TWI791448B - 光學模組製造方法 - Google Patents

光學模組製造方法 Download PDF

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Publication number
TWI791448B
TWI791448B TW106123539A TW106123539A TWI791448B TW I791448 B TWI791448 B TW I791448B TW 106123539 A TW106123539 A TW 106123539A TW 106123539 A TW106123539 A TW 106123539A TW I791448 B TWI791448 B TW I791448B
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Taiwan
Prior art keywords
light
opening
transmitting element
carrier
opaque layer
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TW106123539A
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English (en)
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TW201812366A (zh
Inventor
何信穎
陳盈仲
賴律名
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日月光半導體製造股份有限公司
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Publication of TW201812366A publication Critical patent/TW201812366A/zh
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
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    • H01L25/167Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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Abstract

本發明提供一種光學模組,其包括:一載體;一光發射器,其安置於該載體上;一光偵測器,其安置於該載體上;及一外殼,其安置於該載體上。該外殼界定曝露該光發射器之一第一開口及曝露該光偵測器之一第二開口。該光學模組進一步包括安置於該第一開口上之一第一光透射元件及安置於該第二開口上之一第二光透射元件。一第一不透明層安置於該第一光透射元件上,該第一不透明層界定一第一孔隙,且一第二不透明層安置於該第二光透射元件上,該第二不透明層界定一第二孔隙。

Description

光學模組製造方法
本發明係關於一種半導體封裝裝置,且係關於一種包括一或多個發光組件的半導體封裝裝置。
在光學感測器模組中,蓋之孔隙或外殼與光發射器或光偵測器的對準可影響感測器模組之效能。然而,自所要位置之偏移可能在製造光學感測器模組期間發生。舉例而言,晶粒相對於載體之安裝區域(安裝或置放晶粒之區域)的偏移(例如,移位)可大約介於25μm至50μm之範圍內,蓋之面板或外殼相對於載體之偏移可大約係100μm,且蓋之孔隙的偏移可大約係30μm。即使蓋之面板劃分成個別蓋,大約50μm之一或多個移位亦有可能在裝配晶粒及個別蓋時發生。可能需要減小此類偏移(例如,在製造光學感測器模組期間產生之偏移)。
另外,蓋或外殼之開口(例如,光通過之開口)(其由蓋或外殼界定)的大小對於一些光學定位應用(例如,近接感測器)準確地量測物件與光學感測器模組之間的距離係重要的。量測結果之準確性可在蓋或外殼之開口的大小減小時改良。然而,對於一些比較性技術可達成之蓋之開口的最小大小係大約250μm。因此,可能需要開發具有具有小開口(例如,小於大約 250μm之開口)之蓋或外殼的光學感測器模組。
根據本發明之一態樣,一種光學模組包括:一載體;一光發射器,其安置於該載體上;一光偵測器,其安置於該載體上;及一外殼,其安置於該載體上。該外殼界定曝露該光發射器之一第一開口及曝露該光偵測器之一第二開口。該光學模組進一步包括安置於該第一開口上之一第一光透射元件及安置於該第二開口上之一第二光透射元件。一第一不透明層安置於該第一光透射元件上,該第一不透明層界定一第一孔隙,且一第二不透明層安置於該第二光透射元件上,該第二不透明層界定一第二孔隙。
根據本發明之另一態樣,一種製造一光學模組之方法包括:提供一載體;將一光發射器置放於該載體上;將一光偵測器置放於該載體上;及將一外殼置放於該載體上,該外殼界定曝露該光發射器之一第一開口及曝露該光偵測器之一第二開口。該方法進一步包括:將一第一光透射元件置放於該第一開口上,該第一光透射元件包括界定一第一孔隙之一第一不透明層;及將一第二光透射元件置放於該第二開口上,該第二光透射元件包括界定一第二孔隙之一第二不透明層。
1:光學裝置
2:光學裝置
3A:半導體裝置
3B:半導體裝置
10:載體
11:第一電子組件
11e:發光區域
12:第二電子組件
12d:光偵測區域
13:第一光透射元件
13a:黏著層
13h:第一開口
14:第二光透射元件
14a:黏著層
14h:第二開口
15:蓋/外殼
15h1:第一腔體
15h2:第二腔體
15w:壁結構
16:第一不透明層
16h:第一孔隙
17:第二不透明層
17h:第二孔隙
23:第一光透射元件
23a:凸表面
24:第二光透射元件
24a:凸表面
31:第三不透明層
31h:開口
32:透鏡
33:濾光層
151:頂面
C1:中心
C2:中心
C3:中心
C4:中心
D1:寬度
D2:寬度
D3:寬度
D4:寬度
D5:寬度
D6:寬度
D7:寬度
D8:寬度
圖1說明根據本發明之一第一態樣的光學裝置之一些實施例的橫截面圖;圖2說明根據本發明之第一態樣的光學裝置之一些實施例的橫截面圖;圖3A說明根據本發明之一第二態樣的半導體裝置之一些實施例的橫截面圖; 圖3B說明根據本發明之第二態樣的半導體裝置之一些實施例的橫截面圖;且圖4A、圖4B及圖4C說明根據本發明之一些實施例之用於製造光學裝置的方法。
貫穿圖式及實施方式使用共同參考編號以指示相同或類似組件。結合隨附圖式,自以下實施方式,可最好地理解本發明。
相關申請案之交叉參考
本申請案主張2016年7月15日申請之美國臨時申請案第62/363,102號的權益及優先權,該臨時申請案之內容以全文引用的方式併入本文中。
圖1說明根據本發明之一第一態樣的光學裝置1之一些實施例的橫截面圖。光學裝置1包括載體10、第一電子組件11、第二電子組件12、第一光透射元件13、第二光透射元件14、蓋15、第一不透明層16及第二不透明層17。
載體10可包括(例如)印刷電路板,諸如紙基銅箔層合物、複合銅箔層合物或聚合物浸漬的基於玻璃纖維之銅箔層合物。載體10可包括互連結構,諸如複數個導電跡線或穿孔。在一些實施例中,載體10包括陶瓷材料或金屬板。在一些實施例中,載體10可包括基板,諸如有機基板或引線框。在一些實施例中,載體10可包括兩層基板,兩層基板包括核心層,及安置於載體10之上表面及下表面上的導電材料及/或結構。導電材料及/或結構可包括複數個跡線。
第一電子組件11安置於載體10上。第一電子組件11可包括發射晶粒或其他光學晶粒。舉例而言,第一電子組件11可包括發光二極體(LED)、雷 射二極體或可包括一或多個半導體層之另一裝置。該等半導體層可包括矽、碳化矽、氮化鎵或任何其他半導體材料。第一電子組件11可藉助於(例如)覆晶或線接合技術連接至載體10。在一些實施例中,第一電子組件11包括經由晶粒接合材料接合於載體10上之LED晶粒。該LED晶粒包括至少一個線接合墊。該LED晶粒藉由導電線電連接至載體10,該導電線之一端接合至LED晶粒之線接合墊,且該導電線之另一端接合至載體10之線接合墊。第一電子組件11具有面向第一光透射元件13之作用區(或發光區域)11e。
第二電子組件12安置於載體10上,且與第一電子組件11實體上分離。在一些實施例中,電子組件12可包括光偵測器,該光偵測器係(例如)PIN二極體(包括p型半導體區、純質半導體區及n型半導體區的二極體)或光二極體或光晶體管。電子組件12可(例如)藉助於覆晶或線接合技術連接至載體。第一電子組件12具有面向第二光透射元件14之作用區(或光偵測區域)12d。
蓋(或外殼)15安置於載體10上。蓋15具有安置於電子組件11與電子組件12之間的壁結構15w。蓋15係實質上不透明的,以防止由電子組件11發射之非所要光直接透射至電子組件12。
蓋15界定在第一電子組件11上方之第一開口13h及在第二電子組件12上方之第二開口14h。第一開口13h與第二開口14h彼此實體上分離。在一些實施例中,第一開口13h之寬度D1約等於或大於第一電子組件11之發光區域11e的面積(例如,大了約10%、大了約20%、大了約30%、大了大於約30%),且第二開口14h之寬度D3約等於或大於第二電子組件12之光偵測區域12d的面積(例如,大了約10%、大了約20%、大了約30%、大了大於 約30%)。舉例而言,第一開口13h在載體10上之投影面積約等於或大於第一電子組件11之發光區域11e的面積,且第二開口14h在載體10上之投影面積約等於或大於第二電子組件12之光偵測區域12d的面積。舉例而言,第一開口13h經組態使得第一電子組件11之發光區域11e藉由第一開口13h而自蓋15曝露(例如,完全曝露),此可有助於(例如,在製造期間或之後)準確地判定第一電子組件11之發光區域11e之中心的位置。另外,第二開口14h經組態使得第二電子組件12之光偵測區域12d藉由第二開口14h而自蓋15曝露(例如,完全曝露),此可有助於(例如,在製造期間或之後)準確地判定第二電子組件12之光偵測區域12d之中心的位置。
蓋15界定在第一開口13h上方之經組態以容納第一光透射元件13的第一腔體15h1(例如,第一開口13h由蓋15之構成腔體15h1之底部的一部分界定),且界定在第二開口14h上方之經組態以容納第二光透射元件14的第二腔體15h2(例如,第二開口14h由蓋15之構成腔體15h2之底部的一部分界定)。在一些實施例中,第一腔體15h1之寬度D5大於第一開口13h之寬度D1(例如,大了約10%、大了約20%、大了約30%、大了大於約30%),且第二腔體15h2之寬度D6大於第二開口14h之寬度D3(例如,大了約10%、大了約20%、大了約30%、大了大於約30%)。第一腔體15h1與第二腔體15h2彼此實體上分離。
第一光透射元件13安置於第一腔體15h1內及第一開口13h上。第一光透射元件13經組態以允許透射自第一電子組件11發射之光。在一些實施例中,第一光透射元件13係透鏡。在一些實施例中,第一光透射元件13之寬度D7大於第一開口13h之寬度D1且小於或約等於第一腔體15h1之寬度D5。在一些實施例中,黏著層13a(例如,在第一光透射元件13之寬度D7 小於第一腔體15h1之寬度D5的一些實施例中)安置於第一光透射元件13與第一腔體15h1之側壁之間。在一些實施例中,黏著層13a包括熱固化材料或光學固化材料。
第二光透射元件14安置於第二腔體15h2內及第二開口14h上。第二光透射元件14與第一光透射元件13實體上分離。第二光透射元件14經組態以允許透射由第二電子組件12接收之光。在一些實施例中,第二光透射元件14係透鏡。在一些實施例中,第二光透射元件14之寬度D8大於第一開口14h之寬度D3且小於或約等於第二腔體15h2之寬度D6。在一些實施例中,黏著層14a(例如,在第一光透射元件14之寬度D8小於第二腔體15h2之寬度D6的一些實施例中)安置於第二光透射元件13與第二腔體15h2之側壁之間。
第一不透明層16安置於第一光透射元件13上。在一些實施例中,第一不透明層16可包括光吸收層、油墨、光刻膠或金屬層。在一些實施例中,第一不透明層16自蓋15之頂面151凹入。第一不透明層16界定第一孔隙16h。由第一電子組件11發射之光選擇性地通過第一孔隙16h,且由第一電子組件11發射之其他光實質上由第一不透明層16阻擋或吸收。第一孔隙16h之中心與第一電子組件11之發光區域11e的中心實質上對準。第一孔隙16h之寬度D2小於第一開口13h之寬度D1。在一些實施例中,第一孔隙16h之寬度小於約250μm。
第二不透明層17安置於第二光透射元件14上。第二不透明層17與第一不透明層16實體上分離。在一些實施例中,第二不透明層17可包括光吸收層、油墨、光刻膠或金屬層。在一些實施例中,第二不透明層17自蓋15之頂面151凹入。第二不透明層17界定第二孔隙17h。朝向第二電子組件12發 射之光選擇性地通過第二孔隙17h,且由第二電子組件12發射之其他光實質上由第二不透明層17阻擋或吸收。第二孔隙17h之中心與第二電子組件12之光偵測區域12d的中心實質上對準。第二孔隙17h之寬度D4小於第二開口14h之寬度D3。在一些實施例中,第二孔隙17h之寬度小於約250μm。
在比較性光學模組中,孔隙藉由機器直接形成於蓋中;然而,由於一些此類製程之限制,蓋之孔隙的大小不小於約250μm。根據圖1中所展示之一些實施例,分別藉由在第一光透射元件13及第二光透射元件14上印刷或塗佈油墨來形成第一不透明層16及第二不透明層17。第一孔隙16h及第二孔隙17h係藉由微影技術形成,且因此孔隙之大小可易於按比例縮小(例如,縮小至小於約250μm)。藉由小型化此類孔隙,可減少可能由光偵測器無意中偵測到之非所要光(例如,來自外部環境之光),此可有助於減小由光學模組偵測到之物件的所量測或偵測到之位置與真實位置之間的偏離,因此增大光學模組之準確性。
在一些實施例中,包括光透射元件及不透明層之面板可置放於蓋上以覆蓋光發射器及光偵測器兩者。然而,由於不透明層之孔隙的相對位置可固定,因此可能難以同時控制不透明層之孔隙與光發射器或光偵測器的對準。舉例而言,不透明層之一個孔隙可與光發射器對準,但另一孔隙可與光偵測器不對準。根據圖1中所展示之實施例,光透射元件13、14及不透明層16、17個別地安置於第一電子組件11(例如,光發射器)上方及第二電子組件12(例如,光偵測器)上方。可個別地偵測且對準孔隙16h、17h之各別中心及光發射器11之發光區域11e的中心及光偵測器12之光偵測區域12d的中心,此可有助於減小對準偏移及增加光學裝置1之準確性。
圖2說明根據本發明之第一態樣的光學裝置2之一些實施例的橫截面 圖。光學裝置2類似於圖1中所展示之光學裝置1,惟光學裝置2之第一光透射元件23及第二光透射元件24係平凸透鏡除外。如圖2中所展示,第一光透射元件23之凸表面23a面向第一電子組件11,且第二光透射元件24之凸表面24a面朝第二電子組件12。凸表面23a可突出至由蓋15界定之孔隙13h中。凸表面24a可突出至由蓋15界定之孔隙14h中。平凸透鏡可增大到達電子組件之光的密度,此可有助於改良光學裝置2之效能。
圖3A說明根據本發明之一第二態樣的半導體裝置3A之一些實施例的橫截面圖。半導體裝置3A包括如圖1中所展示之光學裝置1、第三不透明層31及透鏡32。由短劃線描繪之光錐展示可透射至光學裝置1之電子組件或自該電子組件透射之光的一些可能路徑。在一些實施例中,替代,或除了光學裝置1以外,還可藉由圖2中所展示之光學裝置2實施半導體裝置3A。
第三不透明層31安置於光學裝置1上。第三不透明層31界定允許光通過之開口31h。透鏡32安置於第三不透明層31上。在一些實施例中,透鏡32可包括或可係蜂巢式電話之玻璃部分(例如,玻璃面板)、平板電腦、筆記型電腦、相機或裝備有近接感測器之其他電子裝置。
圖3B說明根據本發明之第二態樣的半導體裝置3B之一些實施例的橫截面圖。半導體裝置3B類似於圖3A中所展示之半導體裝置3A,惟第二不透明層31由濾光層33替換除外。由短劃線描繪之光錐展示可透射至光學裝置1之電子組件或自該電子組件透射之光的一些可能路徑。濾光層33不界定開口(例如,在光學裝置1之孔隙上方不含開口)。濾光層33經組態以允許具有預定波長之光通過。在一些實施例中,濾光層33結合第三不透明層31予以實施。
圖4A、圖4B及圖4C說明根據本發明之一些實施例之用於製造如圖1 中所展示之光學裝置1的方法。儘管在下文中關於複數個組件中之每一者描述一些製程、操作或步驟,但可關於多個組件中之一者或關於介於一個與完全複數個組件之間的某一數目而選擇性地執行彼等製程、操作或步驟中之任一者。
參考圖4A,提供載體10。第一電子組件11(例如,光發射器)及第二電子組件12(例如,光偵測器)置放於載體10上。第一電子組件11與第二電子組件12彼此實體上分離。
蓋(或外殼)15置放於載體10上。蓋15經配置以使得蓋15之壁結構15w安置於電子組件11與電子組件12之間,蓋15之第一開口13h安置於第一電子組件11上方,且蓋15之第二開口14h安置於第二電子組件12上方。在一些實施例中,第一開口13h之寬度D1約等於或大於第一電子組件11之發光區域11e的面積(例如,大了約10%、大了約20%、大了約30%、大了大於約30%),且第二開口14h之寬度D3約等於或大於第二電子組件12之光偵測區域12d的面積(例如,大了約10%、大了約20%、大了約30%、大了大於約30%)。舉例而言,第一開口13h經組態使得第一電子組件11之發光區域11e藉由第一開口13h而自蓋15曝露,此可有助於在後續操作中準確地判定第一電子組件11之發光區域11e之中心的位置。另外,第二開口14h經組態使得第二電子組件12之光偵測區域12d藉由第二開口13h而自蓋15曝露,此可有助於在後續操作中準確地判定第二電子組件12之光偵測區域12d之中心的位置。第一開口13h與第二開口14h彼此實體上分離。
蓋15具有在第一開口13h上方之第一腔體15h1及在第二開口14h上方之第二腔體15h2。在一些實施例中,第一腔體15h1之寬度D5大於第一開口13h之寬度D1,且第二腔體15h2之寬度D6大於第二開口14h之寬度D3。第 一腔體15h1與第二腔體15h2彼此實體上分離。
在一些製造製程實施例中,對於置放蓋15(例如,置放於載體10上)存在第一偏移容限,且對於置放第一電子組件11或第二電子組件12(例如,置放於載體10上)存在第二偏移容限。第一開口13h之寬度D1及第二開口14h之寬度D3中之至少一者大於或約等於以下各者之總和:第一偏移容限、第二偏移容限與(i)第一電子組件11之發光區域11e之面積的寬度或(ii)第二電子組件12之光偵測區域12d之面積的寬度。
參考圖4B,提供第一光透射元件13及第二光透射元件14。在一些實施例中,藉由將透射元件之面板劃分成多個個別光透射元件來提供第一光透射元件13及第二光透射元件14。在一些實施例中,第一光透射元件13之寬度D7大於第一開口13h之寬度D1,且小於或約等於第一腔體15h1之寬度D5(例如,係小了約10%、小了約20%、小了約30%或小了約小於30%)。第二光透射元件14之寬度D8大於第一開口14h之寬度D3及小於或約等於第二腔體15h2之寬度D6(例如,係小了約10%、小了約20%、小了約30%或小了約小於30%)。
第一不透明層16及第二不透明層17分別形成於第一光透射元件13及第二光透射元件14上。在一些實施例中,可藉由在第一光透射元件13及第二光透射元件14上鍍敷或塗佈油墨來形成第一不透明層16及第二不透明層17。接著形成第一孔隙16h及第二孔隙17h以穿透第一不透明層16及第二不透明層17及曝露第一光透射元件13及第二光透射元件14之一部分。在一些實施例中,第一孔隙16h及第二孔隙17h可藉由光刻法、化學蝕刻、雷射鑽孔或其他適合製程形成。在一些實施例中,第一孔隙16h之寬度D2小於第一開口13h之寬度D1,且第二孔隙17h之寬度D4小於第二開口14h之寬度 D3。在一些實施例中,第一孔隙16h及第二孔隙17h中之每一者的寬度小於約250μm。
可偵測或計算第一孔隙16h之中心C1及第二孔隙17h之中心C2。第一孔隙16h之中心C1或第二孔隙17h之中心C2由影像擷取裝置ICD及處理器判定。可以類似方式執行偵測或計算第一電子組件11之發光區域11e的中心C3及第二電子組件12之光偵測區域12d的中心C4。舉例而言,第一電子組件11之發光區域11e的中心C3或第二電子組件12之光偵測區域12d的中心C4由影像擷取裝置ICD及處理器判定。
參考圖4C,第一孔隙16h之中心C1與第一電子組件11之發光區域11e的中心C3對準,且第一光透射元件13連同第一不透明層16藉由(例如)取放操作安置於第一腔體15h1內。第二孔隙17h之中心C2與第二電子組件12之光偵測區域12d的中心C4對準,且第二光透射元件14連同第二不透明層17藉由(例如)取放操作安置於第二腔體15h2內。在一些實施例中,第一不透明層16及第二不透明層17自蓋15之頂面151凹入。
在一些實施例中,在置放第一光透射元件13及第二光透射元件14之前,可將黏著層13a鄰近於第一腔體15h1及第二腔體15h2之側壁置放,此舉可(例如,在第一光透射元件13之寬度D7及第二光透射元件14之寬度D8小於第一腔體15h1之寬度D5及第二腔體15h2之寬度D6的實施中)有助於緊固第一光透射元件13及第二光透射元件14。在一些實施例中,黏著層13a包括熱固化材料或光學固化材料。
如本文中所使用,術語「實質上」、「實質」、「大約」及「約」用以描述及考慮小的變化。舉例而言,當結合數值使用時,該等術語可指小於或等於彼數值之±10%的變化範圍,諸如,小於或等於±5%、小於或等於 ±4%、小於或等於±3%、小於或等於±2%、小於或等於±1%、小於或等於±0.5%、小於或等於±0.1%或者小於或等於±0.05%之變化範圍。作為另一實例,薄膜或層之厚度「實質上均勻」可指薄膜或層之平均厚度之小於或等於±10%(諸如小於或等於±5%、小於或等於±4%、小於或等於±3%、小於或等於±2%、小於或等於±1%、小於或等於±0.5%、小於或等於±0.1%、或小於或等於±0.05%)的標準差。術語「實質上共面」可指兩個表面沿著同一平面處於50μm內(諸如,沿著同一平面處於40μm內、30μm內、20μm內、10μm內或1μm內)。若(例如)兩個組件重疊或在200μm、150μm內、100μm內、50μm內、40μm內、30μm內、20μm內、10μm內或1μm內,則兩個組件可被視為「實質上對準」。若兩個表面或組件之間的角係(例如)90°±10°(諸如,±5°、±4°、±3°、±2°、±1°、±0.5°、±0.1°或±0.05°),則兩個表面或組件可被視為「實質上垂直」。當結合事件或情形使用時,術語「實質上」、「實質」、「大約」及「約」可指事件或情形精確發生之情況以及事件或情形近似發生之情況。
在對一些實施例之描述中,提供「在」另一組件「上」之一組件可涵蓋前一組件直接在後一組件上(例如,與後一組件實體接觸)的狀況以及一或多個介入組件位於前一組件與後一組件之間的狀況。
另外,有時在本文中按範圍格式呈現量、比率及其他數值。可理解,此類範圍格式用於便利及簡潔起見,且應被靈活地理解為不僅包括明確地指定為範圍限制之數值,而且包括涵蓋於該範圍內之所有個別數值或子範圍,如同明確地指定每一數值及子範圍一般。
儘管已參考本發明之特定實施例描述且說明本發明,但此等描述及說明並不限制本發明。熟習此項技術者可清楚地理解,可進行各種改變,且 可在實施例內替代等效元件而不會脫離如由所附申請專利範圍所界定之本發明的真實精神及範疇。說明可不必按比例繪製。歸因於製造製程之類中的變數,本發明中之藝術再現與實際設備之間可存在區別。可存在並未特定說明之本發明的其他實施例。應將本說明書及圖式視為說明性而非限制性的。可作出修改,以使特定情形、材料、物質組成、方法或製程適應於本發明之目標、精神及範疇。所有此類修改均意欲處於此處所附之申請專利範圍的範疇內。儘管已參考按特定次序執行之特定操作描述本文中所揭示的方法,但可理解,在不脫離本發明之教示的情況下,可組合、細分或重新定序此等操作以形成等效方法。因此,除非在本文中特定指示,否則操作之次序及分組並非本發明之限制。
1:光學裝置
10:載體
11:第一電子組件
11e:發光區域
12:第二電子組件
12d:光偵測區域
13:第一光透射元件
13a:黏著層
13h:第一開口
14:第二光透射元件
14a:黏著層
14h:第二開口
15:蓋/外殼
15h1:第一腔體
15h2:第二腔體
15w:壁結構
16:第一不透明層
16h:第一孔隙
17:第二不透明層
17h:第二孔隙
151:頂面
D1:寬度
D2:寬度
D3:寬度
D4:寬度
D5:寬度
D6:寬度
D7:寬度
D8:寬度

Claims (13)

  1. 一種製造一光學模組之方法,該方法包含:(a)提供一載體;(b)將一光發射器置放於該載體上;(c)將一光偵測器置放於該載體上;(d)將一外殼置放於該載體上,該外殼界定曝露該光發射器之一第一開口及曝露該光偵測器之一第二開口;(e)藉由一第一取放操作將一第一光透射元件置放於該第一開口上,該第一光透射元件包含界定一第一孔隙之一第一不透明層;及(f)藉由一第二取放操作將一第二光透射元件置放於該第二開口上,且使該第二光透射元件透過該外殼與該第一光透射元件隔開,該第二光透射元件包含界定一第二孔隙之一第二不透明層,其中分別地執行該第一取放操作及該第二取放操作以分別地對齊並放置該第一光透射元件及該第二光透射元件。
  2. 如請求項1之方法,其中該操作(e)進一步包含判定該第一孔隙之一中心相對於該光發射器之一發光區域之一中心的一對準,且該操作(f)進一步包含判定該第二孔隙之一中心相對於該光偵測器之一光偵測區域之一中心的一對準。
  3. 如請求項2之方法,其中判定該對準係使用一影像擷取裝置及一處理 器。
  4. 如請求項1之方法,其進一步包含在該操作(e)之前劃分一光透射元件之一面板以形成該第一光透射元件及該第二光透射元件。
  5. 如請求項1之方法,其中該外殼界定:一第一腔體,其經組態以容納該第一光透射元件;及一第二腔體,其經組態以容納該第二光透射元件。
  6. 如請求項5之方法,其進一步包含:在該第一光透射元件與該第一腔體之一側壁之間形成一黏著層;及在該第二光透射元件與該第二腔體之一側壁之間形成一黏著層。
  7. 如請求項1之方法,其中該第一不透明層或該第二不透明層之一表面自該外殼之一頂面凹入。
  8. 如請求項1之方法,其中該第一光透射元件與該第二光透射元件實體上間隔開。
  9. 如請求項1之方法,其中該第一不透明層與該第二不透明層實體上間隔開。
  10. 如請求項1之方法,其中該第一開口在該載體上之一投影面積大於該 光發射器之一發光區域的一面積,且該第二開口在該載體上之一投影面積大於該光偵測器之一光偵測區域的一面積。
  11. 如請求項1之方法,其中將該外殼置放於該載體上具有一第一偏移容限,且將該光發射器或該光偵測器置放於該載體上具有一第二偏移容限,且該第一開口或該第二開口之一寬度大於或等於以下各者之一總和:該第一偏移容限、該第二偏移容限與(i)該光發射器之發光區域的一寬度或(ii)該光偵測器之該光偵測區域的一寬度。
  12. 如請求項1之方法,其中該第一不透明層及該第二不透明層係光吸收層或金屬層。
  13. 如請求項1之方法,其中該外殼界定一第一腔體,其經組態以容納該第一光透射元件,該方法進一步包括:在置放該第一光透射元件於該第一開口上之前,將一黏著層置放於該第一腔體的一壁部分。
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Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017175504A1 (ja) * 2016-04-04 2017-10-12 京セラ株式会社 計測センサ用パッケージおよび計測センサ
US20180017741A1 (en) * 2016-07-15 2018-01-18 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
US20180315894A1 (en) * 2017-04-26 2018-11-01 Advanced Semiconductor Engineering, Inc. Semiconductor device package and a method of manufacturing the same
US11430906B2 (en) * 2018-07-26 2022-08-30 Advanced Semiconductor Engineering, Inc. Optical device including lid having first and second cavity with inclined sidewalls
US10811400B2 (en) * 2018-09-28 2020-10-20 Apple Inc. Wafer level optical module
US11164900B2 (en) 2018-10-08 2021-11-02 Omnivision Technologies, Inc. Image sensor chip-scale-package
US11402719B2 (en) * 2018-12-11 2022-08-02 E Ink Corporation Retroreflective electro-optic displays
JP7417029B2 (ja) * 2018-12-14 2024-01-18 日亜化学工業株式会社 発光装置及びその製造方法
CN109638634A (zh) * 2018-12-14 2019-04-16 上海灿瑞科技股份有限公司 一种镭射光发射装置
CN111434436A (zh) * 2019-01-11 2020-07-21 泰科电子科技(苏州工业园区)有限公司 激光焊接方法
CN109980497A (zh) * 2019-04-15 2019-07-05 上海灿瑞科技股份有限公司 雷射光发光装置
US11276797B2 (en) * 2019-04-15 2022-03-15 Advanced Semiconductor Engineering, Inc. Optical device and method of manufacturing the same
TWI811557B (zh) * 2020-07-31 2023-08-11 立碁電子工業股份有限公司 光學感測模組
DE112021006488T5 (de) * 2020-12-15 2023-11-02 Ams International Ag Verpackung optischer systeme
US20220216171A1 (en) * 2021-01-06 2022-07-07 Huawei Technologies Co., Ltd. Chip package structure, preparation method, and electronic device
CN116825774A (zh) * 2022-03-17 2023-09-29 三赢科技(深圳)有限公司 封装结构、封装结构制作方法、摄像模组及电子装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102299162A (zh) * 2010-06-28 2011-12-28 索尼公司 光电转换装置、光电转换装置的封装结构和制造方法
US20130050526A1 (en) * 2011-08-24 2013-02-28 Brian Keelan Super-resolution imaging systems
TW201349467A (zh) * 2012-04-05 2013-12-01 Heptagon Micro Optics Pte Ltd 光電模組
CN103579015A (zh) * 2012-07-18 2014-02-12 嘉盛马来西亚公司 半导体封装和形成半导体封装的方法
US8957380B2 (en) * 2009-06-30 2015-02-17 Avago Technologies General Ip (Singapore) Pte. Ltd. Infrared attenuating or blocking layer in optical proximity sensor
TW201519479A (zh) * 2013-07-30 2015-05-16 Heptagon Micro Optics Pte Ltd 具有屏蔽以減少光漏或漫射光的光電模組及此模組之製造方法
US20150243802A1 (en) * 2012-08-30 2015-08-27 Kyocera Corporation Light receiving and emitting element and sensor device using same

Family Cites Families (106)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6124974A (en) * 1996-01-26 2000-09-26 Proxemics Lenslet array systems and methods
US20080136955A1 (en) * 1996-09-27 2008-06-12 Tessera North America. Integrated camera and associated methods
US6235141B1 (en) * 1996-09-27 2001-05-22 Digital Optics Corporation Method of mass producing and packaging integrated optical subsystems
US6096155A (en) * 1996-09-27 2000-08-01 Digital Optics Corporation Method of dicing wafer level integrated multiple optical elements
DE19958229B4 (de) * 1998-12-09 2007-05-31 Fuji Electric Co., Ltd., Kawasaki Optisches Halbleiter-Sensorbauelement
US6635941B2 (en) * 2001-03-21 2003-10-21 Canon Kabushiki Kaisha Structure of semiconductor device with improved reliability
JP4510403B2 (ja) * 2003-05-08 2010-07-21 富士フイルム株式会社 カメラモジュール及びカメラモジュールの製造方法
US7255494B2 (en) * 2003-05-23 2007-08-14 Intel Corporation Low-profile package for housing an optoelectronic assembly
US6860652B2 (en) * 2003-05-23 2005-03-01 Intel Corporation Package for housing an optoelectronic assembly
JP2005038956A (ja) * 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 光部品とその製造方法
KR20060059873A (ko) * 2003-08-22 2006-06-02 코니카 미놀타 옵토 인코포레이티드 고체 촬상 장치 및 상기 고체 촬상 장치를 구비한 촬상장치 및 고체 촬상 장치의 마이크로렌즈 어레이 제조 방법
US7199438B2 (en) * 2003-09-23 2007-04-03 Advanced Semiconductor Engineering, Inc. Overmolded optical package
US8049806B2 (en) * 2004-09-27 2011-11-01 Digitaloptics Corporation East Thin camera and associated methods
US7688309B2 (en) * 2004-07-06 2010-03-30 Logitech Europe S.A. Optical displacement module and method to reduce the size of an optical pointing device thereof
TWI297920B (en) * 2006-02-22 2008-06-11 Advanced Semiconductor Eng Compact camera module and its substrate
JP4708214B2 (ja) * 2006-02-23 2011-06-22 浜松ホトニクス株式会社 光送受信デバイス
CN100592130C (zh) * 2007-02-28 2010-02-24 鸿富锦精密工业(深圳)有限公司 相机模组的对位组装系统及对位组装方法
KR100969987B1 (ko) * 2008-01-10 2010-07-15 연세대학교 산학협력단 광학패키지 웨이퍼스케일 어레이 및 그 제조방법
JP5009209B2 (ja) * 2008-03-21 2012-08-22 シャープ株式会社 ウエハ状光学装置およびその製造方法、電子素子ウエハモジュール、センサウエハモジュール、電子素子モジュール、センサモジュール、電子情報機器
US8866920B2 (en) * 2008-05-20 2014-10-21 Pelican Imaging Corporation Capturing and processing of images using monolithic camera array with heterogeneous imagers
US7773317B2 (en) * 2008-07-01 2010-08-10 Aptina Imaging Corp. Lens system with symmetrical optics
US7920339B2 (en) * 2008-07-02 2011-04-05 Aptina Imaging Corporation Method and apparatus providing singlet wafer lens system with field flattener
CN101387513B (zh) * 2008-08-28 2010-06-23 上海科勒电子科技有限公司 距离检测感应装置
US20100177411A1 (en) * 2009-01-09 2010-07-15 Shashikant Hegde Wafer level lens replication on micro-electrical-mechanical systems
US8450821B2 (en) * 2009-03-26 2013-05-28 Micron Technology, Inc. Method and apparatus providing combined spacer and optical lens element
US8779361B2 (en) * 2009-06-30 2014-07-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Optical proximity sensor package with molded infrared light rejection barrier and infrared pass components
KR101648540B1 (ko) * 2009-08-13 2016-08-16 삼성전자주식회사 웨이퍼-레벨 렌즈 모듈 및 이를 구비하는 촬상 장치
EP2502115A4 (en) * 2009-11-20 2013-11-06 Pelican Imaging Corp RECORDING AND PROCESSING IMAGES THROUGH A MONOLITHIC CAMERA ARRAY WITH HETEROGENIC IMAGE CONVERTER
US9733357B2 (en) * 2009-11-23 2017-08-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Infrared proximity sensor package with improved crosstalk isolation
TWI425597B (zh) * 2009-12-31 2014-02-01 Kingpak Tech Inc 具有黑色膠體之影像感測器封裝結構
US8937377B2 (en) * 2010-10-08 2015-01-20 Avago Technologies General Ip (Singapore) Pte. Ltd. Package-on-package proximity sensor module
FR2966979A1 (fr) * 2010-10-28 2012-05-04 St Microelectronics Grenoble 2 Dispositif optique, procede pour sa fabrication et boitier electronique comprenant ce dispositif optique
KR20120100821A (ko) * 2011-03-04 2012-09-12 삼성전자주식회사 다시점 영상 디스플레이 장치
US8604436B1 (en) * 2011-03-24 2013-12-10 Maxim Integrated Products, Inc. Proximity sensor device
FR2974449A1 (fr) * 2011-04-22 2012-10-26 Commissariat Energie Atomique Circuit integre imageur et dispositif de capture d'images stereoscopiques
JP5694042B2 (ja) * 2011-04-28 2015-04-01 三洋電機株式会社 太陽電池モジュールの評価方法及び太陽電池モジュールの製造方法
TWI467262B (zh) * 2011-06-10 2015-01-01 Sharp Kk 透鏡調芯裝置及攝像透鏡
US20130265459A1 (en) * 2011-06-28 2013-10-10 Pelican Imaging Corporation Optical arrangements for use with an array camera
CN103512595B (zh) * 2011-07-19 2016-08-10 赫普塔冈微光有限公司 光电模块及其制造方法与包含光电模块的电器及装置
SG2014005805A (en) * 2011-08-10 2014-06-27 Heptagon Micro Optics Pte Ltd Opto-electronic module and method for manufacturing the same
US8587103B2 (en) * 2011-10-27 2013-11-19 Lite-On Singapore Pte. Ltd. Integrated sensing package structure
US9627572B2 (en) * 2012-04-25 2017-04-18 Kyocera Corporation Light receiving and emitting element module and sensor device using same
KR102208832B1 (ko) * 2012-05-17 2021-01-29 에이엠에스 센서스 싱가포르 피티이. 리미티드. 웨이퍼 스택 조립
US9570648B2 (en) * 2012-06-15 2017-02-14 Intersil Americas LLC Wafer level optical proximity sensors and systems including wafer level optical proximity sensors
US9823115B2 (en) * 2012-07-12 2017-11-21 Pixart Imaging Inc. Packaged optical device having a specular reflection configuration
US9634051B2 (en) * 2012-07-17 2017-04-25 Heptagon Micro Optics Pte. Ltd. Optical devices, in particular computational cameras, and methods for manufacturing the same
GB2505675A (en) * 2012-09-06 2014-03-12 St Microelectronics Pte Ltd A cover for a sensor package with two transparent portions
JP5532104B2 (ja) * 2012-10-18 2014-06-25 オムロン株式会社 面光源装置、液晶表示装置及びモバイル機器
TWI490521B (zh) * 2012-11-14 2015-07-01 Pixart Imaging Inc 近接式光感測器及製作方法
EP2735891B1 (en) * 2012-11-27 2023-01-11 ams AG Proximity sensor arrangement
US9465442B2 (en) * 2013-02-05 2016-10-11 Apple Inc. Optical proximity sensor system having reduced sensitivity to distinct near-field optical effects
US9291495B2 (en) * 2013-03-06 2016-03-22 Apple Inc. Proximity sensor with combined light sensor having an increased viewing angle
CN104123179A (zh) * 2013-04-29 2014-10-29 敦南科技股份有限公司 中断控制方法及其电子系统
US9094593B2 (en) * 2013-07-30 2015-07-28 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
JP2016528496A (ja) * 2013-08-02 2016-09-15 ベリフード, リミテッドVerifood, Ltd. 分光器システムおよび方法、分光分析デバイスおよび方法
CN103400836B (zh) * 2013-08-12 2016-06-01 日月光半导体制造股份有限公司 近接传感器封装构造及其制作方法
EP3072155B1 (en) * 2013-11-22 2019-05-08 Heptagon Micro Optics Pte. Ltd. Compact optoelectronic modules
US10293441B2 (en) * 2013-12-19 2019-05-21 Isolution Co., Ltd. Apparatus and method for aligning optical axes of lenses and assembling camera module
JP6262536B2 (ja) * 2014-01-08 2018-01-17 新光電気工業株式会社 カメラモジュールの製造方法
US9322756B2 (en) * 2014-02-21 2016-04-26 Maxim Integrated Products, Inc. Nondispersive infrared micro-optics sensor for blood alcohol concentration measurements
TWI667767B (zh) * 2014-03-31 2019-08-01 菱生精密工業股份有限公司 Package structure of integrated optical module
TWI619208B (zh) * 2014-03-31 2018-03-21 具聚光結構之光學模組的封裝方法
WO2015160309A1 (en) * 2014-04-17 2015-10-22 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having features for reducing the visual impact of interior components
KR101785879B1 (ko) * 2014-07-23 2017-10-16 헵타곤 마이크로 옵틱스 피티이. 리미티드 수직 정렬 피처들을 포함하는 광 방출기 및 광 검출기 모듈들
CN104332524B (zh) * 2014-08-26 2018-01-09 日月光半导体制造股份有限公司 电子装置、光学模块及其制造方法
US9490378B2 (en) * 2014-09-19 2016-11-08 Avago Technologies General Ip (Singapore) Pte. Ltd. Cone shaped focusing lens
CN105679753B (zh) * 2014-11-20 2018-05-08 日月光半导体制造股份有限公司 光学模块、其制造方法及电子装置
US9735135B2 (en) * 2014-12-04 2017-08-15 Pixart Imaging (Penang) Sdn. Bhd. Optical sensor package and optical sensor assembly
CN105789197B (zh) * 2014-12-25 2019-03-15 日月光半导体制造股份有限公司 光学模块、其制造方法以及具有光学模块的电子装置
CN105895625B (zh) * 2014-12-25 2018-09-21 意法半导体有限公司 用于邻近传感器的晶片级封装
US9525094B2 (en) * 2015-03-27 2016-12-20 Stmicroelectronics (Grenoble 2) Sas Proximity and ranging sensor
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
TWI585911B (zh) * 2015-08-12 2017-06-01 精材科技股份有限公司 一種感應器封裝體及其製造方法
US10061057B2 (en) * 2015-08-21 2018-08-28 Stmicroelectronics (Research & Development) Limited Molded range and proximity sensor with optical resin lens
KR102668526B1 (ko) * 2015-10-07 2024-05-24 에이엠에스-오스람 아시아 퍼시픽 피티이. 리미티드 몰드 회로 기판
CN205211751U (zh) * 2015-11-02 2016-05-04 意法半导体有限公司 邻近传感器以及电子设备
US9976894B2 (en) * 2015-11-17 2018-05-22 Heptagon Micro Optics Pte. Ltd. Optical device
US10190908B2 (en) * 2015-11-18 2019-01-29 Heptagon Micro Optics Pte. Ltd. Optical devices and methods of making same
JP6314968B2 (ja) * 2015-12-25 2018-04-25 日亜化学工業株式会社 発光装置
US9911877B2 (en) * 2016-01-14 2018-03-06 Advanced Semiconductor Engineering, Inc. Electronic device, package structure and method of manufacturing the same
CN107102509B (zh) * 2016-02-19 2020-05-26 台湾扬昕股份有限公司 投影屏幕
EP3211453A1 (en) * 2016-02-26 2017-08-30 ams AG Optical proximity sensor arrangement and method for producing an optical proximity sensor arrangement
US11069667B2 (en) * 2016-03-31 2021-07-20 Stmicroelectronics Pte Ltd Wafer level proximity sensor
US10217789B2 (en) * 2016-04-06 2019-02-26 Omnivision Technologies, Inc. Interposer and chip-scale packaging for wafer-level camera
US10069051B2 (en) * 2016-04-08 2018-09-04 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
EP3454724B1 (en) * 2016-05-10 2023-12-06 Apple Inc. Systems and methods for non-pulsatile blood volume measurements
US10720545B2 (en) * 2016-05-27 2020-07-21 Rohm Co., Ltd. Semiconductor device
US10551596B2 (en) * 2016-06-29 2020-02-04 Ams Sensors Singapore Pte. Ltd. Optical and optoelectronic assemblies including micro-spacers, and methods of manufacturing the same
US9911890B2 (en) * 2016-06-30 2018-03-06 Stmicroelectronics Pte Ltd Optical sensor package including a cavity formed in an image sensor die
JP6626974B2 (ja) * 2016-07-14 2019-12-25 京セラ株式会社 光センサ用パッケージ、光センサ装置および電子モジュール
US20180017741A1 (en) * 2016-07-15 2018-01-18 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
CN107785357A (zh) * 2016-08-26 2018-03-09 意法半导体研发(深圳)有限公司 用于光学传感器封装体的防粘胶溢出帽盖
FR3055509B1 (fr) * 2016-08-26 2018-09-21 Stmicroelectronics (Grenoble 2) Sas Boitier electronique comprenant un capot a rainure
TWI631687B (zh) * 2016-12-30 2018-08-01 菱生精密工業股份有限公司 Package structure of remote sensor and packaging method thereof
FR3061630B1 (fr) * 2017-01-03 2021-07-09 St Microelectronics Grenoble 2 Procede de fabrication d'un capot pour boitier electronique et boitier electronique comprenant un capot
US10714638B2 (en) * 2017-01-13 2020-07-14 Ams Sensors Singapore Pte. Ltd. Optoelectronic modules and methods for manufacturing the same
CN109213385B (zh) * 2017-07-05 2021-07-20 光宝科技新加坡私人有限公司 移动装置及其近接感测模块
US10529759B2 (en) * 2017-09-11 2020-01-07 Pixart Imaging Inc. Optical sensor package module and manufacturing method thereof
FR3073120A1 (fr) * 2017-11-02 2019-05-03 Stmicroelectronics (Grenoble 2) Sas Capot d'encapsulation pour boitier electronique
FR3073356A1 (fr) * 2017-11-06 2019-05-10 Stmicroelectronics (Grenoble 2) Sas Capot d'encapsulation pour boitier electronique et procede de fabrication
FR3075465B1 (fr) * 2017-12-15 2020-03-27 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
FR3075467B1 (fr) * 2017-12-15 2020-03-27 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
FR3078855A1 (fr) * 2018-03-08 2019-09-13 St Microelectronics Grenoble 2 Sas Capot d'encapsulation pour boitier electronique et procede de fabrication
FR3080218B1 (fr) * 2018-04-11 2022-02-11 St Microelectronics Grenoble 2 Dispositif electronique comprenant des puces electroniques
TWI681424B (zh) * 2018-06-11 2020-01-01 海華科技股份有限公司 光學元件、光學組件及光學模組
US10943894B2 (en) * 2018-10-05 2021-03-09 Asahi Kasei Microdevices Corporation Optical device having lens block having recessed portion covering photoelectric conversion block

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8957380B2 (en) * 2009-06-30 2015-02-17 Avago Technologies General Ip (Singapore) Pte. Ltd. Infrared attenuating or blocking layer in optical proximity sensor
CN102299162A (zh) * 2010-06-28 2011-12-28 索尼公司 光电转换装置、光电转换装置的封装结构和制造方法
US20130050526A1 (en) * 2011-08-24 2013-02-28 Brian Keelan Super-resolution imaging systems
TW201349467A (zh) * 2012-04-05 2013-12-01 Heptagon Micro Optics Pte Ltd 光電模組
CN103579015A (zh) * 2012-07-18 2014-02-12 嘉盛马来西亚公司 半导体封装和形成半导体封装的方法
US20150243802A1 (en) * 2012-08-30 2015-08-27 Kyocera Corporation Light receiving and emitting element and sensor device using same
TW201519479A (zh) * 2013-07-30 2015-05-16 Heptagon Micro Optics Pte Ltd 具有屏蔽以減少光漏或漫射光的光電模組及此模組之製造方法

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