JP2021184440A - 樹脂モールド装置 - Google Patents
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Abstract
Description
電子部品がキャリアに搭載されたワークがモールド金型へ搬送されて樹脂モールドされる樹脂モールド装置であって、ステージ上に保持されたワークの姿勢を基準位置に整えるワークアライメント部と、前記ワークアライメント部でアライメントされたワークを保持して前記モールド金型へ搬送するローダーハンド機構と、を備えており、前記ローダーハンド機構は、前記ステージ上のワークを挟み込んで保持するローダーハンドと、前記ローダーハンドに備えたワークの外形位置と基準位置との位置ずれを検出する位置検出部と、前記位置検出部で検出された位置ずれ量に応じて前記ローダーハンドの中心位置をワークの中心位置とX−Y方向に位置合わせする位置合わせ機構と、を備えたことを特徴とする。
これにより、ローダーハンドがワーク外形を撮像するだけで基準位置からのX−Y方向の位置ずれ量算出してローダーハンドの中心位置をワークの中心位置とX−Y方向に位置合わせすることができる。
これにより、プリヒートステージでワークがプリヒートされて反り量が異なっても押圧部材の押圧力を可変とすることでワークの平坦度を維持することができるので、ワークをローダーハンドで平坦度を維持したまま位置決め保持することができる。
以下、図面を参照して、本発明の実施形態について図1を参照して説明する。図1は本発明の実施形態に係る樹脂モールド装置のレイアウト構成図である。樹脂モールド装置は上型キャビティタイプの圧縮成形装置1を例示し、ワークWは、厚さ0.2mm〜3mm程度で□400mm〜□700mm程度の大きさの薄板状のキャリアK(例えば銅板、ガラス板等)に半導体チップなどの電子部品Tが搭載されたものを想定して説明する。以下の装置構成では、複数の機能部(ユニット)を連結してなる装置構成について例示するが、装置本体に各機能部が一体に設けられていてもよい。また、各実施形態を説明するための全図において、同一の機能を有する部材には同一の符号を付し、その繰返しの説明は省略する場合がある。
図4A,Bに示すように、プリヒート部10には、プリヒータ10aが内蔵されたヒータ台10e上に矩形状のプリヒートステージ10bが設けられている。プリヒートステージ10bには、ワークWが搭載されて吸着保持される複数の吸着孔10fが設けられている。吸着孔10eは後述する真空発生装置21に接続されている。プリヒータ10aは、ワークW及び樹脂Rを100℃程度までプリヒートするようになっている。尚、ワークアライメント部はプリヒート部10に限らず、ワーク受渡しユニットCの受渡し位置Qや樹脂供給ステージ7等であってもよい。
上述したプリヒート部10でプリヒートされ、アライメントされたワークWは、ローダー4(ローダーハンド機構)によってプリヒートステージ10bより保持してモールド金型11aへ搬送される。
図5Aに示すようにローダー4は、プリヒートステージ10b上のワークWを保持するローダーハンド4bを備えている。ローダーハンド4bはプリヒートステージ10b上のワークW上面より外周縁部を押圧する環状の枠体4b1とワークW下面を複数箇所でワーク端面と所定クリアランスαを設けて支持するチャック4b2を備えている。
図1に示すワーク受渡しユニットCの受渡し位置Qにあるワーク移送部2より樹脂Rが搭載されたワークWをローダー4が受け取り、当該ローダー4がプリヒートステージ10b上に搬送すると、ワークアライメント動作が開始される(ステップS1)。
プリヒートステージ10bでプリヒートされてワークWの反り量が異なっても枠体4b1の押圧力を可変とすることでワークWの平坦度を維持することができ、ワークWをローダーハンド4bで平坦度を維持したまま正確にワークWの外形サイズを検出して正確に位置決め保持することができる。
また、ワークWは、ローダー4により上型に供給され、モールド樹脂R(顆粒樹脂又は液状樹脂)は樹脂供給ユニットBにより直接下型キャビティ内にディスペンサにより供給するようにしてもよくリリースフィルムFに載せた状態でモールド樹脂Rを供給するようにしてもよい。
また、ワークアライメント部はプリヒート部10を例示しローダーハンド機構としてローダー4を例示したが、これに限定されるものではなく、ワークWを載置する樹脂供給ステージ7やワークWをピックアップして搬送するピックアンドプレース機構8等に適用してもよい。
Claims (6)
- 電子部品がキャリアに搭載されたワークがモールド金型へ搬送されて樹脂モールドされる樹脂モールド装置であって、
ステージ上に保持されたワークの姿勢を基準位置に整えるワークアライメント部と、
前記ワークアライメント部でアライメントされたワークを保持して前記モールド金型へ搬送するローダーハンド機構と、を備えており、
前記ローダーハンド機構は、
前記ステージ上のワークを挟み込んで保持するローダーハンドと、
前記ローダーハンドに備えたワークの外形位置と基準位置との位置ずれを検出する位置検出部と、
前記位置検出部で検出された位置ずれ量に応じて前記ローダーハンドの中心位置をワークの中心位置とX−Y方向に位置合わせする位置合わせ機構と、を備えたことを特徴とする樹脂モールド装置。 - 前記ワークアライメント部は、前記ワークをX−Y方向に各々設けられた基準ブロックに対して押し当てて前記ワークの姿勢を基準位置に整える請求項1記載の樹脂モールド装置。
- 前記位置検出部は、撮像カメラを備え、ステージ上に載置されたワークの外形座標を読み取って基準位置を示す位置決めマークとのX−Y方向の位置ずれを検出する請求項1又は請求項2記載の樹脂モールド装置。
- 前記位置検出部は、複数の撮像カメラを備え、ワーク外形の対角位置にある座標を検出して仮想ステージ中心位置とのX−Y方向の位置ずれを検出する請求項1又は請求項2記載の樹脂モールド装置。
- 前記ステージは、前記ワークを予熱するプリヒートステージである請求項1乃至請求項4のいずれかに記載の樹脂モールド装置。
- 前記ローダーハンドは、ワーク上面より外周縁部を押圧する環状の押圧部材とワーク下面をワーク端面と所定クリアランスを設けて支持するチャックを備え、前記押圧部材は、ワークの押圧力が可変となるように制御され、前記ローダーハンド機構は前記プリヒートステージでプリヒートされたワークを前記押圧部材と前記チャックで挟み込んだままモールド金型へ搬送する請求項5記載の樹脂モールド装置。
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US17/238,135 US20210362382A1 (en) | 2020-05-22 | 2021-04-22 | Resin molding device |
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CN113707572A (zh) | 2021-11-26 |
KR102434806B1 (ko) | 2022-08-19 |
JP7406247B2 (ja) | 2023-12-27 |
US20210362382A1 (en) | 2021-11-25 |
KR20210144584A (ko) | 2021-11-30 |
TWI804856B (zh) | 2023-06-11 |
CN113707572B (zh) | 2024-08-13 |
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