TWI772898B - 電子零件的安裝裝置 - Google Patents

電子零件的安裝裝置 Download PDF

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Publication number
TWI772898B
TWI772898B TW109132494A TW109132494A TWI772898B TW I772898 B TWI772898 B TW I772898B TW 109132494 A TW109132494 A TW 109132494A TW 109132494 A TW109132494 A TW 109132494A TW I772898 B TWI772898 B TW I772898B
Authority
TW
Taiwan
Prior art keywords
display panel
electronic component
bonding
anisotropic conductive
conductive film
Prior art date
Application number
TW109132494A
Other languages
English (en)
Chinese (zh)
Other versions
TW202130239A (zh
Inventor
広瀬圭剛
菊池一哉
Original Assignee
日商芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020134284A external-priority patent/JP7362563B2/ja
Application filed by 日商芝浦機械電子裝置股份有限公司 filed Critical 日商芝浦機械電子裝置股份有限公司
Publication of TW202130239A publication Critical patent/TW202130239A/zh
Application granted granted Critical
Publication of TWI772898B publication Critical patent/TWI772898B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW109132494A 2019-09-25 2020-09-21 電子零件的安裝裝置 TWI772898B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2019-173616 2019-09-25
JP2019173616 2019-09-25
JP2020124878 2020-07-22
JP2020-124878 2020-07-22
JP2020134284A JP7362563B2 (ja) 2019-09-25 2020-08-07 電子部品の実装装置
JP2020-134284 2020-08-07

Publications (2)

Publication Number Publication Date
TW202130239A TW202130239A (zh) 2021-08-01
TWI772898B true TWI772898B (zh) 2022-08-01

Family

ID=75041038

Family Applications (2)

Application Number Title Priority Date Filing Date
TW111125438A TWI823462B (zh) 2019-09-25 2020-09-21 電子零件的安裝裝置
TW109132494A TWI772898B (zh) 2019-09-25 2020-09-21 電子零件的安裝裝置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW111125438A TWI823462B (zh) 2019-09-25 2020-09-21 電子零件的安裝裝置

Country Status (3)

Country Link
KR (1) KR102383924B1 (ko)
CN (1) CN112566485B (ko)
TW (2) TWI823462B (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007311774A (ja) * 2006-04-17 2007-11-29 Toray Eng Co Ltd 異種接着テープ貼付方法およびこれを用いたボンディング方法ならびにこれらの装置
TW200809996A (en) * 2006-07-05 2008-02-16 Matsushita Electric Ind Co Ltd ACF attachment device and ACF attachment method
TW201448067A (zh) * 2013-03-28 2014-12-16 Toray Eng Co Ltd 安裝方法及安裝裝置
CN104584712A (zh) * 2012-08-22 2015-04-29 松下知识产权经营株式会社 元件安装装置和安装方法
TW201808084A (zh) * 2016-08-16 2018-03-01 芝浦機械電子裝置股份有限公司 電子零件安裝裝置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3647783B2 (ja) * 2001-09-19 2005-05-18 株式会社コスモハイテック 導電体の熱圧着装置
JP3757874B2 (ja) * 2002-01-29 2006-03-22 松下電器産業株式会社 電子部品のボンディング装置およびボンディング方法
JP3765570B2 (ja) * 2002-11-21 2006-04-12 芝浦メカトロニクス株式会社 部品実装装置
JP4576207B2 (ja) * 2004-11-05 2010-11-04 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP4908404B2 (ja) * 2005-04-28 2012-04-04 東レエンジニアリング株式会社 ボンディング装置およびこれを備えたボンディングシステム
JP4802003B2 (ja) 2006-01-30 2011-10-26 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5302773B2 (ja) * 2009-05-27 2013-10-02 株式会社日立ハイテクノロジーズ 電子部品実装装置
JP2011109046A (ja) * 2009-11-20 2011-06-02 Sony Chemical & Information Device Corp 実装装置および電子モジュールの製造方法
WO2011111420A1 (ja) * 2010-03-10 2011-09-15 シャープ株式会社 液晶表示装置とその製造方法
JP5719573B2 (ja) * 2010-11-25 2015-05-20 芝浦メカトロニクス株式会社 半導体セルのリード線接続装置及び接続方法
JP5845446B2 (ja) * 2012-10-17 2016-01-20 パナソニックＩｐマネジメント株式会社 部品実装装置及び部品実装方法
KR101399973B1 (ko) 2012-12-21 2014-06-19 세광테크 주식회사 인라인 자동 ｏｌｂ 본딩장치
JP6675357B2 (ja) * 2016-08-16 2020-04-01 芝浦メカトロニクス株式会社 圧着装置
JP6767333B2 (ja) * 2017-09-28 2020-10-14 芝浦メカトロニクス株式会社 電子部品の実装装置
JP6561326B2 (ja) 2018-08-27 2019-08-21 パナソニックＩｐマネジメント株式会社 部品実装ラインおよび部品実装方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007311774A (ja) * 2006-04-17 2007-11-29 Toray Eng Co Ltd 異種接着テープ貼付方法およびこれを用いたボンディング方法ならびにこれらの装置
TW200809996A (en) * 2006-07-05 2008-02-16 Matsushita Electric Ind Co Ltd ACF attachment device and ACF attachment method
CN104584712A (zh) * 2012-08-22 2015-04-29 松下知识产权经营株式会社 元件安装装置和安装方法
TW201448067A (zh) * 2013-03-28 2014-12-16 Toray Eng Co Ltd 安裝方法及安裝裝置
TW201808084A (zh) * 2016-08-16 2018-03-01 芝浦機械電子裝置股份有限公司 電子零件安裝裝置

Also Published As

Publication number Publication date
CN112566485B (zh) 2022-05-13
CN112566485A (zh) 2021-03-26
KR20210036276A (ko) 2021-04-02
KR102383924B1 (ko) 2022-04-08
TWI823462B (zh) 2023-11-21
TW202130239A (zh) 2021-08-01
TW202243563A (zh) 2022-11-01

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