TWI800482B - 用於清潔塑膠表面的方法及用於執行該方法的設備 - Google Patents

用於清潔塑膠表面的方法及用於執行該方法的設備 Download PDF

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Publication number
TWI800482B
TWI800482B TW106117602A TW106117602A TWI800482B TW I800482 B TWI800482 B TW I800482B TW 106117602 A TW106117602 A TW 106117602A TW 106117602 A TW106117602 A TW 106117602A TW I800482 B TWI800482 B TW I800482B
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TW
Taiwan
Prior art keywords
carrying
plastic surfaces
cleaning plastic
cleaning
plastic
Prior art date
Application number
TW106117602A
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English (en)
Other versions
TW201742677A (zh
Inventor
馬堤亞斯 菲達
托斯頓 馬帝
路茲 瑞伯斯達克
Original Assignee
德商布魯克斯機械（德國）有限公司
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Publication of TW201742677A publication Critical patent/TW201742677A/zh
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Publication of TWI800482B publication Critical patent/TWI800482B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/08—Cleaning containers, e.g. tanks
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
    • C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
    • C02F1/46104—Devices therefor; Their operating or servicing
    • C02F1/4618—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/10—Salts
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
    • C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
    • C02F1/46104—Devices therefor; Their operating or servicing
    • C02F1/4618—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water
    • C02F2001/46195—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water characterised by the oxidation reduction potential [ORP]
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2201/00—Apparatus for treatment of water, waste water or sewage
    • C02F2201/46—Apparatus for electrochemical processes
    • C02F2201/461—Electrolysis apparatus
    • C02F2201/46105—Details relating to the electrolytic devices
    • C02F2201/46115—Electrolytic cell with membranes or diaphragms
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/18—Glass; Plastics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electrochemistry (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Hydrology & Water Resources (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
TW106117602A 2016-05-27 2017-05-26 用於清潔塑膠表面的方法及用於執行該方法的設備 TWI800482B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016109771.3A DE102016109771B4 (de) 2016-05-27 2016-05-27 Verfahren zum Reinigen einer Kunststoffoberfläche
DE102016109771.3 2016-05-27

Publications (2)

Publication Number Publication Date
TW201742677A TW201742677A (zh) 2017-12-16
TWI800482B true TWI800482B (zh) 2023-05-01

Family

ID=59067625

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106117602A TWI800482B (zh) 2016-05-27 2017-05-26 用於清潔塑膠表面的方法及用於執行該方法的設備

Country Status (10)

Country Link
US (1) US11872603B2 (zh)
EP (1) EP3487639A1 (zh)
JP (1) JP2019519688A (zh)
KR (1) KR102424386B1 (zh)
CN (1) CN110099755A (zh)
DE (1) DE102016109771B4 (zh)
IL (1) IL263210A (zh)
SG (1) SG11201810844VA (zh)
TW (1) TWI800482B (zh)
WO (1) WO2017203007A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201804881D0 (en) * 2018-03-27 2018-05-09 Lam Res Ag Method of producing rinsing liquid
CN109530374B (zh) * 2018-11-21 2021-07-27 上海超硅半导体有限公司 一种晶圆盒清洗方法
CN110880449B (zh) * 2019-09-30 2022-07-19 王偲偲 一种硅片清洗方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578193A (en) * 1993-01-08 1996-11-26 Nec Corporation Method and apparatus for wet treatment of solid surfaces
US5635053A (en) * 1994-10-28 1997-06-03 Nec Corporation Method and apparatus for cleaning electronic parts
US6273107B1 (en) * 1997-12-05 2001-08-14 Texas Instruments Incorporated Positive flow, positive displacement rinse tank
JP2007123770A (ja) * 2005-10-31 2007-05-17 Kaijo Corp ドアシェル洗浄装置及びドアシェル洗浄方法

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JPS6114233A (ja) * 1984-06-29 1986-01-22 N V C:Kk プラスチツク製品の洗浄方法
US5599438A (en) * 1994-03-25 1997-02-04 Nec Corporation Method for producing electrolyzed water
JP2830733B2 (ja) * 1994-03-25 1998-12-02 日本電気株式会社 電解水生成方法および電解水生成機構
JP2743823B2 (ja) * 1994-03-25 1998-04-22 日本電気株式会社 半導体基板のウエット処理方法
JP2737643B2 (ja) * 1994-03-25 1998-04-08 日本電気株式会社 電解活性水の生成方法および生成装置
JP3181795B2 (ja) * 1994-10-28 2001-07-03 オルガノ株式会社 電解水製造装置
JP3313263B2 (ja) 1995-04-15 2002-08-12 株式会社東芝 電解水生成方法及びその生成装置、半導体製造装置
JP2832171B2 (ja) * 1995-04-28 1998-12-02 信越半導体株式会社 半導体基板の洗浄装置および洗浄方法
JP3299662B2 (ja) 1995-09-06 2002-07-08 シャープ株式会社 食器洗い機
TW338713B (en) * 1995-09-06 1998-08-21 Sharp Kk A dishwasher
JP3590470B2 (ja) * 1996-03-27 2004-11-17 アルプス電気株式会社 洗浄水生成方法および洗浄方法ならびに洗浄水生成装置および洗浄装置
JP3378543B2 (ja) * 1999-11-26 2003-02-17 株式会社半導体先端テクノロジーズ ウェーハ・キャリア洗浄方法
JP4462513B2 (ja) * 2000-01-12 2010-05-12 有限会社コヒーレントテクノロジー 電解水の製造方法、洗浄水、及び洗浄方法
KR100389917B1 (ko) * 2000-09-06 2003-07-04 삼성전자주식회사 산화성 물질을 포함하는 아노드 수 및/또는 환원성 물질을포함하는 캐소드 수를 사용하는 반도체 제조를 위한 습식공정 및 이 공정에 사용되는 아노드수 및/또는 캐소드수
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CN102658270B (zh) 2012-05-09 2016-05-11 上海华虹宏力半导体制造有限公司 一种晶圆盒清洗装置及其清洗方法
US9579697B2 (en) * 2012-12-06 2017-02-28 Taiwan Semiconductor Manufacturing Co., Ltd. System and method of cleaning FOUP
KR102107987B1 (ko) * 2012-12-27 2020-05-08 세메스 주식회사 기판 처리 장치
CN104043605A (zh) * 2013-03-13 2014-09-17 北京北方微电子基地设备工艺研究中心有限责任公司 载体清洗装置和载体清洗方法
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JP6114233B2 (ja) 2014-06-20 2017-04-12 株式会社バンダイナムコエンターテインメント プログラム及びゲーム装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578193A (en) * 1993-01-08 1996-11-26 Nec Corporation Method and apparatus for wet treatment of solid surfaces
US5635053A (en) * 1994-10-28 1997-06-03 Nec Corporation Method and apparatus for cleaning electronic parts
US6273107B1 (en) * 1997-12-05 2001-08-14 Texas Instruments Incorporated Positive flow, positive displacement rinse tank
JP2007123770A (ja) * 2005-10-31 2007-05-17 Kaijo Corp ドアシェル洗浄装置及びドアシェル洗浄方法

Also Published As

Publication number Publication date
DE102016109771A1 (de) 2017-11-30
KR20190035621A (ko) 2019-04-03
CN110099755A (zh) 2019-08-06
US20200043766A1 (en) 2020-02-06
DE102016109771B4 (de) 2020-09-10
IL263210A (en) 2018-12-31
WO2017203007A1 (de) 2017-11-30
EP3487639A1 (de) 2019-05-29
JP2019519688A (ja) 2019-07-11
KR102424386B1 (ko) 2022-07-25
TW201742677A (zh) 2017-12-16
US11872603B2 (en) 2024-01-16
SG11201810844VA (en) 2019-01-30

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