TWI785015B - 阻氣性接著薄膜和電子構件及光學構件 - Google Patents

阻氣性接著薄膜和電子構件及光學構件 Download PDF

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Publication number
TWI785015B
TWI785015B TW107106792A TW107106792A TWI785015B TW I785015 B TWI785015 B TW I785015B TW 107106792 A TW107106792 A TW 107106792A TW 107106792 A TW107106792 A TW 107106792A TW I785015 B TWI785015 B TW I785015B
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TW
Taiwan
Prior art keywords
film
gas barrier
layer
adhesive
antistatic
Prior art date
Application number
TW107106792A
Other languages
English (en)
Chinese (zh)
Other versions
TW201842111A (zh
Inventor
七島祐
樫尾幹広
佐藤慶一
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201842111A publication Critical patent/TW201842111A/zh
Application granted granted Critical
Publication of TWI785015B publication Critical patent/TWI785015B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW107106792A 2017-03-03 2018-03-01 阻氣性接著薄膜和電子構件及光學構件 TWI785015B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-040766 2017-03-03
JP2017040766 2017-03-03

Publications (2)

Publication Number Publication Date
TW201842111A TW201842111A (zh) 2018-12-01
TWI785015B true TWI785015B (zh) 2022-12-01

Family

ID=63371066

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107106792A TWI785015B (zh) 2017-03-03 2018-03-01 阻氣性接著薄膜和電子構件及光學構件

Country Status (3)

Country Link
JP (1) JP7080216B2 (ja)
TW (1) TWI785015B (ja)
WO (1) WO2018159602A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112752813B (zh) 2018-09-28 2023-02-28 琳得科株式会社 阻气性层叠体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11300895A (ja) * 1998-04-17 1999-11-02 Toyobo Co Ltd 離型フィルム
JP2011046107A (ja) * 2009-08-27 2011-03-10 Fujifilm Corp 電子素子の製造方法および複合フィルム
JP2012241154A (ja) * 2011-05-23 2012-12-10 Nitto Denko Corp 粘着フィルム
JP2014166753A (ja) * 2013-01-31 2014-09-11 Lintec Corp 電子デバイス用フィルム状封止材、電子デバイス用封止シートおよび電子デバイス
WO2015119109A1 (ja) * 2014-02-04 2015-08-13 コニカミノルタ株式会社 ガスバリアーフィルムの製造方法及びガスバリアーフィルム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011005837A (ja) * 2009-06-29 2011-01-13 Dainippon Printing Co Ltd ガスバリア性帯電防止粘着フィルム
CN103154172B (zh) 2010-09-07 2014-12-10 琳得科株式会社 粘着片以及电子设备
JP6225025B2 (ja) * 2011-08-03 2017-11-01 リンテック株式会社 ガスバリア性粘着シート、その製造方法、並びに電子部材及び光学部材
JP6645137B2 (ja) * 2015-11-24 2020-02-12 コニカミノルタ株式会社 ガスバリアー性粘着シート及びそれを備える電子デバイス

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11300895A (ja) * 1998-04-17 1999-11-02 Toyobo Co Ltd 離型フィルム
JP2011046107A (ja) * 2009-08-27 2011-03-10 Fujifilm Corp 電子素子の製造方法および複合フィルム
JP2012241154A (ja) * 2011-05-23 2012-12-10 Nitto Denko Corp 粘着フィルム
JP2014166753A (ja) * 2013-01-31 2014-09-11 Lintec Corp 電子デバイス用フィルム状封止材、電子デバイス用封止シートおよび電子デバイス
WO2015119109A1 (ja) * 2014-02-04 2015-08-13 コニカミノルタ株式会社 ガスバリアーフィルムの製造方法及びガスバリアーフィルム

Also Published As

Publication number Publication date
JP7080216B2 (ja) 2022-06-03
TW201842111A (zh) 2018-12-01
JPWO2018159602A1 (ja) 2019-12-26
WO2018159602A1 (ja) 2018-09-07

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