CN102601739A - Device and method for classifying and recovering waste grinding fluid and deionized water - Google Patents
Device and method for classifying and recovering waste grinding fluid and deionized water Download PDFInfo
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- CN102601739A CN102601739A CN201110123661XA CN201110123661A CN102601739A CN 102601739 A CN102601739 A CN 102601739A CN 201110123661X A CN201110123661X A CN 201110123661XA CN 201110123661 A CN201110123661 A CN 201110123661A CN 102601739 A CN102601739 A CN 102601739A
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- deionized water
- grinding
- lapping liquid
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- groove
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The invention relates to a structure and a method for recovering waste grinding fluid in the field of semiconductor manufacturing, in particular to a structure and a method for classifying and recovering the waste grinding fluid. A plurality of collection devices are sleeved on a grinding rotary plate to distinguish different waste fluids and recover or classify the waste fluid, so that the collected waste fluid is higher in concentration, and recovery efficiency can be improved while cost is saved.
Description
Technical field
The present invention relates generally to that a kind of in the field of semiconductor manufacture reclaims the device and method of discarded lapping liquid and deionized water, more precisely, the present invention relates to a kind of be used to classify reclaim the device and method of discarded lapping liquid and deionized water.
Background technology
Along with the increase of the semiconductor subassembly live width finding and the number of plies, the planarization processing procedure has been indispensable, and especially grinding technics is paid attention to by the technical staff all the more; But liquid such as employed lapping liquid and deionized water in process of lapping; Normally mix and be discharged in the pipeline, especially when the lapping liquid composition not simultaneously, the waste liquid of discharge is recycled through being difficult to more; Thereby improved cost recovery; And the efficient that reclaims also reduces greatly, causes unnecessary waste, and the liquid of rotation at a high speed is prone to be splashed on other equipment.
Current milling apparatus; Grinding wafer equipment for example; General constitute by the devices such as grinding pad, fluid Supplying apparatus and wafer carrier that grind rotating disk and be provided with on it at least, wherein wafer carrier fixedly wafer contact with grinding pad, and exert pressure downwards with the friction between increasing wafer lower surface and the grinding pad upper surface; Fluid Supplying apparatus spray lapping liquid or deionized water on the grinding pad upper surface and wafer around, so that wafer is carried out chemical etching or cleaning.
The invention of being correlated with it at present, only limits to collect the mixed solution of lapping liquid and deionized water; Slurry recirculation in a kind of CMP apparatus is disclosed like Chinese patent (application number CN97116136.4); A kind ofly comprise that one grinds in the CMP equipment of backing plate; Its improvement comprises: a collecting ring; It is at least in part around said backing plate, acceptance or hold said slurry when the slurry of use leaves said backing plate; One first pipeline, it can draw a said part of using slurry through its first end in said collecting ring; One mixes house steward, and it has second inlet that first inlet and that an outlet, is connected in said first pipeline is connected to a fresh slurry source, and said mixings house steward mixes and produces recycle slurry giving to the fluid of its inlet; And one second pipeline, it is connected in said mixing house steward's outlet, so that let said recycle slurry return said backing plate.This scheme need be transformed grinding rotating disk, and is bigger to the change of equipment, and what collect is the mixed liquor of lapping liquid and deionized water, can't accomplish categorised collection.
Summary of the invention
In view of the above problems; The invention provides a kind of be used to classify reclaim the device of discarded lapping liquid and deionized water; Comprise the grinding rotating disk, wherein, also comprise: the outer cover that is arranged on a said grinding rotating disk hollow cylindrical on every side; The axis coinciding of the axle center of said outer cover and said grinding rotating disk, and the inwall of said outer cover is provided with the groove of multi-layer annular.
Above-mentioned be used to classify reclaim the device of discarded lapping liquid and deionized water, wherein, every layer of said groove is provided with outage.
Above-mentioned be used to classify reclaim the device of discarded lapping liquid and deionized water, wherein, said groove internal diameter is greater than said grinding disk diameter.
Above-mentioned be used to classify reclaim the device of discarded lapping liquid and deionized water, wherein, the size of said groove and angle can be carried out accommodation.
Above-mentioned be used to classify reclaim the device of discarded lapping liquid and deionized water, wherein, also comprise the grinding pad that is fixedly set in said grinding disk upper surface.
Above-mentioned be used to classify reclaim the device of discarded lapping liquid and deionized water; Wherein, Said outer cover can go up and down to different height according to the different rotating speeds that grinds rotating disk, and is collected by the arbitrary groove in the said groove with the discarded lapping liquid or the deionized water that keep being shed on the said grinding pad.
Above-mentioned be used to classify reclaim the device of discarded lapping liquid and deionized water; Wherein, Also comprise the wafer carrier and the fluid Supplying apparatus that are arranged at said grinding pad top, the shower nozzle of said fluid Supplying apparatus sprays lapping liquid or deionized water reaches said wafer periphery on said grinding pad.
Above-mentioned be used to classify reclaim the device of discarded lapping liquid and deionized water, wherein, said wafer carrier direction of rotation is opposite with said grinding rotating disk direction of rotation.
The present invention also provide a kind of be used to classify reclaim the method for discarded lapping liquid and deionized water, wherein, may further comprise the steps:
The outer cover of one hollow cylindrical is sheathed on and grinds around the rotating disk, is provided with the groove of multi-layer annular on its inwall at least;
Go up and down said outer cover to corresponding height; In grinding rotating disk drive setting grinding pad rotating process on it; Be fixed on the wafer on the wafer carrier with grinding; Utilize fluid Supplying apparatus to pass through its shower nozzle simultaneously and spray lapping liquid on said grinding pad and said wafer periphery, collect the lapping liquid that throws away from the surface of said grinding pad because of centrifugal action through a said groove afterwards;
After grinding technics is accomplished; Go up and down said outer cover once more to another corresponding height; Utilize the shower nozzle of fluid Supplying apparatus to spray deionized water on said grinding pad and said wafer periphery, collect the deionized water that throws away from the surface of said grinding pad because of centrifugal action through another said groove.
Above-mentioned be used to classify reclaim the method for discarded lapping liquid and deionized water, wherein, every layer of said groove is provided with outage.
Above-mentioned be used to classify reclaim the method for discarded lapping liquid and deionized water, wherein, said groove internal diameter is greater than said grinding disk diameter.
Above-mentioned be used to classify reclaim the method for discarded lapping liquid and deionized water, wherein, the size of said groove and angle can be carried out accommodation.
Above-mentioned be used to classify reclaim the method for discarded lapping liquid and deionized water, wherein, said wafer carrier direction of rotation is opposite with said grinding rotating disk direction of rotation.
Above-mentioned be used to classify reclaim the method for discarded lapping liquid and deionized water; Wherein, Said outer cover can go up and down to different height according to the different rotating speeds that grinds rotating disk, and is collected by the arbitrary groove in the said groove with the discarded lapping liquid or the deionized water that keep being shed on the said grinding pad.
The present invention also provide a kind of be used to classify reclaim the method for discarded lapping liquid and deionized water, wherein, may further comprise the steps:
The outer cover of one hollow cylindrical is sheathed on and grinds around the rotating disk, is provided with the groove of multi-layer annular on its inwall at least;
Go up and down said outer cover to corresponding height; In grinding rotating disk drive setting grinding pad rotating process on it; Be fixed on the wafer on the wafer carrier with grinding; Utilize fluid Supplying apparatus to pass through its shower nozzle simultaneously and spray lapping liquid on said grinding pad and said wafer periphery, collect the lapping liquid that throws away from the surface of said grinding pad because of centrifugal action through a said groove afterwards;
After grinding technics is accomplished; Keep the height of said outer cover constant; Through changing the rotating speed of said grinding rotating disk; Utilize the shower nozzle of fluid Supplying apparatus to spray deionized water on said grinding pad and said wafer periphery, collect the deionized water that throws away from the surface of said grinding pad because of centrifugal action through another said groove.
Above-mentioned be used to classify reclaim the method for discarded lapping liquid and deionized water, wherein, every layer of said groove is provided with outage.
Above-mentioned be used to classify reclaim the method for discarded lapping liquid and deionized water, wherein, said groove internal diameter is greater than said grinding disk diameter.
Above-mentioned be used to classify reclaim the method for discarded lapping liquid and deionized water, wherein, the size of said groove and angle can be carried out accommodation.
Above-mentioned be used to classify reclaim the method for discarded lapping liquid and deionized water, wherein, said wafer carrier direction of rotation is opposite with said grinding rotating disk direction of rotation.
The present invention propose a kind of be used to classify reclaim the device and method of discarded lapping liquid and deionized water; Through grinding sheathed multilayer gathering-device on the rotating disk; Can distinguish different waste liquids also reclaims or classification processing; Make the liquid waste concentration of collection higher relatively, help improving and regain efficient and practice thrift cost.
Those skilled in the art reads the detailed description of following preferred embodiment, and with reference to after the accompanying drawing, of the present invention these are incited somebody to action obvious with otherwise advantage undoubtedly.
Description of drawings
With reference to appended accompanying drawing, to describe embodiments of the invention more fully.Yet appended accompanying drawing only is used for explanation and sets forth, and does not constitute limitation of the scope of the invention.
Fig. 1 is that the present invention is used to classify and reclaims the device sketch map of discarded lapping liquid and deionized water;
Fig. 2 is the structural representation of outer cover among the present invention;
Fig. 3 a-c is that the present invention is used to classify and reclaims the method flow diagram of discarded lapping liquid and deionized water.
The specific embodiment
Referring to shown in Figure 1; The invention provides a kind of be used to classify reclaim the device of discarded lapping liquid and deionized water; Grind rotating disk 11 sheathed hollow cylindrical outer cover 12 on every side, grinding pad 13 is fixedly installed on the upper surface that grinds rotating disk 11, and goes up and down to highly corresponding; Wafer 14 is connected on the wafer carrier 15, and contacts with grinding pad 13; Fluid Supplying apparatus 16 is arranged on the top of grinding pad 13; When grinding rotating disk 11 drive grinding pads 13 rotation grinding wafers 14; Wafer carrier 15 drives wafer 14 and also exerts pressure downwards with the 11 opposite directions rotations of grinding rotating disk; To strengthen the friction between wafer 14 and the grinding pad 13; Fluid Supplying apparatus 16 sprays lapping liquid around grinding pad 13 upper surface center of circle parts and wafer 14 through its shower nozzle 161 simultaneously, to accelerate the grinding of wafer 14; Wherein, the inwall of outer cover 12 is provided with groove 121,122 and 123, and outage 121
1, 122
1With 123
1
Be sprayed at lapping liquid on the grinding pad 13 because centrifugal action, can be thrown toward and be set in the groove 121 that grinds on the rotating disk 11, through outage 121
1Be transported in the corresponding processing means; After grinding technics is accomplished; It is residual with what in grinding technics, produce on the cleaning wafer that shower nozzle 161 sprays deionized water; Also can spray deionized water through other fluid Supplying apparatus around grinding pad 13 and wafer 14, grind formula, grind the rotating speed of rotating disk 11 through adjustment through the height or the cooperation of adjustment outer cover 12; Deionized water on the grinding pad 13 is flow in the groove 122, again through outage 122 under action of centrifugal force
1Be transported in the corresponding processing means; Also can adopt above-mentioned similar step, another kind ground waste collection in groove 123, pass through outage 123
1Be discharged in the corresponding processing device.
Further, the internal diameter of above-mentioned groove is greater than the diameter that grinds rotating disk 11, and its size and angle all can be carried out adaptive adjustment, and above-mentioned groove also can be provided with a plurality of, to meet the different needs.
Collect different waste liquids through different grooves, thereby collect the higher relatively grinding waste liquid of concentration,, also avoided the grinding waste liquid to be splashed on other equipment simultaneously to make things convenient for the processing in later stage.
Shown in Fig. 3 a, the present invention also provide a kind of be used to classify reclaim the method for grinding waste liquid, wherein, may further comprise the steps:
Hollow cylindrical outer cover 22 is set on the grinding rotating disk 21, and the height that is set to adapt; Wherein, the inwall of outer cover 22 is provided with groove 221,222 and 223, and outage 221
1, 222
1With 223
1 Grind rotating disk 21 and drive grinding pad 23 rotations that fixedly install with its upper surface, be connected to the wafer 24 on the wafer carrier 25 with grinding, wafer carrier 25 drives wafers 24 and grinds rotating disk 21 direction of rotation and rotate; Simultaneously; Fluid Supplying apparatus 26 sprays lapping liquids around the center of circle part of grinding pad 23 upper surfaces and wafer 24 through its shower nozzle 261, carrying out the grinding that chemical grinding is accelerated wafer 24 simultaneously, and because action of centrifugal force; Lapping liquid on the grinding pad 23 be thrown toward grind rotating disk 21 around; Because outer cover 22 is arranged on the height of adaptation, makes above-mentioned lapping liquid flow in the groove 221, through outage 221
1Be transported in the corresponding liquid waste treating apparatus, thereby make things convenient for the processing in later stage and utilization again.
Shown in Fig. 3 b; After grinding technics is accomplished; The outer cover 23 that can raise makes the height of groove 222 to above-mentioned groove 221 when grinding technics, and shower nozzle 261 sprays deionized water with cleaning wafer 24 and grinding pad 23, grinds rotating disk 21 and drives grinding pad 23 rotations with identical rotating speed; Make the deionized water on the grinding pad 23 be collected in the groove 222, again through outage 222
1Be transported to treating apparatus; Also can reduce simultaneously the height of outer cover, the waste liquid that grinding pad is thrown away is collected by the upper trench of the groove of collection waste liquid in the last technology.
Shown in Fig. 3 c, after grinding technics is accomplished, also can cooperate with the grinding formula; Through reducing the rotating speed that grinds rotating disk 21; Keep the height and position of outer cover 22 constant,, make that the deionized water on the grinding pad 23 is collected into (shown in Fig. 3 c) in the groove 222 through changing the size of centrifugal force; While also can be through increasing the rotating speed that grinds rotating disk, and to increase centrifugal force, the waste liquid that grinding pad is thrown away is collected by the upper trench of the groove of collection waste liquid in the last technology.
Further, the internal diameter of above-mentioned groove is greater than the diameter that grinds rotating disk 21, and its size and angle all can be carried out adaptive adjustment, and above-mentioned groove also can be provided with a plurality of, to meet the different needs.
The present invention propose a kind of be used to classify reclaim the device and method of discarded lapping liquid and deionized water; Through grinding sheathed outer cover on the rotating disk; Can not only avoid liquid splash to other equipment; Groove categorised collection different polishing liquid and the deionized water on its inside simultaneously makes the higher relatively and easy classification processing of liquid waste concentration of recovery, improved organic efficiency and practiced thrift cost.
Through explanation and accompanying drawing, provided the exemplary embodiments of the ad hoc structure of the specific embodiment, based on the present invention's spirit, also can do other conversion.Although foregoing invention has proposed existing preferred embodiment, yet these contents are not as limitation.
For a person skilled in the art, read above-mentioned explanation after, various variations and revise undoubtedly will be obvious.Therefore, appending claims should be regarded whole variations and the correction of containing true intention of the present invention and scope as.Any and all scope of equal value and contents all should be thought still to belong in the intent of the present invention and the scope in claims scope.
Claims (19)
1. one kind is used to classify and reclaims the device of discarded lapping liquid and deionized water; Comprise the grinding rotating disk; It is characterized in that; Also comprise: be arranged on the outer cover of a said grinding rotating disk hollow cylindrical on every side, the axis coinciding of the axle center of said outer cover and said grinding rotating disk, and the inwall of said outer cover is provided with the groove of multi-layer annular.
2. as claimed in claim 1 be used to classify reclaim the device of discarded lapping liquid and deionized water, it is characterized in that every layer of said groove is provided with outage.
3. as claimed in claim 1 be used to classify reclaim the device of discarded lapping liquid and deionized water, it is characterized in that said groove internal diameter is greater than said grinding disk diameter.
4. as claimed in claim 1 be used to classify reclaim the device of discarded lapping liquid and deionized water, it is characterized in that the size of said groove and angle can be carried out accommodation.
5. as claimed in claim 1 be used to classify reclaim the device of discarded lapping liquid and deionized water, it is characterized in that, also comprise the grinding pad that is fixedly set in said grinding disk upper surface.
6. as claimed in claim 5 be used to classify reclaim the device of discarded lapping liquid and deionized water; It is characterized in that; Said outer cover can go up and down to different height according to the different rotating speeds that grinds rotating disk, and is collected by the arbitrary groove in the said groove with the discarded lapping liquid or the deionized water that keep being shed on the said grinding pad.
7. as claimed in claim 6 be used to classify reclaim the device of discarded lapping liquid and deionized water; It is characterized in that; Also comprise the wafer carrier and the fluid Supplying apparatus that are arranged at said grinding pad top, the shower nozzle of said fluid Supplying apparatus sprays lapping liquid or deionized water reaches said wafer periphery on said grinding pad.
8. as claimed in claim 7 be used to classify reclaim the device of discarded lapping liquid and deionized water, it is characterized in that said wafer carrier direction of rotation is opposite with said grinding rotating disk direction of rotation.
9. one kind is used to classify and reclaims the method for discarded lapping liquid and deionized water, it is characterized in that, may further comprise the steps:
The outer cover of one hollow cylindrical is sheathed on and grinds around the rotating disk, is provided with the groove of multi-layer annular on its inwall at least;
Go up and down said outer cover to corresponding height; In grinding rotating disk drive setting grinding pad rotating process on it; Be fixed on the wafer on the wafer carrier with grinding; Utilize fluid Supplying apparatus to pass through its shower nozzle simultaneously and spray lapping liquid on said grinding pad and said wafer periphery, collect the lapping liquid that throws away from the surface of said grinding pad because of centrifugal action through a said groove afterwards;
After grinding technics is accomplished; Go up and down said outer cover once more to another corresponding height; Utilize the shower nozzle of fluid Supplying apparatus to spray deionized water on said grinding pad and said wafer periphery, collect the deionized water that throws away from the surface of said grinding pad because of centrifugal action through another said groove.
10. as claimed in claim 9 be used to classify reclaim the method for discarded lapping liquid and deionized water, it is characterized in that every layer of said groove is provided with outage.
11. as claimed in claim 9 be used to classify reclaim the method for discarded lapping liquid and deionized water, it is characterized in that said groove internal diameter is greater than said grinding disk diameter.
12. as claimed in claim 9 be used to classify reclaim the method for discarded lapping liquid and deionized water, it is characterized in that the size of said groove and angle can be carried out accommodation.
13. as claimed in claim 9 be used to classify reclaim the method for discarded lapping liquid and deionized water, it is characterized in that said wafer carrier direction of rotation is opposite with said grinding rotating disk direction of rotation.
14. as claimed in claim 9 be used to classify reclaim the method for discarded lapping liquid and deionized water; It is characterized in that; Said outer cover can go up and down to different height according to the different rotating speeds that grinds rotating disk, and is collected by the arbitrary groove in the said groove with the discarded lapping liquid or the deionized water that keep being shed on the said grinding pad.
15. one kind is used to classify and reclaims the method for discarded lapping liquid and deionized water, it is characterized in that, may further comprise the steps:
The outer cover of one hollow cylindrical is sheathed on and grinds around the rotating disk, is provided with the groove of multi-layer annular on its inwall at least;
Go up and down said outer cover to corresponding height; In grinding rotating disk drive setting grinding pad rotating process on it; Be fixed on the wafer on the wafer carrier with grinding; Utilize fluid Supplying apparatus to pass through its shower nozzle simultaneously and spray lapping liquid on said grinding pad and said wafer periphery, collect the lapping liquid that throws away from the surface of said grinding pad because of centrifugal action through a said groove afterwards;
After grinding technics is accomplished; Keep the height of said outer cover constant; Through changing the rotating speed of said grinding rotating disk; Utilize the shower nozzle of fluid Supplying apparatus to spray deionized water on said grinding pad and said wafer periphery, collect the deionized water that throws away from the surface of said grinding pad because of centrifugal action through another said groove.
16. as claimed in claim 15 be used to classify reclaim the method for discarded lapping liquid and deionized water, it is characterized in that every layer of said groove is provided with outage.
17. as claimed in claim 15 be used to classify reclaim the method for discarded lapping liquid and deionized water, it is characterized in that said groove internal diameter is greater than said grinding disk diameter.
18. as claimed in claim 15 be used to classify reclaim the method for discarded lapping liquid and deionized water, it is characterized in that the size of said groove and angle can be carried out accommodation.
19. as claimed in claim 15 be used to classify reclaim the method for discarded lapping liquid and deionized water, it is characterized in that said wafer carrier direction of rotation is opposite with said grinding rotating disk direction of rotation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110123661XA CN102601739A (en) | 2011-05-13 | 2011-05-13 | Device and method for classifying and recovering waste grinding fluid and deionized water |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110123661XA CN102601739A (en) | 2011-05-13 | 2011-05-13 | Device and method for classifying and recovering waste grinding fluid and deionized water |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102601739A true CN102601739A (en) | 2012-07-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110123661XA Pending CN102601739A (en) | 2011-05-13 | 2011-05-13 | Device and method for classifying and recovering waste grinding fluid and deionized water |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107093567A (en) * | 2016-02-18 | 2017-08-25 | 顶程国际股份有限公司 | Annular liquid collection device |
| CN113681431A (en) * | 2021-10-20 | 2021-11-23 | 江苏昆彭精密机械有限责任公司 | Polishing agent feeding device for polishing machine |
| CN114130782A (en) * | 2021-11-29 | 2022-03-04 | 上海华力微电子有限公司 | Single wafer chemical liquid recovery device and method |
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| JPH11181584A (en) * | 1997-12-18 | 1999-07-06 | Toshiba Electronic Engineering Corp | Substrate treatment apparatus |
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| KR20070108685A (en) * | 2006-05-08 | 2007-11-13 | 삼성전자주식회사 | Slurry recyling system, slurry segregating system and slurry recycling method |
| CN101673062A (en) * | 2008-09-09 | 2010-03-17 | 中芯国际集成电路制造(北京)有限公司 | Device and method for removing photoresist by whole wet method |
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| JPH11168078A (en) * | 1997-12-04 | 1999-06-22 | Dainippon Screen Mfg Co Ltd | Substrate treatment equipment |
| JPH11181584A (en) * | 1997-12-18 | 1999-07-06 | Toshiba Electronic Engineering Corp | Substrate treatment apparatus |
| US6589338B1 (en) * | 1999-12-02 | 2003-07-08 | Tokyo Electron Limited | Device for processing substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107093567A (en) * | 2016-02-18 | 2017-08-25 | 顶程国际股份有限公司 | Annular liquid collection device |
| CN107093567B (en) * | 2016-02-18 | 2019-08-06 | 顶程国际股份有限公司 | Annular liquid collection device |
| CN113681431A (en) * | 2021-10-20 | 2021-11-23 | 江苏昆彭精密机械有限责任公司 | Polishing agent feeding device for polishing machine |
| CN114130782A (en) * | 2021-11-29 | 2022-03-04 | 上海华力微电子有限公司 | Single wafer chemical liquid recovery device and method |
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Application publication date: 20120725 |