TWI804489B - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
TWI804489B
TWI804489B TW107108215A TW107108215A TWI804489B TW I804489 B TWI804489 B TW I804489B TW 107108215 A TW107108215 A TW 107108215A TW 107108215 A TW107108215 A TW 107108215A TW I804489 B TWI804489 B TW I804489B
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TW
Taiwan
Prior art keywords
resin composition
resin
mass
layer
epoxy resin
Prior art date
Application number
TW107108215A
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English (en)
Chinese (zh)
Other versions
TW201900761A (zh
Inventor
阪內啓之
西嶋千晴
Original Assignee
日商味之素股份有限公司
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Publication of TW201900761A publication Critical patent/TW201900761A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C08G59/623—Aminophenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/65—Additives macromolecular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • General Chemical & Material Sciences (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Graft Or Block Polymers (AREA)
TW107108215A 2017-03-29 2018-03-12 樹脂組成物 TWI804489B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017066054 2017-03-29
JP2017-066054 2017-03-29

Publications (2)

Publication Number Publication Date
TW201900761A TW201900761A (zh) 2019-01-01
TWI804489B true TWI804489B (zh) 2023-06-11

Family

ID=63844353

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107108215A TWI804489B (zh) 2017-03-29 2018-03-12 樹脂組成物

Country Status (4)

Country Link
JP (2) JP7067140B2 (ja)
KR (2) KR102579969B1 (ja)
CN (1) CN108690459A (ja)
TW (1) TWI804489B (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7031206B2 (ja) * 2017-10-02 2022-03-08 味の素株式会社 樹脂組成物
US11232957B2 (en) 2017-11-29 2022-01-25 Pep Inovation Pte. Ltd. Chip packaging method and package structure
US11233028B2 (en) 2017-11-29 2022-01-25 Pep Inovation Pte. Ltd. Chip packaging method and chip structure
US11610855B2 (en) 2017-11-29 2023-03-21 Pep Innovation Pte. Ltd. Chip packaging method and package structure
US11114315B2 (en) 2017-11-29 2021-09-07 Pep Innovation Pte. Ltd. Chip packaging method and package structure
JP7124657B2 (ja) * 2018-11-14 2022-08-24 味の素株式会社 樹脂組成物、樹脂シート、プリント配線板及び半導体装置
JP2020084182A (ja) * 2018-11-15 2020-06-04 ユニチカ株式会社 フレキシブル銅張積層板用組成物
JP7124770B2 (ja) * 2019-03-07 2022-08-24 味の素株式会社 樹脂組成物
WO2020255749A1 (ja) * 2019-06-21 2020-12-24 パナソニックＩｐマネジメント株式会社 封止用組成物、半導体装置及び半導体装置の製造方法
JP7302496B2 (ja) 2020-02-05 2023-07-04 味の素株式会社 樹脂組成物
JP7370904B2 (ja) 2020-03-05 2023-10-30 株式会社トッパンインフォメディア 半導体パッケージ基板の層間絶縁材料の研磨方法
JP7424167B2 (ja) * 2020-03-31 2024-01-30 味の素株式会社 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置
JP2021195409A (ja) * 2020-06-10 2021-12-27 日東シンコー株式会社 熱伝導性シート、及び、該熱伝導性シートを備える半導体モジュール
CN114591708B (zh) * 2020-12-30 2023-04-07 广东生益科技股份有限公司 一种树脂组合物、树脂胶膜及其应用
WO2023136253A1 (ja) * 2022-01-13 2023-07-20 味の素株式会社 回路基板の製造方法及びそれに用いる樹脂シート
CN116606528B (zh) * 2023-07-18 2023-09-29 成都上泰科技有限公司 一种用于宽禁带半导体封装的增韧改性环氧树脂高聚物及其制备方法
CN117069987B (zh) * 2023-10-17 2023-12-29 天津爱思达航天科技股份有限公司 一种碳纤维预浸料及其制备方法

Citations (3)

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CN101056934A (zh) * 2004-11-10 2007-10-17 陶氏环球技术公司 两性嵌段共聚物改性的环氧树脂以及由此制造的粘合剂
TW201341441A (zh) * 2011-12-20 2013-10-16 陶氏全球科技公司 環氧樹脂複合物
CN105199326A (zh) * 2014-06-30 2015-12-30 味之素株式会社 树脂组合物

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CN101772546B (zh) * 2007-08-02 2012-05-23 陶氏环球技术公司 用来增强热固性聚合物性能的两亲性嵌段共聚物和无机纳米填料
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BRPI0924000B1 (pt) * 2009-03-09 2019-08-06 Dow Global Technologies Llc Composição termofixável, produto termofixo e processo para preparar uma composição termofixável
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JP6109569B2 (ja) * 2010-05-07 2017-04-05 住友ベークライト株式会社 回路基板用エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板用積層基材、プリント配線板、及び半導体装置
WO2014028338A1 (en) * 2012-08-13 2014-02-20 Henkel Corporation Liquid compression molding encapsulants
CN105408995B (zh) * 2013-07-22 2019-06-18 汉高知识产权控股有限责任公司 控制晶片在压塑成型时翘曲的方法及使用该方法的制品
JP6409362B2 (ja) * 2014-06-25 2018-10-24 味の素株式会社 樹脂組成物
TW201718798A (zh) * 2015-09-03 2017-06-01 住友電木股份有限公司 樹脂片材及電子裝置

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
CN101056934A (zh) * 2004-11-10 2007-10-17 陶氏环球技术公司 两性嵌段共聚物改性的环氧树脂以及由此制造的粘合剂
TW201341441A (zh) * 2011-12-20 2013-10-16 陶氏全球科技公司 環氧樹脂複合物
CN105199326A (zh) * 2014-06-30 2015-12-30 味之素株式会社 树脂组合物

Also Published As

Publication number Publication date
KR20180110629A (ko) 2018-10-10
JP7405182B2 (ja) 2023-12-26
CN108690459A (zh) 2018-10-23
JP2022105508A (ja) 2022-07-14
JP7067140B2 (ja) 2022-05-16
KR102579969B1 (ko) 2023-09-20
JP2018168354A (ja) 2018-11-01
KR20230133824A (ko) 2023-09-19
TW201900761A (zh) 2019-01-01

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