third nozzle 65 . Furthermore, the number of stop positions can also be changed appropriately.

Next, the operator performs an input instructing the start of the setting on the user interface 90 .

In response to the input of the instruction, the processing control unit 93 causes the video camera 70 to start shooting (step S12: start of setting shooting step). The camera 70 captures the photographed area to obtain photographed image data, and outputs the photographed image data to the control unit 9 .

In response to the instruction input, the processing control unit 93 controls the nozzle moving mechanism to sequentially move the first nozzle 30, the second nozzle 60, and the third nozzle 65 to respective stop positions (step S12: recipe setting step). For example, the nozzle moving mechanism 37 sequentially stops the first nozzle 30 at the peripheral position P32, the central position P31, and the peripheral position P34. Specifically, first, the nozzle moving mechanism 37 moves the first nozzle 30 from the standby position P33 to the peripheral position P32, stops at the peripheral position P32 for a predetermined time, and then moves the first nozzle 30 from the peripheral position P32 to the central position P31. , covering the predetermined time to stop at the central position P31, and then moving the first nozzle 30 from the central position P31 to the peripheral position P34, and covering the predetermined time to stop at the peripheral position P34. The nozzle moving mechanism 37 stops the first nozzle 30 at all input stop positions, and then moves to the standby position P33. Thereafter, the processing control unit 93 similarly stops the second nozzle 60 sequentially at all the stop positions, and then stops the third nozzle 65 sequentially at all the stop positions.

In addition, it is preferable that the processing control unit 93 can store the time when each nozzle is stopped at each stop position in the storage medium in advance in the recipe setting step. For example, the processing control unit 93 stores in advance the timing at which a control signal for stopping the first nozzle 30 at the center position P31 is output to the nozzle moving mechanism 37 . Similarly, the processing control unit 93 also prestores in the storage medium the timing at which the control signals for each of the peripheral position P32 and the peripheral position P34 are output. The same applies to the second nozzle 60 and the third nozzle 65 .

If the step of setting the recipe ends, the camera 70 ends the shooting (step S14: the step of setting the shooting ends).

Since the setting and photographing step is performed in parallel with the recipe setting step, the camera 70 can photograph the first nozzle 30 , the second nozzle 60 and the third nozzle 65 . That is, the plurality of captured image data acquired by the camera 70 includes each of the first nozzle 30 , the second nozzle 60 and the third nozzle 65 stopped at the respective stop positions.

FIG. 8 is a diagram schematically showing an example of captured image data acquired in the setting and shooting step. The captured image data of FIG. 8 includes the discharge head 31 of the first nozzle 30 stopped at the central position P31. That is, FIG. 8 shows captured image data obtained when the first nozzle 30 stops at the center position P31.

Next, the setting unit 92 specifies captured image data including each nozzle stopped at each stop position (hereinafter referred to as set image data) from a plurality of captured image data (step S15: set image data specifying step). For example, the setting unit 92 specifies setting image data including the first nozzle 30 stopped at the central position P31 based on the control signal output to the nozzle moving mechanism 37 . That is, the setting unit 92 reads the time at which the control signal for moving the first nozzle 30 to the center position P31 is output from the storage medium, and specifies it based on the time and the time at which the image data captured by the camera 70 is obtained. Output the set image data including the first nozzle 30 stopped at the central position P31. Since the time from when the control signal is output to when the first nozzle 30 stops at the center position P31 is predetermined, the setting unit 92 can obtain the period during which the first nozzle 30 stops at the center position P31 based on the time when the control signal is output. The setting unit 92 specifies the captured image data having the acquisition time included in the period as the set image data.

The setting unit 92 similarly specifies the setting image data including the first nozzle 30 stopped at each other stop position, the setting image data including the second nozzle 60 stopped at each stop position, and the setting image data including the second nozzle 60 stopped at each stop position. The setting image data of the third nozzle 65. If the number of stop positions relative to each nozzle is the same, (number of nozzles)×(number of stop positions) sheets of set image data are specified in the step of setting image data specifying.

Furthermore, in the setting recipe step (step S13 ), the setting substrate W may be carried into the processing unit 1 . In the example of FIG. 8 , the substrate W for setting held by the spin chuck 20 is included in the captured image data. However, in the step of setting the recipe, the substrate W for setting may not necessarily be carried in.

Moreover, in the step of setting the recipe, the cup moving mechanism 59 can also raise the processing cup 40 . In the example of FIG. 8, the image data shows the processing cup 40 in the raised state. However, in the step of setting the recipe, the processing cup 40 may not necessarily rise up.

Next, the setting unit 92 analyzes the setting image data, detects the coordinate position of the nozzle in the setting image data, and sets the coordinate position as the setting coordinate position (step S17: position setting step). For example, the setting unit 92 uses the setting image data ( FIG. 8 ) including the first nozzle 30 stopped at the central position P31 and the first nozzle 30 (specifically, the discharge head 31 ) stored in the storage medium in advance. The coordinate position of the first nozzle 30 in the set image data is detected by template matching with reference to the image data RI1. Furthermore, in the example of FIG. 8 , the reference image data RI1 is displayed by overlapping the captured image data schematically with phantom lines.

The setting unit 92 sets the detected coordinate position as the set coordinate position with respect to the central position P31. Specifically, the setting unit 92 stores the set coordinate position with respect to the central position P31 in the storage medium.

Furthermore, the setting unit 92 detects the coordinate position of the first nozzle 30 in the setting image data by template matching between the setting image data including the first nozzle 30 stopped at other stop positions and the reference image data RI1, And set the coordinate position as the set coordinate position with respect to the stop position. Also, the setting unit 92 detects the coordinate position of the second nozzle 60 based on the image data for setting including the second nozzle 60 stopped at each stop position and the reference image data representing a part of the second nozzle 60, and sets The coordinate position is set as a set coordinate position with respect to the stop position. Moreover, the setting part 92 also sequentially sets the setting coordinate position with respect to each stop position of the 3rd nozzle 65 similarly.

Thereby, the set coordinate positions of the respective stop positions of the first nozzle 30, the set coordinate positions of the respective stop positions of the second nozzle 60, and the set coordinate positions of the respective stop positions of the third nozzle 65 are set.

In addition, in the example of FIG. 7, step S17 (judgment area setting step) is also performed, and this process will be mentioned later.

As described above, according to this setting process, the setting unit 92 automatically specifies setting image data from a plurality of captured image data, and automatically sets the setting coordinate position of the monitoring object in the setting image data. Therefore, the operator does not need to visually recognize a plurality of captured image data and manually specify the setting image data, and also does not need to manually designate the coordinate position of the first nozzle 30 in the setting image data. Therefore, the burden on the operator can be reduced, and the work time required for installation can be shortened. In addition, it is also possible to avoid unevenness in setting due to unevenness in the proficiency of workers.

Also, according to this setting process, the setting unit 92 sequentially and automatically specifies all the setting image data for each stop position of each nozzle in response to, for example, an input of setting start designation by an operator. For comparison, the following situation can also be considered: for each nozzle stop position, the input for specifying the set image data is performed separately. For example, the following situation can also be considered: the setting part 92 responds to the input of the setting image data including the first nozzle 30 stopped at the central position P31 to specify the setting image data, and responds to the input of the setting image data using the specified The setting image data is specified by inputting the setting image data including the first nozzle 30 stopped at the peripheral edge position P32. However, such an input is a burden on the operator and prolongs the working time. On the other hand, in the above-mentioned example, since all the setting image data can be specified by one input, the number of times of input by the operator can be reduced, and the working time can be shortened. Furthermore, when the setting part 92 uses the end of the setting and shooting step as a trigger to perform a specific step of setting image data, the number of times of input by the operator can be further reduced.

In addition, the setting unit 92 sequentially sets all the set coordinate positions for each stop position of each nozzle in response to one input, for example. Therefore, the number of times of input by the operator can be reduced, and the working time can be shortened. Furthermore, when the setting part 92 performs the position setting step by triggering the completion of the specific step of setting the image data, the number of times of input by the operator can be further reduced.

In addition, in setting process, the input of a worker can also be used suitably as a trigger (trigger). For example, the specific step of setting image data can also be started with an input instruction from an operator as a trigger. For example, the setting unit 92 notifies the operator of the completion of the setting and shooting step via the user interface 90 , and the operator receives the notification, and inputs to the user interface 90 instructing the start of the specific step of setting the image data. The setting unit 92 may also perform specific steps of setting image data in response to the input of the instruction.

In addition, the position setting step (step S16) may be started by an input instruction from an operator as a trigger. For example, the setting unit 92 notifies the operator of the completion of the specific step of setting the image data via the user interface 90 , and the operator receives the notification and inputs to the user interface 90 instructing the start of the position setting step. The setting unit 92 may also perform an image data specific setting step in response to the input of the instruction.

＜Monitoring process＞ Next, an example of monitoring processing performed in parallel with the processing recipe step (step S5) will be described. FIG. 9 is a flowchart showing an example of monitoring processing. In parallel with the recipe processing step, the camera 70 sequentially photographs the photographed area to obtain photographed image data (step S21: process photographing step). In the above example, in the processing recipe step, the first nozzle 30 discharges the processing liquid to the upper surface of the substrate W at the central position P31, and then the second nozzle 60 discharges the processing liquid to the upper surface of the substrate W at the central position P61 ( such as flushing fluid).

The monitoring processing unit 91 monitors the position of each nozzle based on the captured image data acquired in the processing and capturing step (step S22: position monitoring step). Specifically, first, the monitoring processing unit 91 receives information indicating the order of processing from the processing control unit 93 , and specifies a period during which the first nozzle 30 moves from the standby position P33 to the center position P31 based on the information. The monitoring processing unit 91 detects the coordinate position of the first nozzle 30 in the captured image data by matching the captured image data obtained during this period with the template of the reference image data RI1 stored in the storage medium. . If the coordinate position of the first nozzle 30 is substantially constant in a plurality of captured image data, it can be judged that the first nozzle 30 stops at the central position P31, and this coordinate position corresponds to the stop coordinate position of the first nozzle 30.

Next, the monitoring processing unit 91 reads the set coordinate position about the central position P31 from the storage medium, and judges whether the position of the first nozzle 30 is appropriate based on the detected stop coordinate position of the first nozzle 30 and the set coordinate position. . Specifically, the monitoring processing unit 91 determines whether or not the difference between the stop coordinate position and the set coordinate position is an allowable value or less. The allowable value is set in advance, for example, and is stored in a storage medium.

If the difference is equal to or less than the allowable value, the monitoring processing unit 91 determines that the first nozzle 30 is properly stopped at the center position P31. On the other hand, if the difference is greater than the allowable value, the monitoring processing unit 91 determines that the first nozzle 30 is stopped at a position deviated from the central position P31. That is, the monitoring processing unit 91 detects an abnormality in the nozzle position of the first nozzle 30 . The monitoring processing unit 91 may notify the operator of the abnormality of the nozzle position of the first nozzle 30 via the user interface 90 . In addition, at this time, the processing control unit 93 may interrupt the processing of the substrate W.

The monitoring processing unit 91 also monitors the position of the second nozzle 60 by the same processing as above. In addition, in the processing recipe step (step S5 ), when the third nozzle 65 discharges the processing liquid onto the upper surface of the substrate W, the monitoring processing unit 91 also monitors the position of the third nozzle 65 by the same processing.

As described above, the monitoring processing unit 91 can monitor the position of each nozzle in the processing recipe step.

＜Spit monitoring＞ In the example of FIG. 9 , the monitoring processing unit 91 also monitors the discharge state of the processing liquid from each nozzle in the processing recipe step (step S5 ) based on the captured image data (step S23 : discharge monitoring step). Hereinafter, the first nozzle 30 will be described as an example.

First, the monitoring processing unit 91 sets the ejection determination region R1 in the captured image data (see FIG. 8 ). The discharge determination region R1 is a region including a region lower than the front end of the first nozzle 30 in the captured image data, and is a region including the processing liquid discharged from the front end of the first nozzle 30 .

The relative positional relationship of the discharge determination region R1 with respect to the coordinate position of the first nozzle 30 is set in advance and stored in a storage medium. In addition, the discharge determination region R1 has, for example, a rectangular shape extending in the longitudinal direction, and is set to a predetermined size in advance. A relative relationship representing such a positional relationship, shape, and size (hereinafter referred to as a set relative relationship) is stored in a storage medium.

The monitoring processing unit 91 sets the discharge determination region R1 based on the stop coordinate position of the first nozzle 30 detected by the aforementioned template matching and the set relative relationship stored in the storage medium. Thereby, even if the coordinate position of the first nozzle 30 changes slightly in the captured image data, the discharge determination region R1 can be set according to the coordinate position. Therefore, the discharge determination region R1 is set to appropriately include the processing liquid discharged from the front end of the first nozzle 30 .

FIG. 10 is a diagram schematically showing another example of processing the captured image data acquired in the capturing step (step S21). The captured image data in FIG. 10 includes the discharge head 31 of the first nozzle 30 which discharges the processing liquid at the central position P31. That is, FIG. 10 shows captured image data obtained when the first nozzle 30 discharges the processing liquid at the central position P31.

As can be understood from a comparison between FIG. 8 and FIG. 10 , the pixel values in the discharge determination region R1 are different when the first nozzle 30 discharges the processing liquid and when the first nozzle 30 does not discharge the processing liquid. For example, the sum of the pixel values in the discharge determination region R1 when the first nozzle 30 discharges the processing liquid is greater than the sum of the pixel values in the discharge determination region R1 when the first nozzle 30 does not discharge the processing liquid.

Therefore, the monitoring processing unit 91 judges whether or not the first nozzle 30 is discharging the processing liquid based on the pixel value in the discharge determination region R1. As a specific example, the monitoring processing unit 91 determines whether the sum of the pixel values in the discharge determination region R1 is greater than or equal to a predetermined discharge reference value, and determines that the first nozzle 30 is discharging the processing liquid when the sum is greater than or equal to the discharge reference value. Moreover, the monitoring processing unit 91 determines that the first nozzle 30 has not discharged the processing liquid when the total sum is less than the discharge reference value.

It should be noted that the determination of the presence or absence of discharge of the processing liquid based on the pixel values in the discharge determination region R1 is not limited thereto, and various methods can be employed. For example, the variance of the pixel values in the discharge determination region R1 when the first nozzle 30 discharges the processing liquid is larger than the variance when the first nozzle 30 does not discharge the processing liquid. Therefore, the monitoring processing unit 91 may also calculate the variance, and judge whether or not the treatment liquid is discharged based on the magnitude of the variance. In addition, a standard deviation may be used instead of the variance.

The monitoring processing unit 91 performs the above-mentioned processing on each of the photographed image data sequentially acquired by the camera 70, thereby detecting the timing when the first nozzle 30 starts to discharge the processing liquid and the first nozzle 30 ends the processing liquid. The end point of spit out. In addition, the monitoring processing unit 91 may calculate the discharge time at which the treatment liquid is discharged from the start time and the end time, and monitor whether the discharge time is a predetermined time. Specifically, when the difference between the discharge time and the predetermined time is greater than or equal to the allowable time, it is determined that a discharge abnormality has occurred. The allowable time is set in advance, for example, and stored in a storage medium.

The monitoring processing part 91 monitors the discharge state of the processing liquid from the 2nd nozzle 60 and the 3rd nozzle 65 by the same processing as needed. For example, when the second nozzle 60 also discharges the processing liquid at the central position P61 in the processing recipe step (step S5 ), the monitoring processing unit 91 also monitors the discharge state of the processing liquid from the second nozzle 60 .

In addition, in the processing recipe step (step S5), the first nozzle 30 may discharge the processing liquid at the peripheral edge position P32. In this case, the monitoring processing unit 91 monitors the discharge state of the processing liquid at the peripheral edge position P32 of the first nozzle 30 . Specifically, first, the monitoring processing unit 91 specifies a period during which the first nozzle 30 moves to the peripheral edge position P32 based on the information indicating the processing order received from the processing control unit 93 . The monitoring processing part 91 specifies the captured image data which stopped at the peripheral edge position P32 from the captured image data acquired during this period, and detects the stop coordinate position of the 1st nozzle 30 in this captured image data. Then, the monitoring processing unit 91 sets the discharge determination region R1 according to the stop coordinate position of the first nozzle 30 and the set relative relationship stored in the storage medium, and monitors the discharge state of the processing liquid according to the pixel value in the discharge determination region R1.

When the second nozzle 60 and the third nozzle 65 discharge the processing liquid at appropriate stop positions, the monitoring processing unit 91 also monitors the discharge state of the processing liquid from each of the second nozzle 60 and the third nozzle 65. .

＜judgment area＞ The sizes in the captured image data of the first nozzle 30 stopped at different first stop positions and second stop positions are different from each other. Specifically, when the first stop position and the second stop position are shifted from each other in the depth direction when viewed from the camera 70 , the sizes in the captured image data of the first nozzle 30 are different from each other. For example, in the depth direction of the camera 70, the central position P31, the peripheral position P32, and the peripheral position P34 are different from each other. Therefore, the sizes in the captured image data of the first nozzle 30 stopped at the central position P31, the peripheral position P32, and the peripheral position P32 are different from each other.

FIG. 11 is a diagram showing the difference in size in the captured image data of the first nozzle 30 . In FIG. 11 , the first nozzle 30 on the right is larger than the first nozzle 30 on the left. That is, the first nozzle 30 on the right represents the first nozzle 30 stopped at a position close to the camera 70 in the depth direction, and the first nozzle 30 on the left represents the first nozzle 30 stopped at a position away from the camera 70 in the depth direction.

Since the first nozzle 30 on the left is stopped at a stop position away from the camera 70 , the treatment liquid ejected from the front end of the first nozzle 30 on the left will be displayed as small in the captured image data. On the contrary, since the first nozzle 30 on the right is stopped at a stop position close to the camera 70, the treatment liquid discharged from the front end of the first nozzle 30 on the right will be displayed larger in the captured image data.

In such captured image data, if the position and size of the discharge determination region R1 are not set according to the stop position, that is, not according to the size of the first nozzle 30, the discharge determination region R1 will deviate from the proper position relative to the processing liquid. , or become too large compared to the size of the treatment liquid. In FIG. 11 , the distance between the front end of the first nozzle 30 on the left side and the upper end of the ejection judgment area R1 is equal to the distance between the front end of the first nozzle 30 on the right side and the upper end of the ejection judgment area R1, and the two ejection judgment areas R1 are also equal in size. In this case, the discharge determination region R1 on the left side is shifted downward from an appropriate position with respect to the processing liquid, and is set to be larger than the processing liquid.

Therefore, it is preferable to set in advance the relative setting relationship indicating the position and size of the discharge determination region R1 with respect to the first nozzle 30 respectively for different stop positions.

<Judgement area setting procedure> In an example of the setting process in FIG. 7, the determination area setting step (step S17) is executed after the position setting step (step S16). In the determination area setting step, the setting unit 92 sets a set relative relationship representing the geometrical relationship (position and size) between the set coordinate position of each nozzle and the discharge determination area R1 according to the stop position of each nozzle.

However, the setting relative relationship of the first nozzle 30 with respect to the central position P31 is set in advance and stored in a storage medium. This set relative relationship is manually set by an operator, for example as follows. For example, the operator inputs the setting image data including the setting image data of the first nozzle 30 stopped at the central position P31 to the user interface 90 . The control unit 9 responds to the input and displays the setting image data on the user interface 90 . The operator visually recognizes the setting image data, and specifies the position and size of the discharge determination region R1 in the setting image data to the user interface 90 . The setting unit 92 creates a set relative relationship representing the geometrical relative relationship between the set coordinate position of the first nozzle 30 in the set image data and the input discharge determination region R1, and stores the set relative relationship in the memory. media.

The setting unit 92 automatically creates a set relative relationship corresponding to the first nozzle 30 stopped at another stop position based on the set relative relationship with respect to the central position P31 of the first nozzle 30 . Specifically, first, the setting unit 92 detects the size of the first nozzle 30 included in the setting image data including the first nozzle 30 stopped at the peripheral edge position P32. For example, the setting unit 92 performs template matching using the setting image data and the reference image data RI1 of the first nozzle 30 . In the template matching, the size of the reference image data RI1 is changed sequentially to identify a region in the set image data that has a high similarity with the reference image data RI1. Thereby, the magnification M1 of the region corresponding to the reference image data RI1 in the set image data relative to the reference image data RI1 can be obtained.

FIG. 12 schematically shows an example of the discharge determination region R1 at the central position P31 and the peripheral position P32. In Fig. 12, the magnification M1 of the size of the first nozzle 30 on the peripheral position P32 relative to the size of the first nozzle 30 at the central position P31 (that is, the size of the reference image data RI1) is represented by a framed arrow (block arrows) are schematically represented.

In FIG. 12 , since the size of the first nozzle 30 at the peripheral position P32 is smaller than the size of the first nozzle 30 at the central position P31 , the magnification M1 is smaller than 1. However, when the peripheral position P32 is closer to the camera 70 than the central position P31, the magnification M1 will be greater than 1 because the first nozzle 30 at the peripheral position P32 will appear larger when photographed.

The setting unit 92 sets the size of the discharge determination region R1 for the peripheral position P32 to a value obtained by multiplying the size of the discharge determination region R1 for the central position P31 by the magnification M1. Thereby, the discharge determination region R1 corresponding to the size of the processing liquid in the captured image data can be set.

In addition, the installation unit 92 may adjust the relative position of the discharge determination region R1 with respect to the region of the first nozzle 30 . For example, the smaller the magnification M1 is, the closer the position of the discharge determination region R1 is set to the first nozzle 30 . That is, it is preferable that the smaller the magnification M1 is, the higher the discharge determination region R1 is set. Thereby, the setting relative relationship between the first nozzle 30 and the discharge determination region R1 can be appropriately set according to the magnification M1. The setting unit 92 stores the set relative relationship with respect to the peripheral edge position P32 in the storage medium.

The same applies to other stop positions of the first nozzle 30 , and the same applies to the second nozzle 60 and the third nozzle 65 .

＜Inspection processing＞ It is also possible to perform a check process that judges whether or not the setting information (set coordinate position and set relative relationship) set by the setting process is appropriate. FIG. 13 is a flowchart showing an example of inspection processing. First, the video camera 70 starts imaging of an imaging area (step S31: start of inspection imaging step). Next, the processing control unit 93 stops each of the first nozzle 30, the second nozzle 60, and the third nozzle 65 at each stop position, and discharges the processing liquid at each stop position (step S32: recipe checking step). For example, the nozzle moving mechanism 37 moves the first nozzle 30 from the standby position P33 to the peripheral position P32 and stops at the peripheral position P32. When the first nozzle 30 stops at the peripheral edge position P32, the valve 35 is opened, and the first nozzle 30 discharges the processing liquid. Next, when the valve 35 is closed, the discharge of the treatment liquid from the first nozzle 30 is stopped. Thereafter, the processing liquid is discharged while the first nozzle 30 is stopped at each stop position. The same applies to the second nozzle 60 and the third nozzle 65 .

The processing control unit 93 stores in advance the timing at which each nozzle is at each stop position and the timing at which the processing liquid is discharged in the storage medium based on the control signals output to the nozzle moving mechanism and the valve.

Next, the video camera 70 finishes shooting (step S33: end of checking shooting step). Since the inspection and photographing step using the camera 70 is performed in parallel with the recipe inspection step, a plurality of photographed image data includes each nozzle that ejects the processing liquid at each stop position.

Next, the setting unit 92 judges whether the set coordinate position and the set relative relationship have been properly set (step S34: checking step). First, the setting unit 92 specifies the captured image data including each nozzle stopped at each stop position based on the acquisition time and the time when it is stored in the storage medium. Furthermore, the setting unit 92 specifies the captured image data including each nozzle that discharges the processing liquid at each stop position, based on the acquisition time and the time when it is stored in the storage medium.

Next, the setting unit 92 monitors the position of each nozzle and the discharge of the processing liquid in the inspection recipe step based on the captured image data. The monitoring of the position of each nozzle is performed by the same process as the position monitoring step (step S22), and the monitoring of the discharge state of the nozzle is performed by the same process as the discharge monitoring step (step S23).

If the setting unit 92 detects that the position of the nozzle is abnormal, it determines that the setting coordinates of the nozzle and the stop position for which the position of the nozzle is detected are not properly set. At this time, the setting unit 92 notifies the operator via the user interface 90 that the setting coordinate position of the stop position of the nozzle is appropriately set.

Furthermore, if the setting unit 92 detects abnormality in the discharge of the processing liquid, it determines that the relative position between the nozzle and the stop position where the abnormal discharge of the processing liquid is detected is not properly set. The setting unit 92 notifies the operator via the user interface 90 that the setting relative relationship of the stop position of the nozzle is not properly set.

If the operator recognizes the notification that the setting information is not properly set, the setting information can be reset by executing the setting process again. In this case, it is preferable to reset only the setting information that is not properly set. For example, in the input step, only the nozzle and stop position to be reset can be input. Alternatively, the operator may use the user interface 90 to manually reset only the setting information that has not been properly set.

＜Disposal Cup＞ In the above-mentioned example, the first nozzle 30 , the second nozzle 60 , and the third nozzle 65 have been illustrated as examples of the objects to be monitored moving in the chamber 10 . However, the processing cup 40 may also be used as the object to be monitored. The inner cup 41 , the middle cup 42 and the outer cup 43 of the processing cup 40 are raised and lowered between the upper position and the lower position by the cup moving mechanism 59 . Hereinafter, for simplification of description, the outer cup 43 will be described.

The monitoring processing unit 91 monitors the state of the processing cup 40 in the captured image data. Here, specifically, the camera 70 takes pictures of the shooting area in the state where the outer cup 43 is raised to the upper position in advance to obtain captured image data, and captures a part of the outer cup 43 (such as the outer cup) included in the captured image data. 43) is pre-stored in a storage medium as reference image data RI2 (see also FIG. 8).

Then, the monitoring processing unit 91 detects the coordinate position of the outer cup 43 by matching the captured image data acquired in the recipe processing step (step S5 ) with the reference image data RI2 . The monitoring processing unit 91 calculates the difference between the coordinate position of the outer cup 43 and the set coordinate position of the position above the outer cup 43, and detects that the position of the cup is abnormal when the difference is greater than the allowable value.

In addition to this, the set coordinate position of the cup 43 is also set by the setting process. Specifically, in the recipe setting step (step S12 ), the cup moving mechanism 59 moves the outer cup 43 from the lower position to the upper position, and stops at the upper position for a predetermined time. Then, in the position setting step (step S14), the setting unit 92 specifies the captured image data including the cup 43 stopped at the upper position according to the control signal to the cup moving mechanism 59, and uses the captured image The data is matched with the template of the reference image data RI2 to detect the coordinate position of the outer cup 43 . The setting unit 92 stores the coordinate position in the storage medium as the set coordinate position with respect to the position above the outer cup 43 .

Thereby, the setting coordinate position of the outer cup 43 can also be automatically set, and the time required for setting processing can be shortened. The middle cup 42 and the inner cup 41 are also the same.

As mentioned above, although the substrate processing method and the substrate processing apparatus 100 were demonstrated in detail, the above-mentioned description is an illustration in every aspect, and this substrate processing apparatus is not limited to this. It should be understood that countless modifications that are not illustrated can be conceived without departing from the disclosed scope of the present invention. The respective configurations described in the above-mentioned embodiments and modifications may be appropriately combined or omitted as long as they do not contradict each other.

In the above-mentioned example, although the installation process is performed when the substrate processing apparatus 100 is installed, for example, when the posture of the camera 70 changes due to a person's hand colliding with the camera 70, the installation process may be performed. The reason is that if the posture of the camera 70 changes, the coordinate positions of the nozzles in the captured image data will change.

In addition, in the above-mentioned example, although one first nozzle 30 was attached to the front end of the nozzle arm 32, a plurality of first nozzles 30 may be attached. In this case, the plurality of first nozzles 30 move integrally. In this case, in the input step (step S11 ), the operator inputs the information of the plurality of first nozzles 30 attached to the nozzle arm 32 to the user interface 90 . For example, the setting unit 92 may detect the coordinate position of each first nozzle 30 in the set image data including the plurality of first nozzles 30 stopped at the central position P31, and set each coordinate position as the set coordinate position. That is, regarding the center position P13, the set coordinate position is set individually for each first nozzle 30 . The same applies to other stop positions. In addition, the same is true for setting the relative relationship, which may be set individually for each first nozzle 30 . The same applies to the second nozzle 60 and the third nozzle 65 .

In addition, in the above-mentioned setting process, although the setting information is set for one processing unit 1 , the setting information may be set for a plurality of processing units 1 belonging to the substrate processing apparatus 100 .

1: Processing unit 9: Control Department 10: chamber 11: side wall 12: top wall 13: bottom wall 14: Fan filter unit 15: Partition board 18: exhaust pipe 20: Substrate holding (spinning chuck) 21: Rotating base 21a: upper surface 22:Rotary motor 23: cover member 24: Rotation axis 25: collar-shaped member 26: pinch 30,60,65: Monitoring object (nozzle) 31: spit head 32: Nozzle arm 33: Nozzle abutment 34: supply pipe 35: valve 36: Treatment liquid supply source 37: Moving mechanism (nozzle moving mechanism) 40: Surveillance object (processing cup) 41: inner cup 42: medium cup 43: outer cup 43a: lower end 43b: upper end 43c: Turn back part 44: bottom 45: inner wall 46: Outer wall 47: The 1st Guidance Department 47b: upper end 48: Middle wall 49: Abandoned ditch 50: Inner recovery ditch 51: Outer recovery ditch 52: The 2nd Guidance Department 52a: lower end 52b: upper end 52c: Turning part 53: Treatment liquid separation wall 59: Moving mechanism (cup moving mechanism) 60: No. 2 nozzle 61, 66: spit out the head 62, 67: nozzle arm 63, 68: nozzle abutment 65: No. 3 nozzle 70: Camera 71: Lighting department 90: User Interface 91: Surveillance and processing department 92: Setting department 93: Processing Control Department 100: Substrate processing device 102: Indexing robot 103: Main transport robot C: vehicle CX: axis of rotation LP: load port P31, P61, P66: central position P32, P34, P61, P63, P67, P69: peripheral position P33, P62, P68: standby position R1: Spit out the judgment area RI1: Reference Image Data RI2: Reference image data W: Substrate

FIG. 1 is a diagram schematically showing an example of the overall configuration of a substrate processing apparatus. FIG. 2 is a plan view schematically showing an example of the configuration of a processing unit. Fig. 3 is a side view schematically showing an example of the configuration of a processing unit. Fig. 4 is a plan view schematically showing an example of a moving path of a nozzle. Fig. 5 is a functional block diagram showing an example of the internal configuration of the control unit. Fig. 6 is a flowchart showing an example of the operation of the processing unit. FIG. 7 is a flowchart showing an example of setting processing. FIG. 8 is a diagram schematically showing an example of captured image data. FIG. 9 is a flowchart showing a specific example of monitoring processing. FIG. 10 is a diagram schematically showing an example of captured image data. Fig. 11 is a diagram schematically showing the size of the first nozzle in the captured image data. FIG. 12 is a diagram schematically showing an example of the ejection determination region R1 in the captured image data. FIG. 13 is a flowchart showing an example of inspection processing.

Claims (8)

A method for setting setting information for substrate processing monitoring, which includes: a setup recipe step, which controls a moving mechanism that moves a first monitoring object in a substrate processing apparatus, so that the first monitoring object moving to the first stop position; setting a shooting step, which is executed in parallel with the above-mentioned setting recipe step, and shooting the above-mentioned first monitoring object by the camera; The first image data obtained and including the first image data of the first monitoring object stopped at the first stop position and the first reference image data representing at least a part of the first monitoring object are used to detect the first image The position of the above-mentioned first monitoring object in the image data, and set this position as an appropriate position related to the above-mentioned first stop position; The acquisition time of the image data is determined by specifying the above-mentioned first object including the above-mentioned first monitoring object stopped at the above-mentioned first stop position among the above-mentioned plurality of image data sequentially obtained by the above-mentioned camera in the above-mentioned setting and shooting step. 1 image data. The method for setting setting information for substrate processing monitoring according to claim 1, wherein, in the step of setting the recipe, the nozzles that supply the processing liquid to the main surface of the substrate held in the substrate processing device are used as the first monitoring Object, and make it move to the above-mentioned 1st stop position. The method for setting setting information for substrate processing monitoring according to claim 2, wherein, in the step of setting the recipe, the nozzles are sequentially moved to the first stop position, and at least in the depth direction when viewed from the camera A second stop position different from the first stop position, and the setting step includes: a detection step based on the second stop position of the nozzle that is stopped at the second stop position and obtained by the camera in the setting and shooting step 2 image data, and the above-mentioned first reference image data, to detect the position and size of the nozzle in the above-mentioned second image data; The position and size of the above-mentioned nozzles in the above-mentioned first relative relationship predetermined in advance, and the magnification of the size of the above-mentioned nozzles in the above-mentioned second image data relative to the size of the above-mentioned nozzles in the above-mentioned first image data are set. A second relative relationship that defines the discharge determination area with respect to the position and size of the nozzle in the second image data. The method for setting setting information for substrate processing monitoring according to claim 1, wherein, in the step of setting the recipe, the processing cup surrounding the substrate holding part in the substrate processing device is used as the first monitoring object, so that It moves in the vertical direction and stops at the above-mentioned first stop position. The method for setting the setting information for substrate processing monitoring according to claim 1, wherein, In the above step of setting the recipe, the first monitoring object is sequentially moved to the above first stop position and the second stop position different from the above first stop position, and in the above setting step, photographing according to the above setting The second image data of the first monitoring target object stopped at the second stop position and the first reference image data acquired in the step are used to detect the first surveillance image in the second image data. position of the object, and set this position as an appropriate position relative to the above-mentioned second stop position. The method for setting setting information for substrate processing monitoring according to Claim 1, wherein, in the step of setting the recipe, the second monitoring object different from the first monitoring object in the substrate processing apparatus is moved to the second monitoring object 3. The stop position, and in the above-mentioned setting step, based on the third image data obtained in the above-mentioned setting and shooting step and including the above-mentioned second surveillance object stopped at the above-mentioned third stop position, and the data representing the above-mentioned second surveillance object The second reference image data of at least a part of the object to detect the position of the second monitoring object in the third image data, and set the position as the third stop position relative to the second monitoring object relevant appropriate location. A monitoring method of a substrate processing device, comprising: a setting step of setting the setting information for substrate processing monitoring described in Claim 1; a holding step of holding a substrate by a substrate holding part in the substrate processing device ; A processing recipe step, which controls the moving mechanism in a state where the substrate holding part holds the substrate, so as to move the first monitoring object to the first stop position; a processing and photographing step of photographing the first monitoring object by the camera in parallel with the processing of the recipe; 1 The fourth image data of the first monitoring object at the stop position and the first reference image data to detect the position of the first monitoring object in the fourth image data, and based on the above-mentioned 1 Stop the above appropriate position related to the position to judge whether the position is appropriate. A substrate processing device, which processes substrates; it is equipped with: a chamber; a moving mechanism, which moves an object to be monitored in the chamber to a predetermined stop position; a camera, which takes pictures of an area including the object to be monitored to obtain image data; a storage medium storing reference image data representing at least a part of the monitoring object; The above-mentioned image data and the above-mentioned reference image data are used to detect the position of the monitoring object in the above-mentioned image data, and set this position as an appropriate position related to the above-mentioned stop position; The timing of outputting the control signal and the acquisition timing of the plurality of image data are used to determine the image of the monitoring object stopped at the stop position among the plurality of image data sequentially acquired by the camera material.

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