TWI768140B - 具有粗化處理後之銅表面的物體、銅表面的粗化處理方法、物體的製造方法、積層板的製造方法及印刷佈線板之製造方法 - Google Patents

具有粗化處理後之銅表面的物體、銅表面的粗化處理方法、物體的製造方法、積層板的製造方法及印刷佈線板之製造方法 Download PDF

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Publication number
TWI768140B
TWI768140B TW107137215A TW107137215A TWI768140B TW I768140 B TWI768140 B TW I768140B TW 107137215 A TW107137215 A TW 107137215A TW 107137215 A TW107137215 A TW 107137215A TW I768140 B TWI768140 B TW I768140B
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TW
Taiwan
Prior art keywords
copper
copper surface
treatment
manufacturing
convex portion
Prior art date
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TW107137215A
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English (en)
Chinese (zh)
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TW201931966A (zh
Inventor
佐藤牧子
鈴木理
Original Assignee
日商納美仕有限公司
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Publication of TW201931966A publication Critical patent/TW201931966A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/66—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/70—Carriers or collectors characterised by shape or form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
TW107137215A 2017-11-10 2018-10-22 具有粗化處理後之銅表面的物體、銅表面的粗化處理方法、物體的製造方法、積層板的製造方法及印刷佈線板之製造方法 TWI768140B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-217776 2017-11-10
JP2017217776A JP7013003B2 (ja) 2017-11-10 2017-11-10 粗面化処理された銅表面を有する物体

Publications (2)

Publication Number Publication Date
TW201931966A TW201931966A (zh) 2019-08-01
TWI768140B true TWI768140B (zh) 2022-06-21

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Family Applications (1)

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TW107137215A TWI768140B (zh) 2017-11-10 2018-10-22 具有粗化處理後之銅表面的物體、銅表面的粗化處理方法、物體的製造方法、積層板的製造方法及印刷佈線板之製造方法

Country Status (5)

Country Link
JP (1) JP7013003B2 (ja)
KR (1) KR102542984B1 (ja)
CN (1) CN111108817B (ja)
TW (1) TWI768140B (ja)
WO (1) WO2019093077A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6726780B1 (ja) * 2019-03-04 2020-07-22 ナミックス株式会社 銅箔並びにそれを含むリチウムイオン電池の負極集電体及びその製造方法
JP6778291B1 (ja) * 2019-03-04 2020-10-28 ナミックス株式会社 銅箔並びにそれを含むリチウムイオン電池の負極集電体及びその製造方法
KR20220148865A (ko) * 2020-02-28 2022-11-07 나믹스 가부시끼가이샤 공극을 갖는 복합 구리 부재
KR102704093B1 (ko) * 2021-04-15 2024-09-06 고려대학교 산학협력단 금속 음극 전극 및 이를 이용한 이차 전지
WO2022230803A1 (ja) * 2021-04-30 2022-11-03 Rimtec株式会社 金属樹脂積層体及び金属樹脂積層体の製造方法
WO2022258726A1 (en) * 2021-06-09 2022-12-15 Atotech Deutschland GmbH & Co. KG A composite and a method for manufacturing a composite of a copper layer and an organic layer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0738254A (ja) * 1993-07-22 1995-02-07 Mitsubishi Gas Chem Co Inc 内層銅箔の処理方法
TW201736104A (zh) * 2016-03-03 2017-10-16 三井金屬鑛業股份有限公司 貼銅層合板之製造方法

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JP4577530B2 (ja) * 2008-02-21 2010-11-10 セイコーエプソン株式会社 現像ローラ、現像装置、画像形成装置および現像ローラの製造方法
CN104988503A (zh) * 2008-10-27 2015-10-21 日立化成工业株式会社 铜的表面处理方法及铜
WO2014126193A1 (ja) * 2013-02-14 2014-08-21 三井金属鉱業株式会社 表面処理銅箔及び表面処理銅箔を用いて得られる銅張積層板
CN103435089A (zh) * 2013-07-16 2013-12-11 上海应用技术学院 一种表面粗糙的球状氧化亚铜微纳米粒子及其制备方法
MY182166A (en) * 2013-09-20 2021-01-18 Namics Corp Copper foil, copper foil with carrier foil, and copper-clad laminate
JP6110581B2 (ja) * 2014-12-05 2017-04-05 三井金属鉱業株式会社 高周波信号伝送回路形成用表面処理銅箔、銅張積層板及びプリント配線板
WO2017056534A1 (ja) * 2015-09-30 2017-04-06 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP2017092152A (ja) * 2015-11-05 2017-05-25 日立化成デュポンマイクロシステムズ株式会社 多層体、その製造方法及び半導体装置
US10244635B2 (en) * 2016-03-03 2019-03-26 Mitsui Mining & Smelting Co., Ltd. Production method for copper-clad laminate plate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0738254A (ja) * 1993-07-22 1995-02-07 Mitsubishi Gas Chem Co Inc 内層銅箔の処理方法
TW201736104A (zh) * 2016-03-03 2017-10-16 三井金屬鑛業股份有限公司 貼銅層合板之製造方法

Also Published As

Publication number Publication date
WO2019093077A1 (ja) 2019-05-16
CN111108817A (zh) 2020-05-05
KR102542984B1 (ko) 2023-06-14
JP7013003B2 (ja) 2022-01-31
KR20200085737A (ko) 2020-07-15
CN111108817B (zh) 2024-03-01
JP2019091742A (ja) 2019-06-13
TW201931966A (zh) 2019-08-01

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