JPH11168078A - Substrate treatment equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suitably separate and recover a plural kinds of treatment liquids supplied to the lower surface of a substrate. SOLUTION: A substrate W is isolated from the oppositely facing surface of a spin base 1 and held. From a treating liquid supplying part 4 installed on the facing surface of the spin base 1, a plural kinds of treatment liquids are selectively supplied toward the vicinity of the rotation center of the lower surface of the substrate W. Around the substrate W held, a guide member 6 in which a chemical liquid guiding part 60 and a waste solution guiding part 61 are formed is arranged and is made capable of freely ascending and descending. When the chemical liquid is supplied to the substrate W, the chemical liquid guiding part 60 is positioned on the side part of the substrate W, and the chemical liquid after the treatment is recovered through the chemical liquid guiding part 60, a chemical liquid recovering vessel 54 of a treatment cup 5, a chemical liquid recovering port 50 and a chemical liquid recovering pipe 52. When pure water is supplied to the substrate W, the waste solution guiding part 61 is positioned on the side part of the substrate W, the waste solution after treatment is recovered through a waste solution guiding part 61, a waste liquid recovering vessel 55, a waste liquid recovering port 51, and a waste solution pipe 56.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for individually supplying a plurality of types of processing liquids to the lower surface of a substrate while rotating the substrate and performing substrate processing with the respective processing liquids. The present invention relates to a technique for suitably separating and recovering each type of treatment liquid after use in the above.

[0002]

2. Description of the Related Art FIG. 10 shows an example of a conventional substrate processing apparatus of this type. The apparatus shown in FIG. 10 is an apparatus for performing a cleaning process using a chemical solution or pure water on the substrate W, and has a function of separating and collecting the processed chemical solution and waste liquid.

This apparatus comprises a spin chuck 500 rotatable around a vertical axis J while holding a substrate W in a horizontal position, and a spin chuck 5 via a rotary shaft 501.
00, a motor 503 for rotating the substrate W, a cup 503 surrounding the substrate W to be processed to form a processing chamber, and a processing liquid such as a chemical solution or pure water supplied to the substrate W from obliquely above or below. Nozzles 504a, 504b,
504c and 504d.

A spin chuck 500 is shown in FIGS.
As shown in the figure, the rotating part 500 connected to the rotating shaft 501
A spin base 500c has three or more arms 500b extending radially from a. Each arm 500b
A substrate holding member 500d for holding the substrate W is provided upright in the vicinity of the tip of the substrate holding member 500d.
The outer peripheral portion of the substrate W is held at three or more positions by d.

[0005] At the bottom of the cup 503, a discharge port 505 for discharging a liquid used for cleaning the substrate W is formed. The inner wall surface of the cup 503 receives the cleaning liquid scattered from the rotating substrate W during processing and guides the cleaning liquid to the discharge port 505.

[0006] A discharge port 50 is provided below the cup 503.
5 has a substantially disk-shaped gutter member 507 having a ring-shaped gutter groove 506, and a protective cylinder 508 surrounding the rotating shaft 501.
Is mounted to be rotatable. A drain outlet 509 is formed at a predetermined location on the bottom of the gutter groove 506. A ring gear 510 is fixed to the outer periphery of the gutter member 507, and a drive gear 512 attached to a drive shaft of a motor 511 meshes with the ring gear 510. Further below the gutter member 507, a waste liquid recovery drain 513 for recovering waste liquid used in the cleaning processing and a chemical liquid recovery drain 514 for recovering the cleaning liquid after the cleaning processing are provided.

By driving the motor 511 with such a configuration, the drainage outlet 50 of the gutter member 507 is
9 is a waste liquid collecting drain 513 or a chemical liquid collecting drain 5
14 can be selectively positioned above any of the fourteen. Then, for example, when supplying a chemical solution to the substrate W,
By positioning the drain outlet 509 above the chemical recovery drain 514, the chemical can be recovered for reuse. On the other hand, for example, when supplying pure water to the substrate W in order to wash away the chemical solution attached to the substrate W with pure water, the drainage flow outlet 509 is connected to the wastewater collecting drain 513.
, Waste liquid (pure water mixed with a chemical solution) after being used for the cleaning process can be discarded.

[0008]

However, in the conventional apparatus having the above-described structure, the following problem arises when the cleaning liquid is supplied to the lower surface of the substrate W held by the spin chuck 500 for processing.

That is, a chemical solution or pure water supplied diagonally from the lower side of the substrate W toward the lower surface of the substrate W is drained by the arm 500b of the spin base 500c, and most of the liquid is turned into mist. The processing chamber in the cup 503 will float. As a result, the misted chemical liquid cannot be effectively collected, and the wasteful consumption of the chemical liquid increases. Further, at the time of collecting the chemical solution, the mist of pure water easily mixes with the collected chemical solution in the cup 503, and the concentration of the collected chemical solution decreases as the processing is repeated. It will decrease.

Further, in the conventional apparatus, the recovery path from the cup 503 to the drainage outlet 509 of the gutter member 507 via the outlet 505 is common to the chemical liquid to be recovered for reuse and the waste liquid to be discarded. Therefore, mixing of the two liquids in this recovery path cannot be avoided, resulting in incomplete separation and recovery of the chemical liquid and the waste liquid. As a result, when collecting the waste liquid, the droplets of the chemical adhering to the common collection path are discarded together with the pure water used for the cleaning process, so that the amount of the chemical liquid that can be effectively collected is reduced by that much, and the amount of the chemical liquid is reduced. Unnecessary consumption will increase. Also, when collecting chemicals,
Pure water adhering to the common recovery path mixes with the chemical solution to be collected, so that the concentration of the collected chemical solution decreases as the processing is repeated, and the treatment capacity with the chemical solution gradually decreases. .

[0011] The above-mentioned inconvenience is not limited to the case where two types of liquids are separated and collected, but may also occur when three or more types of liquids are separated and collected.

The present invention has been made in view of such circumstances, and has as its object to provide a substrate processing apparatus capable of suitably separating and recovering a plurality of types of processing liquid supplied to the lower surface of a substrate. And

[0013]

The present invention has the following configuration in order to achieve the above object. That is, according to the first aspect of the present invention, while rotating the substrate,
In a substrate processing apparatus for individually supplying a plurality of types of processing liquids to a lower surface of a substrate and performing substrate processing with the respective processing liquids, a spin base having a facing surface facing the lower surface of the substrate; Substrate holding means for holding a substrate in a state where the lower surface of the spin base is separated from the opposing surface of the spin base; rotating means for rotating the substrate holding means for holding the spin base and the substrate; A processing liquid supply unit that is provided on the surface and selectively supplies a plurality of types of processing liquid toward the vicinity of the center of rotation of the lower surface of the substrate held by the substrate holding means; A plurality of recovery paths provided in, and provided separately corresponding to the type of the processing liquid, receiving the processing liquid scattered from the substrate to be rotated on the side of the substrate held by the substrate holding means So A plurality of guides for guiding the recovery path corresponding to the processing liquid, and the processing liquid scattered from the substrate to be rotated is held by the substrate holding means so as to be received by the guide corresponding to the type of the processing liquid. And a position adjusting means for adjusting a positional relationship between the substrate and each guide portion.

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, when the processing liquid is supplied from the processing liquid supply unit to a lower surface of the substrate held by the substrate holding means, The substrate is rotated at a rotation speed of 10 rpm or more.

[0015]

The operation of the present invention is as follows. The substrate holding means holds the substrate with the lower surface of the substrate separated from the opposing surface of the spin base. In the holding state of the substrate, the substrate held by the substrate holding unit is rotated by the rotating unit together with the spin base and the substrate holding unit.

A plurality of types of processing liquids are selectively supplied from a processing liquid supply section provided on the opposite surface of the spin base toward the vicinity of the rotation center of the lower surface of the substrate being rotated.
Substrate processing is performed.

Since the lower surface of the substrate is held away from the opposing surface of the spin base with its lower surface facing the opposing surface of the spin base, the processing liquid supply unit provided on the opposing surface of the spin base is used to hold the lower surface of the substrate. The processing liquid supplied toward the vicinity of the rotation center can be entirely supplied to the substrate without any obstacle.

The processing liquid supplied near the center of rotation on the lower surface of the substrate is spread over the entire lower surface of the substrate by the rotation of the substrate, is shaken off from the outer peripheral portion of the substrate, and is scattered to the side of the substrate.

Prior to supplying the processing liquid to the vicinity of the rotation center on the lower surface of the substrate, the processing liquid scattered from the rotated substrate is received by the guide portion corresponding to the type of the processing liquid by the position adjusting means. In addition, the positional relationship between the substrate held by the substrate holding means and each guide portion is adjusted.

Therefore, the processing liquid scattered laterally from the rotated substrate is received by the guide corresponding to the type of the processing liquid, guided to the recovery path corresponding to the type of the processing liquid, and collected. Collected via road.

When the type of the processing liquid supplied near the center of rotation on the lower surface of the substrate is changed, the liquid is scattered from the substrate to be rotated by another guide portion corresponding to the type of the processing liquid by the position adjusting means. The positional relationship between the substrate held by the substrate holding means and each guide portion is adjusted so that the processing liquid is received. Then, the processing liquid is received by the guide portion corresponding to the type of the processing liquid, and guided to a recovery path corresponding to the type of the processing liquid, and is recovered.

That is, the recovery path of the processing liquid after being scattered from the rotating substrate is a guide portion and a recovery path provided separately for each type of processing liquid, and each type of processing liquid is collected on the recovery path. Do not mix.

According to the second aspect of the present invention, when the processing liquid is supplied from the processing liquid supply unit to the lower surface of the substrate held by the substrate holding means, the substrate is rotated at a rotation speed of 10 rpm or more. The processing liquid supplied to the lower surface of the substrate quickly spreads to the lower surface of the substrate, and the processing of the lower surface of the substrate can be effectively performed. Further, it is possible to prevent the processing liquid supplied to the lower surface of the substrate from dropping on the opposing surface of the spin base, and to prevent the spin base from being contaminated with the processing liquid. In particular, when the treatment liquid is a chemical liquid, if the chemical liquid falls on the opposing surface of the spin base, the spin base is contaminated, and during the subsequent processing, the space between the opposing surface of the spin base and the lower surface of the held substrate. Although the atmosphere of the chemical solution remains and the substrate is contaminated with the chemical solution, by rotating the substrate at a rotation speed of 10 rpm or more as described above, the chemical solution does not drop onto the opposing surface of the spin base. This prevents contamination of the substrate with the chemical solution.

[0024]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal sectional view showing a configuration of a substrate processing apparatus according to one embodiment of the present invention.

The apparatus of this embodiment is an apparatus for performing a cleaning process using a chemical solution or pure water on a substrate W, and is rotatable around a vertical axis J while holding the substrate W in a horizontal posture. A spin chuck 1, a rotation driving mechanism 2 as a rotating means for rotating the spin chuck 1, and a nozzle 3 a for supplying a processing liquid such as a chemical solution or pure water to the upper surface of the substrate W held by the spin chuck 1. 3b, a processing liquid supply unit 4 for selectively supplying a plurality of types of processing liquids, such as a chemical liquid and pure water, to the vicinity of the rotation center of the lower surface of the substrate W held by the spin chuck 1, and a chemical liquid recovery A processing cup 5 provided with a port 50 and a waste liquid recovery port 51;
And a guide member 6 in which a waste liquid guide portion 61 is formed, and an elevating drive mechanism 7 as a position adjusting means for elevating the processing cup 5 and the guide member 6.

The spin chuck 1 is housed in a processing chamber 8. The processing chamber 8 is formed by the processing cup 5 and a guide member 6 that can move up and down with respect to the processing cup 5. A rotating shaft 11 is provided so as to penetrate the center of the bottom surface of the processing cup 5, and at the upper end of the rotating shaft 11,
A disk-shaped spin base 12 having a facing surface facing the lower surface of the substrate W is attached so as to be integrally rotatable.

On the upper surface, which is the above-mentioned facing surface of the spin base 12, three or more substrate holding members 13 as substrate holding means for holding the outer peripheral portion of the substrate W at three or more locations are provided on the periphery of the spin base 12. It is erected at regular intervals along. In FIG. 1, in order to avoid complication of the drawing,
Only one substrate holding member 13 is shown.

Each of the substrate holding members 13 includes a substrate supporting portion 13a for supporting the outer peripheral portion of the substrate W from below, and a substrate supporting portion 13a.
And a substrate holding portion 13b for holding the substrate W by pressing the outer peripheral end surface of the substrate W supported by the
The substrate W is configured to be separated from the upper surface of the substrate 2 and held in a horizontal posture. Each substrate holding member 13 is configured to be switchable between a holding state in which the substrate holding portion 13b presses the outer peripheral end surface of the substrate W and a non-holding state in which the substrate holding portion 13b separates from the outer peripheral end surface of the substrate W. The switching between the holding state and the non-holding state is performed, for example, in Japanese Patent Publication No. 3-9607.
This is realized by a link mechanism disclosed in Japanese Unexamined Patent Publication (Kokai) No. H10-26095.

At the center of the rotating shaft 11, a processing liquid supply pipe 40
The upper end of the processing liquid supply pipe 40 is the processing liquid supply section 4. In the vicinity of the lower end of the rotary shaft 11, a rotary drive mechanism 2 including a motor 20 as a drive source is linked and connected. With the rotation drive mechanism 2 rotating the substrate W held on the spin chuck 1 together with the spin chuck 1 and the substrate holding member 13, a chemical solution or pure water is supplied from the nozzles 3 a, 3 b or the processing liquid supply unit 4. By supplying, the substrate W is cleaned.

A chemical liquid or pure water is supplied to the nozzles 3a and 3b and the processing liquid supply unit 4 from a processing liquid supply mechanism 9. As shown in FIG. 2, the processing liquid supply mechanism 9 includes a chemical tank 90 for storing a chemical liquid.
And a pure water supply unit (such as a factory utility) 91 for supplying pure water. A chemical recovery pipe 52 connected to a chemical recovery port 50 of the processing cup 5 is connected to the chemical tank 9.
0, and is configured so that the chemical solution collected after being used for processing is stored in the chemical solution tank 90 and reused.

The chemical tank 90 has a circulation pipe 95a in which a pump 92, a filter 93a, and an on-off valve 94a are interposed.
And a circulation pipe 95b in which a pump 92, a filter 93b, and an on-off valve 94b are interposed.

A chemical supply pipe 97a having an open / close valve 96a is connected to the circulation pipe 95a. The chemical supply pipe 97a is connected to the nozzle 3a. When the chemical is not supplied from the nozzle 3a, the on / off valve 94a is opened, the on / off valve 96a is closed, and the pump 92 is pumped, and the chemical in the chemical tank 90 is circulated through the circulation pipe 95a to remove impurities by the filter 93a. It is supposed to be. When supplying the chemical from the nozzle 3a, the on-off valve 94a is closed and the on-off valve 96a is opened,
The chemical solution in the chemical solution tank 90 that has been pressure-fed to the pump 92 is ejected from the nozzle 3a.

The circulation pipe 95b has an on-off valve 96b.
Is connected to and connected to a chemical solution supply pipe 97b. The chemical supply pipe 97b is connected to the processing liquid supply pipe 40. When the chemical liquid is not supplied from the processing liquid supply unit 4, the on-off valve 94b is opened, the on-off valve 96b is closed, and the chemical liquid in the chemical liquid tank 90 is circulated through the circulation pipe 95b by the filter 93b. When the chemicals are supplied from the processing liquid supply unit 4 after the impurities are removed, the opening / closing valve 94b is closed and the opening / closing valve 96b is opened, and the chemical in the chemical liquid tank 90 that has been pressure-fed to the pump 92 is discharged from the processing liquid supply unit 4. It is squirting.

The pure water supply section 91 is connected to a pure water supply pipe 99a provided with an on-off valve 98a and a pure water supply pipe 99b provided with an on-off valve 98b. The pure water supply pipe 99a is connected to the nozzle 3b in communication with the nozzle 3b, and the opening and closing of the on-off valve 98a switches between the jet of pure water from the nozzle 3b and the stop thereof. Also,
The pure water supply pipe 99b is connected to the processing liquid supply pipe 40 so that the opening and closing of the open / close valve 98b switches between the injection of pure water from the processing liquid supply unit 4 and the stop thereof. Note that, by selectively switching the opening of the on-off valves 96b and 98b, the supply of the chemical liquid and the pure water from the processing liquid supply unit 4 to the lower surface of the substrate W can be selectively performed.

Returning to FIG. 1, the processing cup 5 is a substantially cylindrical container having a bottom, and a cylindrical partition member 53 is provided on the bottom surface.
Are formed to protrude upward. This allows
A donut-shaped chemical liquid recovery tank 54 is formed between the partition member 53 and the side wall 5 a of the processing cup 5 in a plan view, and a substantially cylindrical waste liquid recovery tank 55 is formed inside the partition member 53. The chemical liquid collecting tank 54 is a tank for collecting a chemical liquid used for the treatment, and has a chemical liquid collecting port 50 connected to a chemical liquid collecting pipe 52 at a bottom surface thereof. Further, the waste liquid collecting tank 55 is a tank for collecting a waste liquid to be discarded like pure water used for the treatment, and a waste liquid collecting port 51 is formed on a bottom surface thereof. A waste liquid pipe 56 is connected to the waste liquid recovery port 51, and
The waste liquid collected through the waste liquid pipe 56 is disposed.

The guide member 6 has a substantially rotationally symmetric shape with respect to an axis J passing through the center of the rotating shaft 11. And
It is attached to a cylindrical support member 70 surrounding the processing cup 5. The cylindrical support member 70 is moved up and down by a lifting drive mechanism 7, whereby the guide member 6 can be moved up and down with respect to the spin chuck 1.

The guide member 6 has an inner wall surface 6a having a rotationally symmetric shape with respect to the rotation shaft 11. On the inner wall surface 6a, a laterally protruding portion 62 protruding inward toward the spin chuck 1 is formed at a position separated from the lower end by a predetermined distance upward. The lateral projection 62 divides the inner wall surface 6a of the guide member 6 into a lower chemical solution guide portion 60 and an upper waste solution guide portion 61. In other words,
The lateral projection 62 is formed at the boundary between the chemical liquid guide 60 and the waste liquid guide 61. The chemical liquid guiding section 60 is a part for guiding the chemical liquid to be collected for reuse to the chemical liquid collecting tank 54, and the waste liquid guiding section 61 is a part for guiding the waste liquid to be disposed of to the waste liquid collecting tank 55. .

A tongue portion 62a that hangs downward is formed at the tip of the lateral convex portion 62 (the portion closest to the spin chuck 1). As a result, the chemical solution guide 60
As a result, a downward concave portion 63 which is depressed upward and opened downward is formed. This downward recess 63
The top surface 63a is an inclined surface formed such that the diameter decreases as going upward. A vertical cylindrical surface 63b is continued below the top surface 63a.

On the other hand, a top surface 64a is formed at an upper portion of the waste liquid guiding portion 61, and is formed of an inclined surface formed so that the diameter decreases as going upward. Is connected to a vertical cylindrical surface 64b. Therefore, the top surface 64 a, the cylindrical surface 64 b, and the upper surface of the lateral protrusion 62 form a lateral recess 64 that is depressed in a direction away from the spin chuck 1 and that opens in the direction of the spin chuck 1. . Also,
An upward convex portion 65 having a vertical cylindrical inner wall surface is formed so as to extend further upward so as to continue from the upper end side of the top surface 64a of the lateral concave portion 64.

In this embodiment, the vertical position of the spin chuck 1 is always kept constant, while the guide member 6 and the processing cup 5 are raised and lowered as necessary. Specifically, the guide member 6 has a first height (H1) at which the chemical solution guide portion 60 receives a chemical solution scattered laterally from the substrate W held and rotated by the spin chuck 1, and a spin chuck similarly. The pure water scattered to the side from the substrate W held and rotated by the liquid waste guide unit 6
1 and a third height (H3) in which the upper end 6b (see FIG. 1) of the guide member 6 is located below the substrate holding height (HW) of the spin chuck 1.
Is selectively raised and lowered to three levels. In addition, the processing cup 5 has a substrate holding height (H
W), the processing height (HP) at which the upper end 5b (see FIG. 1) is positioned at substantially the same height as the height (H),
When it is located at 3), it is selectively raised and lowered to a retreat height (HR) at which interference with the guide member 6 can be avoided.

The elevating movement of the guide member 6 and the processing cup 5 is performed by an elevating drive mechanism 7. The elevating drive mechanism 7 includes a well-known uniaxial drive mechanism (not shown) such as a ball screw. The support member 70 is moved up and down by the uniaxial drive mechanism to move the guide member 6 to the first height. The height (H1) to the third height (H3). In addition, processing cup 5
Similarly, the support member (not shown) that supports the processing cup 5 is moved up and down by a one-axis direction driving mechanism (not shown) provided in the lifting drive mechanism 7 to raise and lower the processing cup 5.
Is moved up and down between the processing height (HP) and the retreat height (HR). In addition, this device includes
A sensor for detecting that the guide member 6 is located at each height (H1, H2, H3) and the processing cup 5 are provided at each height (HP,
HR) (not shown).

FIG. 3 is a block diagram showing a configuration of a control system of the present apparatus. The rotary drive mechanism 2 for rotating and driving the spin chuck 1, a processing liquid supply mechanism 9, a guide member 6, and a processing cup 5 1 shows a configuration for controlling an elevation drive mechanism 7 for elevating the elevation. The operation of the rotation drive mechanism 2, the operation of the processing liquid supply mechanism 9, and the operation of the elevation drive mechanism 7 are controlled by the control unit 10. The control unit 10 includes sensors S1 to S3 for detecting that the guide member 6 is located at each height (H1, H2, H3) and that the processing cup 5 is located at each height (HP, HR). Output signals from the sensors S4 and S5 to be detected are given, and based on the outputs of these sensors, the control unit 10 controls the elevation drive mechanism 7 to move the guide member 6 to a desired height (H1, H2, H
3) and the processing cup 5 is controlled to be positioned at a desired height (HP, HR).

Next, the operation of the present apparatus will be described with reference to FIGS. FIG. 4 shows a state at the time of chemical treatment, and FIG.
6 shows a state at the time of rinsing processing and drying processing, and FIG. 6 shows a state at the time of loading / unloading the substrate.

First, an outline of the processing will be described. First, one substrate W is carried in by a transfer robot (not shown), and the substrate W is held by the spin chuck 1 in a horizontal posture. Thereafter, the spin chuck 1 is rotated, whereby the substrate W is rotated at a high speed around a vertical axis J passing through the center thereof. The nozzles 3a are directed toward the upper and lower surfaces or only the lower surface of the high-speed rotating substrate W.
A chemical liquid is supplied from the processing liquid supply unit 4, and a chemical liquid processing using a chemical liquid such as an etching liquid is performed. After that, pure water is supplied from the nozzle 3b and the processing liquid supply unit 4 to rinse off the chemical liquid attached to the lower (upper) surface of the substrate W (rinse processing). Then, the discharge of the pure water is stopped, and the bottom (upper) of the substrate W is stopped.
The surface is shaken off and dried (drying treatment). Thereafter, the rotation of the spin chuck 1 is stopped, and the substrate W is carried out of the apparatus by the transfer robot.

At the time of chemical treatment, as shown in FIG. 4, the processing cup 5 is at the processing height HP, and the guide member 6 is at the first height H1. In this state, the chemical solution guiding section 60 moves the substrate W
Is located on the side. All of the chemicals supplied from the processing liquid supply unit 4 are supplied to the lower surface of the substrate W without obstacles, and all of the chemicals supplied to the lower surface of the substrate W can be effectively collected. . The chemical solution supplied to the lower surface of the substrate W spreads over the entire lower surface of the substrate W by the rotation of the substrate W, and is shaken off from the outer peripheral portion and scattered around. When the chemical is supplied from the nozzle 3a, the chemical supplied from the nozzle 3a spreads over the entire upper surface of the substrate W by the rotation of the substrate W, and is shaken off from the outer peripheral portion and scattered around. Supplied to the lower (upper) surface of the substrate W,
The chemical scattered from the rotated substrate W is supplied to the chemical guide 6.
At 0, it is guided to the chemical liquid recovery tank 54, and is stored in the chemical liquid tank 80 through the chemical liquid recovery port 50 and the chemical liquid recovery pipe 52. At this time, the chemical liquid is supplied to the waste liquid guiding portion 6
Prevents spill to 1 In particular, in this embodiment,
The tongue 62a is formed at the tip of the lateral projection 62,
Since the downward concave portion 63 is formed in the upper portion of the chemical liquid guide section 60, there is no possibility that the chemical liquid received by the chemical liquid guide section 60 flows out to the waste liquid guide section 61.

On the other hand, during the rinsing process and the drying process,
As shown in FIG. 5, the processing cup 5 is at the processing height HP as in the case of the chemical liquid processing, and the guide member 6 is at the second height H2 lower than the first height H1. In this state, it spreads to the lower (upper) surface of the substrate W held by the spin chuck 1,
The processing liquid (pure water in this case) scattered to the side from the outer peripheral portion is received by the waste liquid guide 61 and the waste liquid recovery tank 5
5 and is discarded through a waste liquid recovery port 51 and a waste liquid pipe 56.

In the state shown in FIG. 5, the leading end of the partition member 53 that separates the chemical liquid recovery tank 54 and the waste liquid recovery tank 55 enters the downward recess 63 formed in the chemical liquid guide 60, so that the waste liquid guide 61 The received pure water is not guided to the chemical solution recovery tank 54. At this time, the waste liquid guide 6
The lateral recess 64 formed at 1 prevents the processing liquid received by the waste liquid guide 61 from jumping out of the apparatus.
Further, the tongue 62 a formed downward at the tip of the lateral projection 62 smoothly guides the processing liquid from the waste liquid guide 61 to the waste liquid recovery tank 55 below. Further, the upward convex portion 65 formed above the waste liquid guide portion 61 prevents splashes of the processing liquid from the substrate W from jumping out of the apparatus. In this regard, the same applies to the case where the guide member 6 is at the first height H1.

When performing the chemical treatment, the rinsing treatment, and the drying treatment, first, the substrate W is rotated at a rotation speed of 10 rpm or more, and then further rotated at a higher speed.
Accordingly, the chemical solution or pure water supplied to the lower surface of the substrate W quickly spreads to the lower surface of the substrate W, and the processing of the lower surface of the substrate W can be performed effectively. Further, it is possible to prevent the chemical solution or pure water supplied to the lower surface of the substrate W from dropping on the opposing surface of the spin base 12, and to prevent the spin base 12 from being contaminated with the chemical solution or pure water (waste liquid). it can. In particular, when the chemical drops on the opposing surface of the spin base 12,
The spin base 12 is contaminated, and the atmosphere of the chemical solution remains between the facing surface of the spin base 12 and the lower surface of the held substrate W during the subsequent processing, and the substrate W is contaminated with the chemical solution. However, such inconvenience can be prevented by rotating the substrate W at a high speed at a rotation speed of 10 rpm or more.

When the substrate W is carried into the substrate processing apparatus,
When unloading the substrate W from the substrate processing apparatus,
As shown in FIG. 6, the processing cup 5 is at the retreat height HR lower than the processing height HP, and the guide member 6 is at the second height H2.
At a third height H3 that is even lower. In this state, the upper end 6b of the guide member 6 is located at a position lower than the holding height HW of the substrate W held by the spin chuck 1, and the transfer of the substrate W is performed between a transfer robot (not shown) and the spin chuck 1. At this time, since the inner wall surface 6a of the guide member 6, which is the treatment liquid adhering portion, is below the substrate W, there is no possibility that the processing liquid will fall from the guide member 6 onto the substrate W when the substrate W is transferred. .

As described above, according to the present embodiment, the spin base 12 is positioned near the center of rotation on the lower surface of the substrate W held in a horizontal posture while being separated from the opposing surface of the spin base 12.
Since the processing liquid is supplied from the processing liquid supply unit 4 provided on the opposite surface of the processing liquid, all of the processing liquid supplied from the processing liquid supply unit 4 can be effectively collected. In addition, since the recovery of the chemical solution and the recovery of the pure water are performed in separate recovery paths, the inconvenience that occurs in the conventional apparatus that shares a part of the recovery path can be eliminated, and the chemical solution and the pure water can be improved. It can be separated and collected. Accordingly, all of the plurality of types of processing liquids supplied to the lower surface of the substrate W held in the horizontal posture can be preferably separated and collected.

Next, another embodiment of the present invention will be described with reference to FIG. FIG. 7 is a longitudinal sectional view showing a configuration of a substrate processing apparatus according to another embodiment of the present invention. This embodiment device also
This is an apparatus for performing a cleaning process using a chemical solution or pure water on the substrate W, but is an embodiment provided with a processing cup and a guide member having a structure different from that of the embodiment of FIG.

More specifically, in the processing cup 100, a casing 101 for accommodating the rotating shaft 11 and the rotation driving mechanism 2 is fixedly mounted at the center of the bottom surface, and cylindrical partition members 102a and 102b are provided therearound. , 102c are erected, and a chemical liquid recovery tank 54 and a waste liquid recovery tank 55 are formed by these partition members 102a to 102c. The space between the outer wall surface of the inner partition member 102a and the inner wall surface of the middle partition member 102b is the chemical solution recovery tank 54, and is between the outer wall surface of the middle partition member 102b and the inner wall surface of the outer partition member 102c. Space is a waste liquid recovery tank 55
It is.

In this embodiment, the casing 101
An exhaust tank 103 for exhausting the gas in the processing chamber 8 is formed between the outer wall surface of the inside and the inner wall surface of the inner partition member 102a. An exhaust port 105 connected to an exhaust duct 104 is provided at the bottom of the exhaust tank 103, and gas in the processing chamber 8 is discharged from the exhaust port 105 to the exhaust tank 103.
It is configured to be sucked through the.

The other components of the processing cup and the recovery paths for the chemical and waste liquids are the same as those in the above-described embodiment.

In this embodiment, the processing cup 100 is fixed together with the spin chuck 1 without moving up and down.
The lifting drive mechanism 7 is configured to raise and lower only the guide member 110.

In FIG. 7 and subsequent figures, each of the partition members 102a to 102c and the guide member 110 are shown only in cross-sectional shape in order to avoid complicating the drawing.

The guide member 110 has a cylindrical shape, and is disposed above the chemical solution recovery tank 54 and the waste liquid recovery tank 55 so as to surround the spin chuck 1 and the substrate W held by the spin chuck 1. The processing cup 100 is provided so as to be movable up and down. The guide member 110 has two inclined portions 111a and 111b whose diameter decreases as going upward.
It is formed in the place. Each inclined portion 111a, 111b
Are arranged concentrically at an interval from each other. Further, gas intake ports 112a and 112b having the same diameter R are formed at the upper ends of the inclined portions 111a and 111b. Further, vertical portions 113 and 114a are connected to the lower end of the inclined portion 111a,
Is connected to a vertical portion 114b. The inclined portions 111a and 111b are connected via vertical portions 114a and 114b, and a large number of openings 115 forming a drain guide passage are formed in the connecting portion in the circumferential direction. An annular groove 116 is formed in the guide member 110 between the vertical portion 113 and the vertical portion 114a. The groove 116 is fitted into the intermediate partition member 102b, and the vertical portions 114a and 114b are , Waste liquid recovery tank 55
The guide member 110 is arranged so as to be fitted inside.

As shown in FIG. 7, when the inclined portion 111a is located at the holding height HW of the substrate W held by the spin chuck 1, the processing liquid (chemical solution) scattered from the rotated substrate W. Is received by the inclined portion 111a, and the inclined portion 1
11a, it is guided to the chemical solution recovery tank 54 along the vertical portion 113, and is stored in the chemical solution tank 80 (see FIG. 2) through the chemical solution recovery port 50 and the chemical solution recovery pipe 52. In this embodiment, the inclined portion 111a and the vertical portion 113 of the guide member 110 constitute the chemical liquid guide 60.

As shown in FIG. 8, the inclined portion 111 is attached to the holding height HW of the substrate W held by the spin chuck 1.
When b is located, the processing liquid (pure water) scattered from the rotated substrate W is received by the inclined portion 111b, and is guided from the opening 115 to the waste liquid collecting tank 55 along the inclined portion 111b and the vertical portion 114b. , Waste liquid recovery port 51, waste liquid pipe 5
6 and discarded. In this embodiment, the inclined portion 111b, the vertical portion 114b, and the opening 115 of the guide member 110 are provided.
Constitute the waste liquid guide 61.

In this embodiment, the cylindrical rotating shaft 11
A gap between an inner wall surface of the cleaning liquid supply pipe 40 and the outer wall surface of the cleaning liquid supply pipe 40 inserted into the rotary shaft 11 is defined as a gas supply path 120. The gas supply path 120 is connected to a gas supply source 123 through a pipe 122 in which an opening / closing valve 121 is interposed. The gas supply path 120 is connected to a gas supply section 124 at the upper end of the gas supply path 120 and the upper surface of the spin base 1. , Held substrate W
Is configured to be able to supply a clean gas such as clean air or a clean inert gas (such as nitrogen gas) to a space between the gas supply unit 124 and the gas supply unit 124 during a drying process. Thus, drying of the substrate W can be promoted.

Also, in this embodiment, the nozzles 3a and 3b are omitted and the atmosphere blocking member 13 is provided above the spin chuck 1.
0 is provided. This atmosphere blocking member 130 is
And a diameter smaller than the diameter R of the gas intake ports 112a and 112b of the guide member 110, and is attached to the lower end of the cylindrical support shaft 131 so as to be integrally rotatable. The support shaft 131 is a support arm 1
32 is rotatably supported. The support shaft 131 is configured to be rotated by a motor 133, whereby the atmosphere blocking member 130 is configured to rotate around the axis J together with the support shaft 131.

Further, the support arm 132 is
4, the atmosphere blocking member 130 is configured to be brought into contact with and separated from the spin chuck 1.

A cleaning liquid supply pipe 140 penetrates through the atmosphere blocking member 130 and the support shaft 131. The cleaning liquid supply pipe 1 has the same configuration as the cleaning liquid supply pipe 40.
Chemical liquid and pure water are also selectively supplied from the processing liquid supply mechanism 9 to 40. Thus, the cleaning liquid supply unit 140a at the lower end of the cleaning liquid supply pipe 140 can selectively supply a chemical solution and pure water to the vicinity of the rotation center of the upper surface of the substrate W held by the spin chuck 1.

A gas supply path 150 is formed around the cleaning liquid supply pipe 140. The gas supply path 150 is connected to a pipe 152 in which an opening / closing valve 151 is interposed.
Is connected to the gas supply source 123 through the gas supply path 150, and supplies a clean gas from the gas supply unit 150a at the lower end of the gas supply path 150 to the space between the lower surface of the atmosphere blocking member 130 and the upper surface of the substrate W. It is configured to be able to.

Since the other structure is the same as that of the embodiment of FIG. 1, the common parts are denoted by the same reference numerals as those of FIG. 1 and their explanation is omitted.

Also in this embodiment, as in the embodiment of FIG. 1, loading of the substrate W, chemical treatment, rinsing, drying,
It operates in the order of unloading. As shown in FIG. 9, the loading and unloading of the substrate W in this embodiment is performed by lowering the guide member 110 to project the spin chuck 1 from above the guide member 110 and moving the atmosphere blocking member 130 to the upper position H.
This is performed with the atmosphere blocking member 130 and the spin chuck 1 separated from each other at H. The chemical treatment is performed in a state where the guide member 110 is located at the height position shown in FIG. 7, and the rinsing process and the drying process are performed in a state where the guide member 110 is located at the height position shown in FIG. Done. During the drying process, the gas supply units 124, 150
Gas is supplied from a to promote drying of the substrate W. Further, the atmosphere shielding member 130 is located at the lower position LH only when processing is performed on the upper surface of the substrate W, and when the processing is performed only on the lower surface of the substrate W, the atmosphere shielding member 130 is moved to the upper position HH. Is located.

According to the structure of this embodiment, the same operation and effect as those of the embodiment of FIG. 1 can be obtained.

In each of the above embodiments, the case where the collected chemicals are reused and the pure water (waste liquid) is discarded has been described. The present invention can be similarly applied to a case where a chemical solution is reused or a case where two kinds of processing liquids are separated and collected and then each processing liquid is individually discarded.

In each of the above embodiments, the case where two kinds of processing liquids are separated and collected is taken as an example.
0 may be provided with three or more guide portions so that three or more types of processing liquids can be separated and collected. However, in this case,
The number of the collection tanks corresponding to the number of the guides is set to the processing cup 5,
100 must be provided.

Further, in each of the above embodiments, the guide member 6,
The processing liquid from the substrate W is received by a predetermined guide by moving the spin chuck 1 up and down, and the guide members 6 and 11 are moved by moving the spin chuck 1 up and down.
The processing liquid may be received by a predetermined guide portion of zero. However, the configuration of each of the above embodiments in which the spin chuck 1 is not moved up and down is easier to seal the driving mechanism related to the spin chuck 1.

Further, in each of the above embodiments, an apparatus for processing a semiconductor wafer is taken as an example. However, the present invention is not limited to the apparatus for performing processing on another substrate such as a glass substrate for a liquid crystal display. The same can be applied to the device.

[0072]

As is apparent from the above description, according to the first aspect of the present invention, the substrate is held in a state separated from the opposing surface of the spin base, and is provided on the opposing surface of the spin base. Since a plurality of types of processing liquids are selectively supplied from the processing liquid supply unit toward the vicinity of the rotation center on the lower surface of the substrate, the processing liquid supplied toward the vicinity of the rotation center on the lower surface of the substrate may be obstructed. All of the processing liquid can be supplied to the substrate without any waste, and all the processing liquid supplied to the lower surface of the substrate can be effectively recovered.

Since each type of processing liquid scattered from the substrate to be rotated is collected by a separate guide portion and a recovery path, a plurality of types of processing liquid are collected on the processing liquid recovery path. Are not mixed, and each type of processing liquid can be individually collected.

Accordingly, when a plurality of types of processing liquids are individually supplied to the held lower surface of the substrate to perform the substrate processing with the respective processing liquids, all of the processing liquid supplied to the lower surface of the substrate can be effectively collected, and Each type of treatment liquid can be suitably separated and collected.

According to the second aspect of the invention, when the processing liquid is supplied from the processing liquid supply unit to the lower surface of the substrate held by the substrate holding means, the substrate is rotated at a rotation speed of 10 rpm or more. The processing liquid supplied to the lower surface of the substrate quickly spreads to the lower surface of the substrate, and the processing of the lower surface of the substrate can be effectively performed. Further, it is possible to prevent the processing liquid supplied to the lower surface of the substrate from dropping on the opposing surface of the spin base, and to prevent the spin base from being contaminated with the processing liquid. Further, when the treatment liquid is a chemical, it is possible to prevent the inconvenience that the substrate is contaminated with the chemical due to the atmosphere of the chemical remaining.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view illustrating a configuration of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating a configuration of a processing liquid supply mechanism.

FIG. 3 is a block diagram showing a configuration of a control system of the apparatus shown in FIG.

FIG. 4 is a view showing a state at the time of chemical solution processing by the apparatus of FIG. 1;

FIG. 5 is a diagram showing a state during a rinsing process and a drying process by the apparatus of FIG. 1;

FIG. 6 is a diagram showing a state of loading / unloading a substrate in the apparatus of FIG. 1;

FIG. 7 is a longitudinal sectional view showing a configuration of a substrate processing apparatus according to another embodiment of the present invention.

FIG. 8 is a diagram showing a state during a rinsing process and a drying process by the apparatus of FIG. 8;

FIG. 9 is a diagram showing a state of loading / unloading a substrate in the apparatus of FIG. 8;

FIG. 10 is a longitudinal sectional view showing a configuration of a conventional device.

FIG. 11 is a plan view showing a configuration of a spin chuck of a conventional apparatus.

[Explanation of symbols]

 1: spin chuck 2: rotation drive mechanism 4: processing liquid supply unit 5, 100: processing cup 6, 110: guide member 7: elevating drive mechanism 9: processing liquid supply mechanism 12: spin base 13: substrate holding member 50: chemical liquid Recovery port 51: Waste liquid recovery port 52: Chemical liquid recovery pipe 54: Chemical liquid recovery tank 55: Waste liquid recovery tank 56: Waste liquid pipe 60: Chemical liquid guide 61: Waste liquid guide W: Substrate

Claims (2)

[Claims] 1. A substrate processing apparatus for individually supplying a plurality of types of processing liquids to a lower surface of a substrate while rotating the substrate and performing substrate processing with the respective processing liquids, wherein a spin having a facing surface facing the lower surface of the substrate is provided. A base, a substrate holding unit provided on the spin base, the substrate holding unit holding the substrate with a lower surface of the substrate separated from an opposing surface of the spin base; and the substrate holding unit holding the spin base and the substrate. Rotating means for rotating, a processing liquid supply unit provided on the opposing surface of the spin base, for selectively supplying a plurality of types of processing liquid toward a vicinity of a rotation center of a lower surface of the substrate held by the substrate holding means A plurality of recovery paths individually provided corresponding to the type of the processing liquid; and a plurality of collecting paths individually provided corresponding to the type of the processing liquid, the processing liquid being scattered from the substrate being rotated. A plurality of guide portions that are received on the side of the substrate held in the stage and guide the recovery solution corresponding to the processing liquid, and a guide corresponding to the type of the processing liquid that is scattered from the rotating substrate. And a position adjusting means for adjusting the positional relationship between the substrate held by the substrate holding means and each of the guides so as to be received by the part. 2. The substrate processing apparatus according to claim 1, wherein when the processing liquid is supplied from the processing liquid supply unit to a lower surface of the substrate held by the substrate holding means, the substrate is rotated at a rotation speed of 10 rpm or more. A substrate processing apparatus characterized by rotating.