EP3487639A1 - Method for cleaning a synthetic surface - Google Patents
Method for cleaning a synthetic surfaceInfo
- Publication number
- EP3487639A1 EP3487639A1 EP17730392.2A EP17730392A EP3487639A1 EP 3487639 A1 EP3487639 A1 EP 3487639A1 EP 17730392 A EP17730392 A EP 17730392A EP 3487639 A1 EP3487639 A1 EP 3487639A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- water
- rinsing
- plastic surface
- electrolyzed water
- deionized water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000004140 cleaning Methods 0.000 title claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 85
- 239000008367 deionised water Substances 0.000 claims abstract description 27
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 27
- 239000002245 particle Substances 0.000 claims abstract description 8
- 239000004033 plastic Substances 0.000 claims description 32
- 239000003792 electrolyte Substances 0.000 claims description 12
- 239000012535 impurity Substances 0.000 claims description 9
- 238000010926 purge Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 238000005868 electrolysis reaction Methods 0.000 description 13
- 239000007788 liquid Substances 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- -1 fluoride ions Chemical class 0.000 description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 6
- 239000000356 contaminant Substances 0.000 description 6
- 239000012528 membrane Substances 0.000 description 6
- 150000001768 cations Chemical class 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003014 ion exchange membrane Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000003011 anion exchange membrane Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 239000012153 distilled water Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 238000005341 cation exchange Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/4618—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/10—Salts
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/4618—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water
- C02F2001/46195—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water characterised by the oxidation reduction potential [ORP]
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2201/00—Apparatus for treatment of water, waste water or sewage
- C02F2201/46—Apparatus for electrochemical processes
- C02F2201/461—Electrolysis apparatus
- C02F2201/46105—Details relating to the electrolytic devices
- C02F2201/46115—Electrolytic cell with membranes or diaphragms
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/18—Glass; Plastics
Definitions
- the invention relates to a method for cleaning, in particular for removing metallic contaminants and / or particles, from a plastic surface.
- processors and integrated circuits are produced on silicon wafers in a multiplicity of different work steps to be carried out successively, in which the wafers are coated or exposed to a wide variety of materials, or parts of applied layers are removed again by different etching methods or other methods. Between these individual steps, the partially coated wafers must be transported from one processing machine to another machine. It is of utmost importance that the very delicate very filigree coated surfaces are not damaged. In particular, applied electrical conductor tracks must remain electrically separated from one another in order to ensure the functionality of the component to be produced, for example a processor.
- FOUPs Front Opening Unified Pod
- FOUPs Front Opening Unified Pod
- PEEK polyetheretherketone
- the invention achieves the stated object by a method for cleaning, in particular for removing metallic contaminants and / or particles, from a plastic surface, the method having the following steps: a) rinsing the plastic surface with deionized water,
- the term "purging" is understood to mean that the respective liquid is applied to the plastic surface to be cleaned, for example by spraying the respective liquid onto the surface or by dipping the plastic surface into the respective liquid Of course, it is also possible to let the liquid run over the plastic surface.
- the plastic surface to be cleaned is consequently rinsed with deionized water, which is also referred to as distilled water. This initially removes adhering or resting coarse particles on the surface. It is particularly advantageous that the ionized water is sprayed onto the plastic surface to be cleaned.
- the plastic surface is rinsed with electrolyzed water. Electrolyzed water is produced by, for example, adding an electrolyte to deionized water and then passing it through an electrolytic cell. By using the electrolyzed water at least part of the adhering to the plastic surface metal is dissolved and removed in this way from the surface. Preferably, the adhered metal is completely removed.
- the surface is rinsed again with deionized water in a third step.
- a so-called “rinse cleaning process” is advantageously used in which the deionized water flows over the surface to be cleaned.
- the inventive method makes use of the knowledge that the solubility of metals in water, in particular the pH and redox potential of the Water depends. Therefore, the solubility of the metals in electrolyzed water is usually higher than in deionized water, so that the additional process step of rinsing with electrolyzed water can better remove metallic contaminants than when purifying with deionized water alone.
- rinsing with electrolyzed water involves rinsing with anodic water having a pH that is less than 7.
- Anodic water is therefore acidic and can dissolve a variety of metals.
- purging with electrolyzed water includes purging with cathodic water having a pH greater than 7.
- particles, such as metallic particles may be at least mostly, but preferably completely, removed with cathodic water.
- rinsing with electrolyzed water involves rinsing with both anodic and cathodic water, using the two differently electrolyzed water in succession.
- the plastic surface is first rinsed with anodic water before it is rinsed with cathodic water. Rinsing the plastic surface with anodic water may leave slight positive charges on the surface. This facilitates later re-adhesion of particles and improves adhesion so that these remaining slightly positive charges should be avoided. Subsequent alkaline surface aftertreatment by cathodic water rinsing removes these slightly positive charges, making it difficult to adhere new particles.
- deionized water is used for rinsing to remove as much as possible the residue of the electrolyzed water.
- the electrolyzed water is produced in an electrolysis cell having two electrodes and into which water is added, which is treated with an electrolyte.
- the production of electrolyzed water has been known for a long time from the prior art.
- the pH and / or the redox potential of the electrolyzed water can be adjusted by using the concentration of the electrolyte and / or an electric current flowing between the two electrodes as control parameters.
- the electrolysis cell generally has two electrolysis chambers, one of which represents the cathode chamber with the cathode located therein and the other represents the anode chamber with the anode located therein.
- the two electrodes are formed as diamond electrodes.
- the two chambers Into at least one of the two chambers is introduced with an electrolyte-added deionized water, which is thus exposed to the electric field that prevails between the two electrodes.
- the two chambers are separated by a membrane which is permeable to ions of a given charge.
- a membrane which is permeable to ions of a given charge.
- the pH of the produced electrolyzed water can be adjusted to a predetermined value. If necessary, the residence time of the deionized water provided with electrolytes within the respective chamber of the electrolysis cell, ie the flow rate, and / or the current flowing through the two electrodes must be adjusted and adjusted.
- the redox potential of the produced electrolyzed water can be adjusted by the electric current. It is thus possible to adjust both the pH and the redox potential independently of one another to a desired combination of values at least within predetermined ranges and thus optimally adjust the electrolyzed water to the metal to be dissolved, which adheres as an impurity to the plastic surface to be cleaned.
- electrolytes can be selected which include chloride ions (Cl “ ), fluoride ions (F “ ), sulfate ions (SO 2 “ ), phosphate ions (PO 3” ), nitrate ions (NO 3 “ ) or It goes without saying that electrolytes which form cations in order to ensure electrical neutrality must also be used as cations, in particular hydrogen ions (H + ) and / or ammonium ions (NH4 + ).
- the rinsing of the plastic surface in each of the process steps takes between 15 seconds and 90 seconds. If rinsing with both anodic and cathodic water in step b), a rinsing period between 15 seconds and 90 seconds can be provided for each of these two rinses. It has proven to be advantageous if the rinsing in the different process steps for different lengths lasts.
- the respective rinsing time is set to the expected dirt or impurities and the desired degree of cleaning.
- the temperature of the deionized water and / or the electrolyzed water may be between 10 ° C and 70 ° C. It has been shown that the cleaning effect increases with increasing temperature. Of course, the temperature in different process steps for the respective liquid can also be chosen differently here. In particular, the deionized water with which is flushed in step a), have a different temperature and in particular be warmer or colder than the deionized water with which in step c) is rinsed.
- the invention also achieves the stated object by a device for carrying out a method described here.
- a device for carrying out a method described here not only has the ability to rinse the plastic surface with the respective different liquids, but also includes an electrolytic cell to produce the required electrolyzed water itself.
- the electrolysis cell can be operated continuously in permanent operation.
- a temporally limited operation of the electrolytic cell may be useful if the device has, for example, one or more intermediate tanks or storage in which or which the electrolyzed liquid can be temporarily stored. In this case, it is possible to use a larger capacity electrolytic cell, which may be operated more efficiently if necessary.
- FIG. 1 the schematic representation of an electrolysis cell
- Figure 2 the schematic representation of a structure of a device according to a first embodiment of the present invention
- Figures 3 and 4 - are schematic diagrams that make up the cleaning effect.
- FIG. 1 shows an electrolytic cell 1 which has an anode chamber 2, in which an anode 4 is located, and a cathode chamber 6, in which a cathode 8 is located. Between the anode chamber 2 and the cathode chamber 6 is an ion exchange membrane 10, which is formed in the embodiment shown as an anion exchange membrane 10. Deionized water or distilled water, which may also be ultrapure ultrafine water, is introduced into the anode chamber 2 through an anode chamber inlet 12. At the same time deionized water in which an electrolyte is located, which forms chloride ions in the embodiment shown, passed through a cathode chamber inlet 14 into the cathode chamber 6. Schematically, it is shown in FIG. 1 that ammonium ions (NH 4 + ) and chloride ions (Cl " ) are present in the cathode chamber 6 in addition to the water (H 2 O).
- NH 4 + ammonium ions
- Cl " chloride ions
- An electrical voltage is applied between the anode 4 and the cathode 8, which accelerates the chloride ions (Cl " ) along the arrow 16 in the direction of the anode 4. They can pass through the ion exchange membrane 10 and are then located in the anode chamber 2 ,
- a cation exchange membrane instead of an anion exchange membrane so that positively charged cations can pass from the anode chamber 2 into the cathode chamber 6.
- anode chamber outlet 18 By an anode chamber outlet 18, the components shown in Figure 1 leave the anode chamber 2. It is water, chloride ions (Cl " ) and hydronium ions (H + ), by the electrical voltage between the Anode 4 and the cathode 8 are generated. At the same time, ozone (O 3) is formed in the anode chamber 2, which likewise leaves the anode chamber 2 through the anode chamber outlet 18.
- Figure 2 shows schematically an apparatus for carrying out a method for cleaning according to a first embodiment of the present invention.
- the device has two electrolysis cells 1, each having an anode chamber 2 and a cathode chamber 6.
- an ion exchange membrane 10 is arranged between the two chambers, which is formed as an anion exchange membrane in the electrolysis cell 1 shown on the left in FIG. 2 and as a cation exchange membrane in the electrolysis cell 1 shown on the right.
- anions can pass through the ion exchange membrane 10 in the electrolysis cell 1 shown on the left, while in the electrolysis cell 1 shown on the right, cations from the anode chamber 2 can pass into the cathode chamber 6.
- the device shown in FIG. 1 has an anolyte mixing tank 22.
- deionized water which is provided via a supply line 24, is mixed with an anolyte before it passes via the anode chamber inlet 12 into the anode chamber 2 of the electrolytic cell shown on the right in FIG 1 is fed.
- Deionized water is supplied through the cathode chamber inlet 14.
- cathodic water is produced, which is introduced via a cathode line 26 into a cathode tank 28. From there it can be fed to an applicator 30, by which it is applied to surface to be cleaned of plastic.
- the device shown in FIG. 2 also has a catholyte mixing tank 32.
- deionized water which is supplied via the supply line 24, is mixed with a catholyte before it is introduced into the cathode chamber 6 via the cathode chamber inlet 14.
- Deionized water is introduced via the anode chamber inlet 12 into the anode chamber 2 of the electrolysis cell 1 shown on the left in FIG. From the anode chamber outlet 18, the anodic water produced in the electrolysis cell shown on the left is introduced through an anode line 34 into an anode tank 36, from which it can also be fed to the applicator 30.
- FIGS. 3 and 4 show schematically how the cleaning effect of a method according to an exemplary embodiment of the present invention is. It is about the removal of iron impurities from a component made of polycarbonate.
- B is plotted, the redox potential in millivolts (mV) over A, the pH value.
- the solid lines each contain a number in a square box. This number indicates the percentage of iron impurities that could be removed by the particular process. Thus, for example, in the result of a process shown in FIG. 3 at a pH of 5.2 and a redox potential of 422 mV, 25% of the iron impurities are removed.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electrochemistry (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Hydrology & Water Resources (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016109771.3A DE102016109771B4 (en) | 2016-05-27 | 2016-05-27 | Method for cleaning a plastic surface |
PCT/EP2017/062693 WO2017203007A1 (en) | 2016-05-27 | 2017-05-24 | Method for cleaning a synthetic surface |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3487639A1 true EP3487639A1 (en) | 2019-05-29 |
Family
ID=59067625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP17730392.2A Withdrawn EP3487639A1 (en) | 2016-05-27 | 2017-05-24 | Method for cleaning a synthetic surface |
Country Status (10)
Country | Link |
---|---|
US (1) | US11872603B2 (en) |
EP (1) | EP3487639A1 (en) |
JP (1) | JP2019519688A (en) |
KR (1) | KR102424386B1 (en) |
CN (1) | CN110099755A (en) |
DE (1) | DE102016109771B4 (en) |
IL (1) | IL263210A (en) |
SG (1) | SG11201810844VA (en) |
TW (1) | TWI800482B (en) |
WO (1) | WO2017203007A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB201804881D0 (en) * | 2018-03-27 | 2018-05-09 | Lam Res Ag | Method of producing rinsing liquid |
CN109530374B (en) * | 2018-11-21 | 2021-07-27 | 上海超硅半导体有限公司 | Wafer box cleaning method |
CN110880449B (en) * | 2019-09-30 | 2022-07-19 | 王偲偲 | Silicon wafer cleaning method |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6114233A (en) * | 1984-06-29 | 1986-01-22 | N V C:Kk | Washing of plastic article |
EP0605882B1 (en) | 1993-01-08 | 1996-12-11 | Nec Corporation | Method and apparatus for wet treatment of solid surfaces |
US5599438A (en) * | 1994-03-25 | 1997-02-04 | Nec Corporation | Method for producing electrolyzed water |
JP2830733B2 (en) * | 1994-03-25 | 1998-12-02 | 日本電気株式会社 | Electrolytic water generation method and electrolysis water generation mechanism |
JP2743823B2 (en) * | 1994-03-25 | 1998-04-22 | 日本電気株式会社 | Semiconductor substrate wet treatment method |
JP2737643B2 (en) * | 1994-03-25 | 1998-04-08 | 日本電気株式会社 | Method and apparatus for producing electrolytically activated water |
JPH08126873A (en) * | 1994-10-28 | 1996-05-21 | Nec Corp | Washing and device for electronic parts and the like |
JP3181795B2 (en) * | 1994-10-28 | 2001-07-03 | オルガノ株式会社 | Electrolyzed water production equipment |
JP3313263B2 (en) | 1995-04-15 | 2002-08-12 | 株式会社東芝 | Electrolytic water generation method, its generation apparatus, and semiconductor manufacturing apparatus |
JP2832171B2 (en) * | 1995-04-28 | 1998-12-02 | 信越半導体株式会社 | Apparatus and method for cleaning semiconductor substrate |
JP3299662B2 (en) | 1995-09-06 | 2002-07-08 | シャープ株式会社 | dishwasher |
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-
2016
- 2016-05-27 DE DE102016109771.3A patent/DE102016109771B4/en active Active
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2017
- 2017-05-24 SG SG11201810844VA patent/SG11201810844VA/en unknown
- 2017-05-24 KR KR1020187037276A patent/KR102424386B1/en active IP Right Grant
- 2017-05-24 CN CN201780032085.3A patent/CN110099755A/en active Pending
- 2017-05-24 WO PCT/EP2017/062693 patent/WO2017203007A1/en unknown
- 2017-05-24 US US16/304,836 patent/US11872603B2/en active Active
- 2017-05-24 JP JP2019514856A patent/JP2019519688A/en active Pending
- 2017-05-24 EP EP17730392.2A patent/EP3487639A1/en not_active Withdrawn
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DE102016109771A1 (en) | 2017-11-30 |
KR20190035621A (en) | 2019-04-03 |
CN110099755A (en) | 2019-08-06 |
US20200043766A1 (en) | 2020-02-06 |
DE102016109771B4 (en) | 2020-09-10 |
IL263210A (en) | 2018-12-31 |
TWI800482B (en) | 2023-05-01 |
WO2017203007A1 (en) | 2017-11-30 |
JP2019519688A (en) | 2019-07-11 |
KR102424386B1 (en) | 2022-07-25 |
TW201742677A (en) | 2017-12-16 |
US11872603B2 (en) | 2024-01-16 |
SG11201810844VA (en) | 2019-01-30 |
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