CN107634050A - 半导体封装装置及其制造方法 - Google Patents

半导体封装装置及其制造方法 Download PDF

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Publication number
CN107634050A
CN107634050A CN201710569372.XA CN201710569372A CN107634050A CN 107634050 A CN107634050 A CN 107634050A CN 201710569372 A CN201710569372 A CN 201710569372A CN 107634050 A CN107634050 A CN 107634050A
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CN
China
Prior art keywords
transmission component
light transmission
opening
opaque layer
carrier
Prior art date
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Pending
Application number
CN201710569372.XA
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English (en)
Inventor
何信颖
陈盈仲
赖律名
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Advanced Semiconductor Engineering Inc
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Advanced Semiconductor Engineering Inc
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Publication date
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Publication of CN107634050A publication Critical patent/CN107634050A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0018—Redirecting means on the surface of the light guide
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    • G02B6/002—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
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    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
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Abstract

本发明提供一种光学模块，其包含：载体；光发射器，其安置于所述载体上；光检测器，其安置于所述载体上；及外壳，其安置于所述载体上。所述外壳界定曝露所述光发射器的第一开口及曝露所述光检测器的第二开口。所述光学模块进一步包含安置于所述第一开口上的第一光透射元件及安置于所述第二开口上的第二光透射元件。第一不透明层安置于所述第一光透射元件上，所述第一不透明层界定第一孔隙，且第二不透明层安置于所述第二光透射元件上，所述第二不透明层界定第二孔隙。

Description

半导体封装装置及其制造方法
相关申请案的交叉参考
本申请案主张2016年7月15日申请的美国临时申请案第62/363,102号的权益及优先权，所述临时申请案的内容以全文引用的方式并入本文中。
技术领域
本发明涉及一种半导体封装装置，且涉及一种包含一或多个发光组件的半导体封装装置。
背景技术
在光学传感器模块中，盖的孔隙或外壳与光发射器或光检测器的对准可能会影响传感器模块的性能。然而，从所要位置的偏移可能在制造光学传感器模块期间发生。举例来说，裸片相对于载体的安装区域(安装或放置裸片的区域)的偏移(例如，移位)可大约介于25μm到50μm的范围内，盖的面板或外壳相对于载体的偏移可大约为100μm，且盖的孔隙的偏移可大约为30μm。即使盖的面板划分成个别盖，大约50μm的一或多个移位也有可能在装配裸片及个别盖时发生。可能需要减小此类偏移(例如，在制造光学传感器模块期间产生的偏移)。
另外，盖或外壳的开口(例如，光通过的开口)(其由盖或外壳界定)的大小对于一些光学定位应用(例如，接近性传感器)准确地测量对象与光学传感器模块之间的距离是重要的。测量结果的准确性可在盖或外壳的开口的大小减小时改进。然而，对于一些比较性技术可实现的盖的开口的最小大小为大约250μm。因此，可能需要开发具有拥有小开口(例如，小于大约250μm的开口)的盖或外壳的光学传感器模块。
发明内容
根据本发明的一方面，一种光学模块包含：载体；光发射器，其安置于所述载体上；光检测器，其安置于所述载体上；及外壳，其安置于所述载体上。所述外壳界定曝露所述光发射器的第一开口及曝露所述光检测器的第二开口。所述光学模块进一步包含安置于所述第一开口上的第一光透射元件及安置于所述第二开口上的第二光透射元件。第一不透明层安置于所述第一光透射元件上，所述第一不透明层界定第一孔隙，且第二不透明层安置于所述第二光透射元件上，所述第二不透明层界定第二孔隙。
根据本发明的另一方面，一种制造光学模块的方法包含：提供载体；将光发射器放置于所述载体上；将光检测器放置于所述载体上；及将外壳放置于所述载体上，所述外壳界定曝露所述光发射器的第一开口及曝露所述光检测器的第二开口。所述方法进一步包含：将第一光透射元件放置于所述第一开口上，所述第一光透射元件包含界定第一孔隙的第一不透明层；及将第二光透射元件放置于所述第二开口上，所述第二光透射元件包含界定第二孔隙的第二不透明层。
附图说明
图1说明根据本发明的第一方面的光学装置的一些实施例的横截面图；
图2说明根据本发明的第一方面的光学装置的一些实施例的横截面图；
图3A说明根据本发明的第二方面的半导体装置的一些实施例的横截面图；
图3B说明根据本发明的第二方面的半导体装置的一些实施例的横截面图；且
图4A、4B及4C说明根据本发明的一些实施例的用于制造光学装置的方法。
贯穿图式及实施方式使用共同参考编号以指示相同或类似组件。结合随附图式，从以下实施方式，可最好地理解本发明。
具体实施方式
图1说明根据本发明的第一方面的光学装置1的一些实施例的横截面图。光学装置1包含载体10、第一电子组件11、第二电子组件12、第一光透射元件13、第二光透射元件14、盖15、第一不透明层16及第二不透明层17。
载体10可包含(例如)印刷电路板，例如纸基铜箔层合物、复合铜箔层合物或聚合物浸渍等基于玻璃纤维的铜箔层合物。载体10可包含互连结构，例如多个导电迹线或穿孔。在一些实施例中，载体10包含陶瓷材料或金属板。在一些实施例中，载体10可包含衬底，例如有机衬底或引线框。在一些实施例中，载体10可包含两层衬底，两层衬底包含核心层，及安置于载体10的上表面及下表面上的导电材料及/或结构。导电材料及/或结构可包含多个迹线。
第一电子组件11安置于载体10上。第一电子组件11可包含发射裸片或其它光学裸片。举例来说，第一电子组件11可包含发光二极管(LED)、激光二极管或可包含一或多个半导体层的另一装置。所述半导体层可包含矽、碳化矽、氮化镓或任何其它半导体材料。第一电子组件11可藉助于(例如)覆晶或线接合技术连接到载体10。在一些实施例中，第一电子组件11包含经由裸片接合材料接合于载体10上的LED裸片。所述LED裸片包含至少一个线接合垫。所述LED裸片通过导电线电连接到载体10，所述导电线的一端接合到LED裸片的线接合垫，且所述导电线的另一端接合到载体10的线接合垫。第一电子组件11具有面向第一光透射元件13的作用区(或发光区域)11e。
第二电子组件12安置于载体10上，且与第一电子组件11物理上分离。在一些实施例中，电子组件12可包含光检测器，所述光检测器为(例如)PIN二极管(包含p型半导体区、纯质半导体区及n型半导体区的二极管)或光二极管或光晶体管。电子组件12可(例如)藉助于覆晶或线接合技术连接到载体。第一电子组件12具有面向第二光透射元件14的作用区(或光检测区域)12d。
盖(或外壳)15安置于载体10上。盖15具有安置于电子组件11与电子组件12之间的壁结构15w。盖15实质上不透明，以防止由电子组件11发射的非所要光直接透射到电子组件12。
盖15界定在第一电子组件11上方的第一开口13h及在第二电子组件12上方的第二开口14h。第一开口13h与第二开口14h彼此物理上分离。在一些实施例中，第一开口13h的宽度D1约等于或大于第一电子组件11的发光区域11e的面积(例如，大了约10％、大了约20％、大了约30％、大了大于约30％)，且第二开口14h的宽度D3约等于或大于第二电子组件12的光检测区域12d的面积(例如，大了约10％、大了约20％、大了约30％、大了大于约30％)。举例来说，第一开口13h在载体10上的突起的面积约等于或大于第一电子组件11的发光区域11e的面积，且第二开口14h在载体10上的突起的面积约等于或大于第二电子组件12的光检测区域12d的面积。举例来说，第一开口13h经配置使得第一电子组件11的发光区域11e通过第一开口13h而从盖15曝露(例如，完全曝露)，此可有助于(例如，在制造期间或之后)准确地确定第一电子组件11的发光区域11e的中心的位置。另外，第二开口14h经配置使得第二电子组件12的光检测区域12d通过第二开口14h而从盖15曝露(例如，完全曝露)，此可有助于(例如，在制造期间或之后)准确地确定第二电子组件12的光检测区域12d的中心的位置。
盖15界定在第一开口13h上方的经配置以容纳第一光透射元件13的第一腔体15h1(例如，第一开口13h由盖15的构成腔体15h1的底部的一部分界定)，且界定在第二开口14h上方的经配置以容纳第二光透射元件14的第二腔体15h2(例如，第二开口14h由盖15的构成腔体15h2的底部的一部分界定)。在一些实施例中，第一腔体15h1的宽度D5大于第一开口13h的宽度D1(例如，大了约10％、大了约20％、大了约30％、大了大于约30％)，且第二腔体15h2的宽度D6大于第二开口14h的宽度D3(例如，大了约10％、大了约20％、大了约30％、大了大于约30％)。第一腔体15h1与第二腔体15h2彼此物理上分离。
第一光透射元件13安置于第一腔体15h1内及第一开口13h上。第一光透射元件13经配置以允许透射从第一电子组件11发射的光。在一些实施例中，第一光透射元件13为透镜。在一些实施例中，第一光透射元件13的宽度D7大于第一开口13h的宽度D1且小于或约等于第一腔体15h1的宽度D5。在一些实施例中，粘着层13a(例如，在第一光透射元件13的宽度D7小于第一腔体15h1的宽度D5的一些实施例中)安置于第一光透射元件13与第一腔体15h1的侧壁之间。在一些实施例中，粘着层13a包含热固化材料或光学固化材料。
第二光透射元件14安置于第二腔体15h2内及第二开口14h上。第二光透射元件14与第一光透射元件13物理上分离。第二光透射元件14经配置以允许透射由第二电子组件12接收的光。在一些实施例中，第二光透射元件14为透镜。在一些实施例中，第二光透射元件14的宽度D8大于第一开口14h的宽度D3且小于或约等于第二腔体15h2的宽度D6。在一些实施例中，粘着层14a(例如，在第一光透射元件14的宽度D8小于第二腔体15h2的宽度D6的一些实施例中)安置于第二光透射元件13与第二腔体15h2的侧壁之间。
第一不透明层16安置于第一光透射元件13上。在一些实施例中，第一不透明层16可包含光吸收层、油墨、光刻胶或金属层。在一些实施例中，第一不透明层16从盖15的顶面151凹入。第一不透明层16界定第一孔隙16h。由第一电子组件11发射的光选择性地通过第一孔隙16h，且由第一电子组件11发射的其它光实质上由第一不透明层16阻挡或吸收。第一孔隙16h的中心与第一电子组件11的发光区域11e的中心实质上对准。第一孔隙16h的宽度D2小于第一开口13h的宽度D1。在一些实施例中，第一孔隙16h的宽度小于约250μm。
第二不透明层17安置于第二光透射元件14上。第二不透明层17与第一不透明层16物理上分离。在一些实施例中，第二不透明层17可包含光吸收层、油墨、光刻胶或金属层。在一些实施例中，第二不透明层17从盖15的顶面151凹入。第二不透明层17界定第二孔隙17h。朝向第二电子组件12发射的光选择性地通过第二孔隙17h，且由第二电子组件12发射的其它光实质上由第二不透明层17阻挡或吸收。第二孔隙17h的中心与第二电子组件12的光检测区域12d的中心实质上对准。第二孔隙17h的宽度D4小于第二开口14h的宽度D3。在一些实施例中，第二孔隙17h的宽度小于约250μm。
在比较性光学模块中，孔隙通过机器直接形成于盖中；然而，由于一些此类工艺的限制，盖的孔隙的大小不小于约250μm。根据图1中所展示的一些实施例，分别通过在第一光透射元件13及第二光透射元件14上印刷或涂佈油墨来形成第一不透明层16及第二不透明层17。第一孔隙16h及第二孔隙17h是通过微影技术形成，且因此孔隙的大小可易于按比例缩小(例如，缩小到小于约250μm)。通过小型化此类孔隙，可减少可能由光检测器无意中检测到的非所要光(例如，来自外部环境的光)，此可有助于减小由光学模块检测到的对象的所测量或检测到的位置与真实位置之间的偏离，因此增大光学模块的准确性。
在一些实施例中，包含光透射元件及不透明层的面板可放置于盖上以覆盖光发射器及光检测器两者。然而，由于不透明层的孔隙的相对位置可固定，因此可能难以同时控制不透明层的孔隙与光发射器或光检测器的对准。举例来说，不透明层的一个孔隙可与光发射器对准，但另一孔隙可与光检测器不对准。根据图1中所展示的实施例，光透射元件13、14及不透明层16、17个别地安置于第一电子组件11(例如，光发射器)上方及第二电子组件12(例如，光检测器)上方。可个别地检测且对准孔隙16h、17h的相应中心及光发射器11的发光区域11e的中心及光检测器12的光检测区域12d的中心，此可有助于减小对准偏移及增加光学装置1的准确性。
图2说明根据本发明的第一方面的光学装置2的一些实施例的横截面图。光学装置2类似于图1中所展示的光学装置1，只是光学装置2的第一光透射元件23及第二光透射元件24是平凸透镜。如图2中所展示，第一光透射元件23的凸表面23a面向第一电子组件11，且第二光透射元件24的凸表面24a面朝第二电子组件12。凸表面23a可突出到由盖15界定的孔隙13h中。凸表面24a可突出到由盖15界定的孔隙14h中。平凸透镜可增大到达电子组件的光的密度，此可有助于改进光学装置2的性能。
图3A说明根据本发明的第二方面的半导体装置3A的一些实施例的横截面图。半导体装置3A包含如图1中所展示的光学装置1、第三不透明层31及透镜32。由短划线描绘的光锥展示可透射到光学装置1的电子组件或从所述电子组件透射的光的一些可能路径。在一些实施例中，替代，或除了光学装置1以外，还可通过图2中所展示的光学装置2实施半导体装置3A。
第三不透明层31安置于光学装置1上。第三不透明层31界定允许光通过的开口31h。透镜32安置于第三不透明层31上。在一些实施例中，透镜32可包含或可为蜂窝式电话的玻璃部分(例如，玻璃面板)、平板计算机、笔记型计算机、相机或装备有接近性传感器的其它电子装置。
图3B说明根据本发明的第二方面的半导体装置3B的一些实施例的横截面图。半导体装置3B类似于图3A中所展示的半导体装置3A，只是第二不透明层31由滤光层33替换。由短划线描绘的光锥展示可透射到光学装置1的电子组件或从所述电子组件透射的光的一些可能路径。滤光层33不界定开口(例如，在光学装置1的孔隙上方不含开口)。滤光层33经配置以允许具有预定波长的光通过。在一些实施例中，滤光层33结合第三不透明层31予以实施。
图4A、4B及4C说明根据本发明的一些实施例的用于制造如图1中所展示的光学装置1的方法。尽管在下文中关于多个组件中的每一者描述一些工艺、操作或步骤，但可关于多个组件中的一者或关于介于一个与完全多个组件之间的某一数目而选择性地执行那些工艺、操作或步骤中的任一者。
参考图4A，提供载体10。第一电子组件11(例如，光发射器)及第二电子组件12(例如，光检测器)放置于载体10上。第一电子组件11与第二电子组件12彼此物理上分离。
盖(或外壳)15放置于载体10上。盖15经布置以使得盖15的壁结构15w安置于电子组件11与电子组件12之间，盖15的第一开口13h安置于第一电子组件11上方，且盖15的第二开口14h安置于第二电子组件12上方。在一些实施例中，第一开口13h的宽度D1约等于或大于第一电子组件11的发光区域11e的面积(例如，大了约10％、大了约20％、大了约30％、大了大于约30％)，且第二开口14h的宽度D3约等于或大于第二电子组件12的光检测区域12d的面积(例如，大了约10％、大了约20％、大了约30％、大了大于约30％)。举例来说，第一开口13h经配置使得第一电子组件11的发光区域11e通过第一开口13h而从盖15曝露，此可有助于在后续操作中准确地确定第一电子组件11的发光区域11e的中心的位置。另外，第二开口14h经配置使得第二电子组件12的光检测区域12d通过第二开口13h而从盖15曝露，此可有助于在后续操作中准确地确定第二电子组件12的光检测区域12d的中心的位置。第一开口13h与第二开口14h彼此物理上分离。
盖15具有在第一开口13h上方的第一腔体15h1及在第二开口14h上方的第二腔体15h2。在一些实施例中，第一腔体15h1的宽度D5大于第一开口13h的宽度D1，且第二腔体15h2的宽度D6大于第二开口14h的宽度D3。第一腔体15h1与第二腔体15h2彼此物理上分离。
在一些制造工艺实施例中，对于放置盖15(例如，放置于载体10上)存在第一偏移容限，且对于放置第一电子组件11或第二电子组件12(例如，放置于载体10上)存在第二偏移容限。第一开口13h的宽度D1及第二开口14h的宽度D3中的至少一者大于或约等于以下各者的总和：第一偏移容限、第二偏移容限与(i)第一电子组件11的发光区域11e的面积的宽度或(ii)第二电子组件12的光检测区域12d的面积的宽度。
参考图4B，提供第一光透射元件13及第二光透射元件14。在一些实施例中，通过将透射元件的面板划分成多个个别光透射元件来提供第一光透射元件13及第二光透射元件14。在一些实施例中，第一光透射元件13的宽度D7大于第一开口13h的宽度D1，且小于或约等于第一腔体15h1的宽度D5(例如，小了约10％、小了约20％、小了约30％或小了小于约30％)。第二光透射元件14的宽度D8大于第一开口14h的宽度D3及小于或约等于第二腔体15h2的宽度D6(例如，小了约10％、小了约20％、小了约30％或小了小于约30％)。
第一不透明层16及第二不透明层17分别形成于第一光透射元件13及第二光透射元件14上。在一些实施例中，可通过在第一光透射元件13及第二光透射元件14上镀敷或涂佈油墨来形成第一不透明层16及第二不透明层17。接着形成第一孔隙16h及第二孔隙17h以穿透第一不透明层16及第二不透明层17及曝露第一光透射元件13及第二光透射元件14的一部分。在一些实施例中，第一孔隙16h及第二孔隙17h可通过光刻法、化学蚀刻、激光钻孔或其它适合工艺形成。在一些实施例中，第一孔隙16h的宽度D2小于第一开口13h的宽度D1，且第二孔隙17h的宽度D4小于第二开口14h的宽度D3。在一些实施例中，第一孔隙16h及第二孔隙17h中的每一者的宽度小于约250μm。
可检测或计算第一孔隙16h的中心C1及第二孔隙17h的中心C2。第一孔隙16h的中心C1或第二孔隙17h的中心C2由图像俘获装置ICD及处理器确定。可以类似方式执行检测或计算第一电子组件11的发光区域11e的中心C3及第二电子组件12的光检测区域12d的中心C4。举例来说，第一电子组件11的发光区域11e的中心C3或第二电子组件12的光检测区域12d的中心C4由图像俘获装置ICD及处理器确定。
参考图4C，第一孔隙16h的中心C1与第一电子组件11的发光区域11e的中心C3对准，且第一光透射元件13连同第一不透明层16通过(例如)取放操作安置于第一腔体15h1内。第二孔隙17h的中心C2与第二电子组件12的光检测区域12d的中心C4对准，且第二光透射元件14连同第二不透明层17通过(例如)取放操作安置于第二腔体15h2内。在一些实施例中，第一不透明层16及第二不透明层17从盖15的顶面151凹入。
在一些实施例中，在放置第一光透射元件13及第二光透射元件14之前，可将粘着层13a邻近于第一腔体15h1及第二腔体15h2的侧壁放置，此举可(例如，在第一光透射元件13的宽度D7及第二光透射元件14的宽度D8小于第一腔体15h1的宽度D5及第二腔体15h2的宽度D6的实施方案中)有助于紧固第一光透射元件13及第二光透射元件14。在一些实施例中，粘着层13a包含热固化材料或光学固化材料。
如本文中所使用，术语“实质上”、“实质”、“大约”及“约”用以描述及考虑小的变化。举例来说，当结合数值使用时，所述术语可指小于或等于彼数值的±10％的变化范围，例如，小于或等于±5％、小于或等于±4％、小于或等于±3％、小于或等于±2％、小于或等于±1％、小于或等于±0.5％、小于或等于±0.1％或者小于或等于±0.05％的变化范围。作为另一实例，薄膜或层的厚度“实质上均匀”可指薄膜或层的平均厚度的小于或等于±10％(例如小于或等于±5％、小于或等于±4％、小于或等于±3％、小于或等于±2％、小于或等于±1％、小于或等于±0.5％、小于或等于±0.1％、或小于或等于±0.05％)的标准差。术语“实质上共面”可指两个表面沿着同一平面处于50μm内(例如，沿着同一平面处于40μm内、30μm内、20μm内、10μm内或1μm内)。如果(例如)两个组件重叠或在200μm、150μm内、100μm内、50μm内、40μm内、30μm内、20μm内、10μm内或1μm内，则两个组件可被视为“实质上对准”。如果两个表面或组件之间的角为(例如)90°±10°(例如，±5°、±4°、±3°、±2°、±1°、±0.5°、±0.1°或±0.05°)，则两个表面或组件可被视为“实质上垂直”。当结合事件或情形使用时，术语“实质上”、“实质”、“大约”及“约”可指事件或情形精确发生的情况以及事件或情形近似发生的情况。
在对一些实施例的描述中，提供“在”另一组件“上”的一组件可涵盖前一组件直接在后一组件上(例如，与后一组件实体接触)的状况以及一或多个介入组件位于前一组件与后一组件之间的状况。
另外，有时在本文中按范围格式呈现量、比率及其它数值。可理解，此类范围格式是出于便利及简洁起见，且应被灵活地理解为不仅包含明确地指定为范围限制的数值，而且包含涵盖于所述范围内的所有个别数值或子范围，如同明确地指定每一数值及子范围一样。
尽管已参考本发明的特定实施例描述且说明本发明，但这些描述及说明并不限制本发明。所属领域的技术人员可清楚地理解，可进行各种改变，且可在实施例内替代等效元件而不会脱离如由所附权利要求书所界定的本发明的真实精神及范围。图解说明可能未必是按比例绘制。归因于制造工艺的类中的变量，本发明中的艺术再现与实际设备之间可存在区别。可存在并未特定说明的本发明的其它实施例。应将本说明书及图式视为说明性而非限制性的。可作出修改，以使特定情形、材料、物质组成、方法或工艺适应于本发明的目标、精神及范围。所有此类修改均意欲处于此处所附的权利要求书的范围内。尽管已参考按特定次序执行的特定操作描述本文中所揭示的方法，但可理解，在不脱离本发明的教示的情况下，可组合、细分或重新定序这些操作以形成等效方法。因此，除非在本文中特定指示，否则操作的次序及分组并不限制本发明。

Claims (26)

1.一种光学模块，其包括：
载体；
光发射器，其安置于所述载体上；
光检测器，其安置于所述载体上；
外壳，其安置于所述载体上，所述外壳界定曝露所述光发射器的第一开口及曝露所述光检测器的第二开口；
第一光透射元件，其安置于所述第一开口上；
第二光透射元件，其安置于所述第二开口上；
第一不透明层，其安置于所述第一光透射元件上，所述第一不透明层界定第一孔隙；及
第二不透明层，其安置于所述第二光透射元件上，所述第二不透明层界定第二孔隙。
2.根据权利要求1所述的光学模块，其中所述第一光透射元件与所述第二光透射元件物理上间隔开。
3.根据权利要求1所述的光学模块，其中所述第一不透明层与所述第二不透明层物理上间隔开。
4.根据权利要求1所述的光学模块，其中所述外壳界定：
第一腔体，其经配置以容纳所述第一光透射元件；及
第二腔体，其经配置以容纳所述第二光透射元件。
5.根据权利要求1所述的光学模块，其中所述第一不透明层或所述第二不透明层的表面从所述外壳的顶面凹入。
6.根据权利要求1所述的光学模块，其中所述第一开口的宽度大于所述第一孔隙的宽度，且所述第二开口的宽度大于所述第二孔隙的宽度。
7.根据权利要求6所述的光学模块，其中所述第一孔隙的所述宽度或所述第二孔隙的所述宽度小于约250微米。
8.根据权利要求1所述的光学模块，其中所述第一开口在所述载体上的突起的面积大于所述光发射器的发光区域的面积，或所述第二开口在所述载体上的突起的面积大于所述光检测器的光检测区域的面积。
9.根据权利要求1所述的光学模块，其中所述第一光透射元件的宽度大于所述第一开口的宽度，且所述第二光透射元件的宽度大于所述第二开口的宽度。
10.根据权利要求1所述的光学模块，其中所述外壳包括安置于所述光发射器与所述光检测器之间的壁部分。
11.根据权利要求1所述的光学模块，其中所述第一不透明层及所述第二不透明层为光吸收层或金属层。
12.根据权利要求1所述的光学模块，其中
所述第一光透射元件及所述第二光透射元件为平凸透镜，
所述第一光透射元件的凸表面面朝所述光发射器，且
所述第二光透射元件的凸表面面朝所述光检测器。
13.根据权利要求1所述的光学模块，其中所述第一孔隙的中心与所述光发射器的发光区域的中心实质上对准，且所述第二孔隙的中心与所述光检测器的光检测区域的中心实质上对准。
14.一种制造光学模块的方法，所述方法包括：
(a)提供载体；
(b)将光发射器放置于所述载体上；
(c)将光检测器放置于所述载体上；
(d)将外壳放置于所述载体上，所述外壳界定曝露所述光发射器的第一开口及曝露所述光检测器的第二开口；
(e)将第一光透射元件放置于所述第一开口上，所述第一光透射元件包括界定第一孔隙的第一不透明层；及
(f)将第二光透射元件放置于所述第二开口上，所述第二光透射元件包括界定第二孔隙的第二不透明层。
15.根据权利要求14所述的方法，其中
所述操作(e)进一步包括确定所述第一孔隙的中心相对于所述光发射器的发光区域的中心的对准，且
所述操作(f)进一步包括确定所述第二孔隙的中心相对于所述光检测器的光检测区域的中心的对准。
16.根据权利要求15所述的方法，其中确定所述对准是使用图像俘获装置及处理器。
17.根据权利要求14所述的方法，其进一步包括在所述操作(e)之前划分光透射元件的面板以形成所述第一光透射元件及所述第二光透射元件。
18.根据权利要求14所述的方法，其中
所述第一光透射元件是通过第一取放操作放置于所述第一开口上；且
所述第二光透射元件是通过第二取放操作放置于所述第二开口上。
19.根据权利要求14所述的方法，其中所述外壳界定：
第一腔体，其经配置以容纳所述第一光透射元件；及
第二腔体，其经配置以容纳所述第二光透射元件。
20.根据权利要求19所述的方法，其进一步包括：
在所述第一光透射元件与所述第一腔体的侧壁之间形成粘着层；及
在所述第二光透射元件与所述第二腔体的侧壁之间形成粘着层。
21.根据权利要求19所述的方法，其中所述第一不透明层或所述第二不透明层的表面从所述外壳的顶面凹入。
22.根据权利要求14所述的方法，其中所述第一光透射元件与所述第二光透射元件物理上间隔开。
23.根据权利要求14所述的方法，其中所述第一不透明层与所述第二不透明层物理上间隔开。
24.根据权利要求14所述的方法，其中所述第一开口在所述载体上的突起的面积大于所述光发射器的发光区域的面积，且所述第二开口在所述载体上的突起的面积大于所述光检测器的光检测区域的面积。
25.根据权利要求24所述的方法，其中将所述外壳放置于所述载体上具有第一偏移容限，且将所述光发射器或所述光检测器放置于所述载体上具有第二偏移容限，且所述第一开口或所述第二开口的宽度大于或等于以下各者的总和：所述第一偏移容限、所述第二偏移容限与(i)所述光发射器的发光区域的宽度或(ii)所述光检测器的所述光检测区域的宽度。
26.根据权利要求14所述的方法，其中所述第一不透明层及所述第二不透明层是光吸收层或金属层。
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