TWI804856B - 樹脂模塑裝置 - Google Patents

樹脂模塑裝置 Download PDF

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Publication number
TWI804856B
TWI804856B TW110115638A TW110115638A TWI804856B TW I804856 B TWI804856 B TW I804856B TW 110115638 A TW110115638 A TW 110115638A TW 110115638 A TW110115638 A TW 110115638A TW I804856 B TWI804856 B TW I804856B
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TW
Taiwan
Prior art keywords
workpiece
loader
resin molding
preheating
resin
Prior art date
Application number
TW110115638A
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English (en)
Chinese (zh)
Other versions
TW202145464A (zh
Inventor
藤沢雅彦
斎藤裕史
Original Assignee
日商山田尖端科技股份有限公司
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Publication of TW202145464A publication Critical patent/TW202145464A/zh
Application granted granted Critical
Publication of TWI804856B publication Critical patent/TWI804856B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/52—Heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
    • B29C2043/3411—Feeding the material to the mould or the compression means using carrying means mounted onto arms, e.g. grippers, fingers, clamping frame, suction means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
    • B29C2043/3605—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Automation & Control Theory (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW110115638A 2020-05-22 2021-04-29 樹脂模塑裝置 TWI804856B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020089927A JP7406247B2 (ja) 2020-05-22 2020-05-22 樹脂モールド装置
JP2020-089927 2020-05-22

Publications (2)

Publication Number Publication Date
TW202145464A TW202145464A (zh) 2021-12-01
TWI804856B true TWI804856B (zh) 2023-06-11

Family

ID=78607754

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110115638A TWI804856B (zh) 2020-05-22 2021-04-29 樹脂模塑裝置

Country Status (5)

Country Link
US (1) US20210362382A1 (ja)
JP (1) JP7406247B2 (ja)
KR (1) KR102434806B1 (ja)
CN (1) CN113707572B (ja)
TW (1) TWI804856B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7277935B2 (ja) * 2020-04-28 2023-05-19 アピックヤマダ株式会社 樹脂モールド装置
JP7277936B2 (ja) * 2020-04-28 2023-05-19 アピックヤマダ株式会社 樹脂モールド装置

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5288698A (en) * 1990-02-01 1994-02-22 Mitsubishi Denki Kabushiki Kaisha Method of positioning lead frame on molding die to seal semiconductor element with resin
US20040022884A1 (en) * 2002-07-30 2004-02-05 Renesas Technology Corp. Resin molding apparatus
JP2008132730A (ja) * 2006-11-29 2008-06-12 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
TW201019446A (en) * 2008-09-29 2010-05-16 Toppan Printing Co Ltd Lead frame board, method of forming the same, and semiconductor device
US20120135096A1 (en) * 2010-11-25 2012-05-31 Maeyama Tetsuya Resin molding machine
US20120148949A1 (en) * 2006-12-26 2012-06-14 Asahi Kasei E-Materials Corporation Resin composition for printing plate
TW201329145A (zh) * 2011-11-28 2013-07-16 Nitto Denko Corp 底層充填材料及半導體裝置之製造方法
US8851875B2 (en) * 2010-11-02 2014-10-07 Samsung Electronics Co., Ltd. Semiconductor package molding system and molding method thereof
TW201536510A (zh) * 2014-03-19 2015-10-01 Towa Corp 片狀樹脂之供給方法及半導體密封方法以及半導體密封裝置
TW201709359A (zh) * 2015-07-15 2017-03-01 Apic Yamada Corp 模製模具及樹脂模製裝置
US20180099375A1 (en) * 2016-10-07 2018-04-12 Disco Corporation Frame fixing jig
TW201821236A (zh) * 2016-12-13 2018-06-16 Apic Yamada Corp 框體治具、樹脂供給治具及其計量方法、模塑樹脂的計量裝置及方法、樹脂供給裝置、樹脂供給計量裝置及方法、與樹脂模塑裝置及方法
TW201936358A (zh) * 2017-08-21 2019-09-16 日商Ｔｏｗａ股份有限公司 樹脂成形裝置以及樹脂成形品製造方法

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JPH104105A (ja) * 1996-06-14 1998-01-06 Nec Corp リードフレームローダ
JP3776174B2 (ja) * 1996-09-12 2006-05-17 アピックヤマダ株式会社 半導体部品の搬送装置
JP2812331B1 (ja) * 1997-06-24 1998-10-22 日本電気株式会社 リードフレームローダ
KR101237056B1 (ko) * 2010-05-04 2013-02-25 한미반도체 주식회사 반도체 패키지 집합체 정렬방법
KR101275697B1 (ko) * 2010-05-25 2013-06-14 한미반도체 주식회사 반도체 자재 정렬방법
KR101454319B1 (ko) * 2010-05-10 2014-10-28 한미반도체 주식회사 반도체 패키지 제조용 싱귤레이션장치
JP5793806B2 (ja) * 2011-08-17 2015-10-14 アピックヤマダ株式会社 樹脂モールド装置
JP5538613B1 (ja) * 2013-11-13 2014-07-02 東京エレクトロン株式会社 接合装置及び接合システム
JP6689160B2 (ja) * 2016-08-24 2020-04-28 株式会社ディスコ 板状物搬送装置及び加工装置
JP6821261B2 (ja) * 2017-04-21 2021-01-27 株式会社ディスコ 被加工物の加工方法
KR101956303B1 (ko) 2018-02-08 2019-03-08 주식회사 오파테크 스마트 점자 학습장치 및 이를 이용한 점자 학습방법

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5288698A (en) * 1990-02-01 1994-02-22 Mitsubishi Denki Kabushiki Kaisha Method of positioning lead frame on molding die to seal semiconductor element with resin
US20040022884A1 (en) * 2002-07-30 2004-02-05 Renesas Technology Corp. Resin molding apparatus
JP2008132730A (ja) * 2006-11-29 2008-06-12 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
US20120148949A1 (en) * 2006-12-26 2012-06-14 Asahi Kasei E-Materials Corporation Resin composition for printing plate
TW201019446A (en) * 2008-09-29 2010-05-16 Toppan Printing Co Ltd Lead frame board, method of forming the same, and semiconductor device
US8851875B2 (en) * 2010-11-02 2014-10-07 Samsung Electronics Co., Ltd. Semiconductor package molding system and molding method thereof
KR20190132336A (ko) * 2010-11-25 2019-11-27 아피쿠 야마다 가부시키가이샤 수지몰드장치
US20120135096A1 (en) * 2010-11-25 2012-05-31 Maeyama Tetsuya Resin molding machine
TW201329145A (zh) * 2011-11-28 2013-07-16 Nitto Denko Corp 底層充填材料及半導體裝置之製造方法
TW201536510A (zh) * 2014-03-19 2015-10-01 Towa Corp 片狀樹脂之供給方法及半導體密封方法以及半導體密封裝置
TW201709359A (zh) * 2015-07-15 2017-03-01 Apic Yamada Corp 模製模具及樹脂模製裝置
US20180099375A1 (en) * 2016-10-07 2018-04-12 Disco Corporation Frame fixing jig
TW201821236A (zh) * 2016-12-13 2018-06-16 Apic Yamada Corp 框體治具、樹脂供給治具及其計量方法、模塑樹脂的計量裝置及方法、樹脂供給裝置、樹脂供給計量裝置及方法、與樹脂模塑裝置及方法
TW201936358A (zh) * 2017-08-21 2019-09-16 日商Ｔｏｗａ股份有限公司 樹脂成形裝置以及樹脂成形品製造方法

Also Published As

Publication number Publication date
JP2021184440A (ja) 2021-12-02
JP7406247B2 (ja) 2023-12-27
US20210362382A1 (en) 2021-11-25
CN113707572B (zh) 2024-08-13
CN113707572A (zh) 2021-11-26
KR20210144584A (ko) 2021-11-30
TW202145464A (zh) 2021-12-01
KR102434806B1 (ko) 2022-08-19

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