TWI801600B - 印刷電路板 - Google Patents

印刷電路板 Download PDF

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Publication number
TWI801600B
TWI801600B TW108119964A TW108119964A TWI801600B TW I801600 B TWI801600 B TW I801600B TW 108119964 A TW108119964 A TW 108119964A TW 108119964 A TW108119964 A TW 108119964A TW I801600 B TWI801600 B TW I801600B
Authority
TW
Taiwan
Prior art keywords
circuit
circuit board
printed circuit
laminate
layer
Prior art date
Application number
TW108119964A
Other languages
English (en)
Chinese (zh)
Other versions
TW202025872A (zh
Inventor
池潤禔
金台城
金炳讚
Original Assignee
南韓商三星電機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商三星電機股份有限公司 filed Critical 南韓商三星電機股份有限公司
Publication of TW202025872A publication Critical patent/TW202025872A/zh
Application granted granted Critical
Publication of TWI801600B publication Critical patent/TWI801600B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
TW108119964A 2018-12-17 2019-06-10 印刷電路板 TWI801600B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0163424 2018-12-17
KR1020180163424A KR102679997B1 (ko) 2018-12-17 2018-12-17 인쇄회로기판

Publications (2)

Publication Number Publication Date
TW202025872A TW202025872A (zh) 2020-07-01
TWI801600B true TWI801600B (zh) 2023-05-11

Family

ID=71106891

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108119964A TWI801600B (zh) 2018-12-17 2019-06-10 印刷電路板

Country Status (3)

Country Link
JP (1) JP7283027B2 (ja)
KR (1) KR102679997B1 (ja)
TW (1) TWI801600B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102628149B1 (ko) * 2020-11-27 2024-01-24 주식회사 심텍 브릿지 패턴을 구비하는 인쇄회로기판 및 이의 제조 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1702854A (zh) * 2004-05-28 2005-11-30 日本特殊陶业株式会社 中间基板
US8754514B2 (en) * 2011-08-10 2014-06-17 Taiwan Semiconductor Manufacturing Company, Ltd. Multi-chip wafer level package

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011159855A (ja) * 2010-02-02 2011-08-18 Panasonic Corp 局所多層回路基板、および局所多層回路基板の製造方法
JP5406322B2 (ja) * 2012-03-01 2014-02-05 株式会社フジクラ 電子部品内蔵多層配線基板及びその製造方法
JP6208411B2 (ja) * 2012-06-15 2017-10-04 新光電気工業株式会社 配線基板及びその製造方法
US20140049928A1 (en) * 2012-08-17 2014-02-20 Taiyo Yuden Co., Ltd. Substrate with built-in electronic component
US9754890B2 (en) * 2014-02-26 2017-09-05 Intel Corporation Embedded multi-device bridge with through-bridge conductive via signal connection
JP6473595B2 (ja) * 2014-10-10 2019-02-20 イビデン株式会社 多層配線板及びその製造方法
JP2016122790A (ja) * 2014-12-25 2016-07-07 イビデン株式会社 多層配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1702854A (zh) * 2004-05-28 2005-11-30 日本特殊陶业株式会社 中间基板
US8754514B2 (en) * 2011-08-10 2014-06-17 Taiwan Semiconductor Manufacturing Company, Ltd. Multi-chip wafer level package

Also Published As

Publication number Publication date
TW202025872A (zh) 2020-07-01
KR20200074718A (ko) 2020-06-25
KR102679997B1 (ko) 2024-07-02
JP2020098898A (ja) 2020-06-25
JP7283027B2 (ja) 2023-05-30

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