TWI803486B - 銅粒子及其製造方法 - Google Patents

銅粒子及其製造方法 Download PDF

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Publication number
TWI803486B
TWI803486B TW107110963A TW107110963A TWI803486B TW I803486 B TWI803486 B TW I803486B TW 107110963 A TW107110963 A TW 107110963A TW 107110963 A TW107110963 A TW 107110963A TW I803486 B TWI803486 B TW I803486B
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TW
Taiwan
Prior art keywords
copper
copper particles
oxygen
particles
particle
Prior art date
Application number
TW107110963A
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English (en)
Chinese (zh)
Other versions
TW201841702A (zh
Inventor
松山敏和
織田晃祐
上住義明
遠藤安俊
Original Assignee
日商三井金屬鑛業股份有限公司
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Application filed by 日商三井金屬鑛業股份有限公司 filed Critical 日商三井金屬鑛業股份有限公司
Publication of TW201841702A publication Critical patent/TW201841702A/zh
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Publication of TWI803486B publication Critical patent/TWI803486B/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16Metallic particles coated with a non-metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2201/00Treatment under specific atmosphere
    • B22F2201/03Oxygen
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00Metallic composition of the powder or its coating
    • B22F2301/10Copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2302/00Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
    • B22F2302/25Oxide

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  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
TW107110963A 2017-03-31 2018-03-29 銅粒子及其製造方法 TWI803486B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-072054 2017-03-31
JP2017072054 2017-03-31

Publications (2)

Publication Number Publication Date
TW201841702A TW201841702A (zh) 2018-12-01
TWI803486B true TWI803486B (zh) 2023-06-01

Family

ID=63676352

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107110963A TWI803486B (zh) 2017-03-31 2018-03-29 銅粒子及其製造方法

Country Status (5)

Country Link
JP (1) JP7050756B2 (ko)
KR (1) KR102403998B1 (ko)
CN (1) CN110325303B (ko)
TW (1) TWI803486B (ko)
WO (1) WO2018181482A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6721934B2 (ja) * 2018-12-04 2020-07-15 メック株式会社 積層造形用銅粉末、積層造形用銅粉末の製造方法、積層造形物の製造方法及び積層造形物
JP6956766B2 (ja) * 2019-08-07 2021-11-02 Jx金属株式会社 銅粉ペーストを用いた接合方法
JP6956765B2 (ja) * 2019-08-07 2021-11-02 Jx金属株式会社 銅粉ペーストを用いた接合方法
JP6704083B1 (ja) * 2019-11-22 2020-06-03 東邦チタニウム株式会社 銅粉体とその製造方法
JP7490528B2 (ja) 2020-01-10 2024-05-27 東邦チタニウム株式会社 銅粉体
CN113019468A (zh) * 2021-03-05 2021-06-25 昆明理工大学 一种铜基Cu-Cu2O-CuO三元复合核壳材料的制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW424244B (en) * 1998-06-02 2001-03-01 Mitsubishi Gas Chemical Co Printed wiring board having highly reliably via hole and process for forming via hole
CN1422510A (zh) * 2000-04-10 2003-06-04 特乔尼科斯有限公司 双等离子体喷管装置
TWI359708B (en) * 2007-03-14 2012-03-11 Phibro Tech Inc Method of producing fine particle copper powders
CN203495238U (zh) * 2013-10-08 2014-03-26 江苏泰禾金属工业有限公司 一种铜粉粉碎装置
TW201619401A (zh) * 2014-10-03 2016-06-01 Mitsui Mining & Smelting Co 銅粉
CN105705276A (zh) * 2014-02-14 2016-06-22 三井金属矿业株式会社 铜粉

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3674501B2 (ja) * 2000-11-30 2005-07-20 株式会社村田製作所 感光性銅ペースト、銅パターンの形成方法、及びセラミック多層基板の製造方法
CN102784643B (zh) * 2011-05-19 2014-09-24 中国科学院过程工程研究所 一种利用有机硅废触体回收的铜粉制备的三元铜催化剂及制备方法
CN102350499B (zh) * 2011-09-28 2013-05-08 河北工业大学 一种Cu/Cu2O核壳复合微球的制备方法
KR101353149B1 (ko) * 2011-12-27 2014-01-27 삼성전기주식회사 구리분말 제조방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW424244B (en) * 1998-06-02 2001-03-01 Mitsubishi Gas Chemical Co Printed wiring board having highly reliably via hole and process for forming via hole
CN1422510A (zh) * 2000-04-10 2003-06-04 特乔尼科斯有限公司 双等离子体喷管装置
TWI359708B (en) * 2007-03-14 2012-03-11 Phibro Tech Inc Method of producing fine particle copper powders
CN203495238U (zh) * 2013-10-08 2014-03-26 江苏泰禾金属工业有限公司 一种铜粉粉碎装置
CN105705276A (zh) * 2014-02-14 2016-06-22 三井金属矿业株式会社 铜粉
TW201619401A (zh) * 2014-10-03 2016-06-01 Mitsui Mining & Smelting Co 銅粉

Also Published As

Publication number Publication date
WO2018181482A1 (ja) 2018-10-04
KR20190132351A (ko) 2019-11-27
CN110325303B (zh) 2022-01-11
JPWO2018181482A1 (ja) 2020-02-06
TW201841702A (zh) 2018-12-01
CN110325303A (zh) 2019-10-11
KR102403998B1 (ko) 2022-05-31
JP7050756B2 (ja) 2022-04-08

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