SG11201810844VA - Method for cleaning a synthetic surface - Google Patents

Method for cleaning a synthetic surface

Info

Publication number
SG11201810844VA
SG11201810844VA SG11201810844VA SG11201810844VA SG11201810844VA SG 11201810844V A SG11201810844V A SG 11201810844VA SG 11201810844V A SG11201810844V A SG 11201810844VA SG 11201810844V A SG11201810844V A SG 11201810844VA SG 11201810844V A SG11201810844V A SG 11201810844VA
Authority
SG
Singapore
Prior art keywords
cleaning
synthetic surface
synthetic
Prior art date
Application number
SG11201810844VA
Inventor
Lutz Rebstock
Matthias Fryda
Thorsten Matthée
Original Assignee
Brooks Automation Germany Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brooks Automation Germany Gmbh filed Critical Brooks Automation Germany Gmbh
Publication of SG11201810844VA publication Critical patent/SG11201810844VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/08—Cleaning containers, e.g. tanks
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
    • C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
    • C02F1/46104—Devices therefor; Their operating or servicing
    • C02F1/4618—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/10—Salts
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
    • C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
    • C02F1/46104—Devices therefor; Their operating or servicing
    • C02F1/4618—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water
    • C02F2001/46195—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water characterised by the oxidation reduction potential [ORP]
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2201/00—Apparatus for treatment of water, waste water or sewage
    • C02F2201/46—Apparatus for electrochemical processes
    • C02F2201/461—Electrolysis apparatus
    • C02F2201/46105—Details relating to the electrolytic devices
    • C02F2201/46115—Electrolytic cell with membranes or diaphragms
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/18—Glass; Plastics

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Environmental & Geological Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Electrochemistry (AREA)
  • Hydrology & Water Resources (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Water Supply & Treatment (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
SG11201810844VA 2016-05-27 2017-05-24 Method for cleaning a synthetic surface SG11201810844VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016109771.3A DE102016109771B4 (en) 2016-05-27 2016-05-27 Method for cleaning a plastic surface
PCT/EP2017/062693 WO2017203007A1 (en) 2016-05-27 2017-05-24 Method for cleaning a synthetic surface

Publications (1)

Publication Number Publication Date
SG11201810844VA true SG11201810844VA (en) 2019-01-30

Family

ID=59067625

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201810844VA SG11201810844VA (en) 2016-05-27 2017-05-24 Method for cleaning a synthetic surface

Country Status (10)

Country Link
US (1) US11872603B2 (en)
EP (1) EP3487639A1 (en)
JP (1) JP2019519688A (en)
KR (1) KR102424386B1 (en)
CN (1) CN110099755A (en)
DE (1) DE102016109771B4 (en)
IL (1) IL263210A (en)
SG (1) SG11201810844VA (en)
TW (1) TWI800482B (en)
WO (1) WO2017203007A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201804881D0 (en) * 2018-03-27 2018-05-09 Lam Res Ag Method of producing rinsing liquid
CN109530374B (en) * 2018-11-21 2021-07-27 上海超硅半导体有限公司 Wafer box cleaning method
CN110880449B (en) * 2019-09-30 2022-07-19 王偲偲 Silicon wafer cleaning method

Family Cites Families (30)

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JPS6114233A (en) * 1984-06-29 1986-01-22 N V C:Kk Washing of plastic article
EP0605882B1 (en) * 1993-01-08 1996-12-11 Nec Corporation Method and apparatus for wet treatment of solid surfaces
JP2830733B2 (en) 1994-03-25 1998-12-02 日本電気株式会社 Electrolytic water generation method and electrolysis water generation mechanism
JP2737643B2 (en) * 1994-03-25 1998-04-08 日本電気株式会社 Method and apparatus for producing electrolytically activated water
JP2743823B2 (en) 1994-03-25 1998-04-22 日本電気株式会社 Semiconductor substrate wet treatment method
US5599438A (en) * 1994-03-25 1997-02-04 Nec Corporation Method for producing electrolyzed water
JPH08126873A (en) 1994-10-28 1996-05-21 Nec Corp Washing and device for electronic parts and the like
JP3181795B2 (en) * 1994-10-28 2001-07-03 オルガノ株式会社 Electrolyzed water production equipment
JP3313263B2 (en) 1995-04-15 2002-08-12 株式会社東芝 Electrolytic water generation method, its generation apparatus, and semiconductor manufacturing apparatus
JP2832171B2 (en) * 1995-04-28 1998-12-02 信越半導体株式会社 Apparatus and method for cleaning semiconductor substrate
TW338713B (en) * 1995-09-06 1998-08-21 Sharp Kk A dishwasher
JP3299662B2 (en) 1995-09-06 2002-07-08 シャープ株式会社 dishwasher
JP3590470B2 (en) * 1996-03-27 2004-11-17 アルプス電気株式会社 Cleaning water generation method and cleaning method, and cleaning water generation device and cleaning device
US6273107B1 (en) * 1997-12-05 2001-08-14 Texas Instruments Incorporated Positive flow, positive displacement rinse tank
JP3378543B2 (en) * 1999-11-26 2003-02-17 株式会社半導体先端テクノロジーズ Wafer carrier cleaning method
JP4462513B2 (en) * 2000-01-12 2010-05-12 有限会社コヒーレントテクノロジー Electrolyzed water manufacturing method, cleaning water, and cleaning method
KR100389917B1 (en) * 2000-09-06 2003-07-04 삼성전자주식회사 Wet process for fabrication of semiconductor device using electrolytically ionized anode water and/or cathod water and electrolytically ionized anode water and/or cathode water used therein
JP2002153827A (en) * 2000-11-19 2002-05-28 Nofil Corp Cleaning method
ES2377945T3 (en) 2001-12-05 2012-04-03 Oculus Innovative Sciences, Inc. Method and apparatus for producing water with negative and positive oxidation and reduction (ORP) potential
KR100528286B1 (en) * 2004-09-02 2005-11-15 주식회사 에스에프에이 Apparatus for cleaning a substrate and method thereof
JP2006255603A (en) 2005-03-17 2006-09-28 Hitachi Chem Co Ltd Washing method and washing device with electrolytic water
JP2007123770A (en) 2005-10-31 2007-05-17 Kaijo Corp Door shell cleaning apparatus and door shell cleaning method
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US9579697B2 (en) 2012-12-06 2017-02-28 Taiwan Semiconductor Manufacturing Co., Ltd. System and method of cleaning FOUP
KR102107987B1 (en) * 2012-12-27 2020-05-08 세메스 주식회사 Substrate treating apparatus
CN104043605A (en) * 2013-03-13 2014-09-17 北京北方微电子基地设备工艺研究中心有限责任公司 Carrier cleaning device and carrier cleaning method
JP2015041756A (en) * 2013-08-23 2015-03-02 株式会社東芝 Cleaning method of wafer carrier
JP6114233B2 (en) 2014-06-20 2017-04-12 株式会社バンダイナムコエンターテインメント Program and game device

Also Published As

Publication number Publication date
WO2017203007A1 (en) 2017-11-30
EP3487639A1 (en) 2019-05-29
DE102016109771B4 (en) 2020-09-10
TW201742677A (en) 2017-12-16
US20200043766A1 (en) 2020-02-06
US11872603B2 (en) 2024-01-16
JP2019519688A (en) 2019-07-11
IL263210A (en) 2018-12-31
DE102016109771A1 (en) 2017-11-30
KR20190035621A (en) 2019-04-03
CN110099755A (en) 2019-08-06
KR102424386B1 (en) 2022-07-25
TWI800482B (en) 2023-05-01

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