TWI804658B - 覆金屬積層板和電路基板 - Google Patents
覆金屬積層板和電路基板 Download PDFInfo
- Publication number
- TWI804658B TWI804658B TW108126128A TW108126128A TWI804658B TW I804658 B TWI804658 B TW I804658B TW 108126128 A TW108126128 A TW 108126128A TW 108126128 A TW108126128 A TW 108126128A TW I804658 B TWI804658 B TW I804658B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- polyimide
- diamine
- polyimide layer
- thickness
- Prior art date
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018139844 | 2018-07-25 | ||
JP2018-139844 | 2018-07-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202010635A TW202010635A (zh) | 2020-03-16 |
TWI804658B true TWI804658B (zh) | 2023-06-11 |
Family
ID=69180524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108126128A TWI804658B (zh) | 2018-07-25 | 2019-07-24 | 覆金屬積層板和電路基板 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7428646B2 (ko) |
KR (1) | KR20210036342A (ko) |
CN (1) | CN112469560B (ko) |
TW (1) | TWI804658B (ko) |
WO (1) | WO2020022129A1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240046171A (ko) * | 2021-08-13 | 2024-04-08 | 엘지전자 주식회사 | 복합 폴리이미드 기판, 복합 폴리이미드 조성물 및 이를 이용한 인쇄 회로 기판 |
CN113604045B (zh) * | 2021-08-31 | 2022-09-02 | 烟台丰鲁精细化工有限责任公司 | 一种低介电性能的热塑性聚酰亚胺树脂复合薄膜及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017144730A (ja) * | 2016-02-12 | 2017-08-24 | 株式会社カネカ | 多層ポリイミドフィルム、およびフレキシブル金属張積層板 |
WO2018061727A1 (ja) * | 2016-09-29 | 2018-04-05 | 新日鉄住金化学株式会社 | ポリイミドフィルム、銅張積層板及び回路基板 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6031396B2 (ja) | 1979-03-14 | 1985-07-22 | 松下電器産業株式会社 | スピ−カシステム |
JP3482723B2 (ja) * | 1995-02-21 | 2004-01-06 | 宇部興産株式会社 | 多層芳香族ポリイミドフィルム |
JP3827859B2 (ja) * | 1998-04-13 | 2006-09-27 | 三井化学株式会社 | ポリイミド−金属積層体及びその製造方法 |
JP5886027B2 (ja) * | 2011-12-21 | 2016-03-16 | 新日鉄住金化学株式会社 | 両面金属張積層板およびその製造方法 |
JP2016188298A (ja) * | 2015-03-30 | 2016-11-04 | 新日鉄住金化学株式会社 | ポリイミド、樹脂フィルム、金属張積層体及び回路基板 |
JP6427454B2 (ja) | 2015-03-31 | 2018-11-21 | 日鉄ケミカル&マテリアル株式会社 | 銅張積層板及びプリント配線板 |
WO2016159060A1 (ja) | 2015-03-31 | 2016-10-06 | 株式会社カネカ | 多層接着フィルム及びフレキシブル金属張積層板 |
JP6473028B2 (ja) | 2015-03-31 | 2019-02-20 | 日鉄ケミカル&マテリアル株式会社 | 銅張積層板、プリント配線板及びその使用方法 |
-
2019
- 2019-07-17 CN CN201980049115.0A patent/CN112469560B/zh active Active
- 2019-07-17 WO PCT/JP2019/027994 patent/WO2020022129A1/ja active Application Filing
- 2019-07-17 JP JP2020532311A patent/JP7428646B2/ja active Active
- 2019-07-17 KR KR1020217001856A patent/KR20210036342A/ko not_active Application Discontinuation
- 2019-07-24 TW TW108126128A patent/TWI804658B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017144730A (ja) * | 2016-02-12 | 2017-08-24 | 株式会社カネカ | 多層ポリイミドフィルム、およびフレキシブル金属張積層板 |
WO2018061727A1 (ja) * | 2016-09-29 | 2018-04-05 | 新日鉄住金化学株式会社 | ポリイミドフィルム、銅張積層板及び回路基板 |
Also Published As
Publication number | Publication date |
---|---|
KR20210036342A (ko) | 2021-04-02 |
WO2020022129A1 (ja) | 2020-01-30 |
TW202010635A (zh) | 2020-03-16 |
CN112469560B (zh) | 2023-05-16 |
JP7428646B2 (ja) | 2024-02-06 |
JPWO2020022129A1 (ja) | 2021-08-05 |
CN112469560A (zh) | 2021-03-09 |
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