TWI763846B - 分離裝置及分離方法 - Google Patents

分離裝置及分離方法

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Publication number
TWI763846B
TWI763846B TW107116556A TW107116556A TWI763846B TW I763846 B TWI763846 B TW I763846B TW 107116556 A TW107116556 A TW 107116556A TW 107116556 A TW107116556 A TW 107116556A TW I763846 B TWI763846 B TW I763846B
Authority
TW
Taiwan
Prior art keywords
adhesive sheet
sheet
holding
elongation
wafer
Prior art date
Application number
TW107116556A
Other languages
English (en)
Chinese (zh)
Other versions
TW201901773A (zh
Inventor
也
山田忠知
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201901773A publication Critical patent/TW201901773A/zh
Application granted granted Critical
Publication of TWI763846B publication Critical patent/TWI763846B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW107116556A 2017-05-29 2018-05-16 分離裝置及分離方法 TWI763846B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017105561A JP6912938B2 (ja) 2017-05-29 2017-05-29 離間装置および離間方法
JP2017-105561 2017-05-29

Publications (2)

Publication Number Publication Date
TW201901773A TW201901773A (zh) 2019-01-01
TWI763846B true TWI763846B (zh) 2022-05-11

Family

ID=64449613

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107116556A TWI763846B (zh) 2017-05-29 2018-05-16 分離裝置及分離方法

Country Status (4)

Country Link
JP (1) JP6912938B2 (ja)
KR (1) KR102434544B1 (ja)
CN (1) CN108933085B (ja)
TW (1) TWI763846B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7224214B2 (ja) * 2019-03-13 2023-02-17 株式会社ディスコ 拡張装置
KR102427897B1 (ko) * 2020-12-03 2022-08-02 에스케이하이닉스 주식회사 반도체 다이의 처리 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0729855A (ja) * 1993-07-12 1995-01-31 Sumitomo Electric Ind Ltd 半導体ウエハのエキスパンデイング方法
JP2001223186A (ja) * 2000-02-09 2001-08-17 Lintec Corp 転写テープマウント装置および転写テープマウント方法
JP2014143313A (ja) * 2013-01-24 2014-08-07 Disco Abrasive Syst Ltd 拡張装置および拡張方法
US20140339673A1 (en) * 2013-05-14 2014-11-20 Texas Instruments Incorporated Wafer processing
TW201633446A (zh) * 2014-12-05 2016-09-16 Lintec Corp 間離裝置及間離方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4693805B2 (ja) * 2007-03-16 2011-06-01 株式会社東芝 半導体装置の製造装置及び製造方法
JP6573072B2 (ja) * 2015-08-27 2019-09-11 株式会社村田製作所 フィルム拡張装置およびそれを用いた電子部品の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0729855A (ja) * 1993-07-12 1995-01-31 Sumitomo Electric Ind Ltd 半導体ウエハのエキスパンデイング方法
JP2001223186A (ja) * 2000-02-09 2001-08-17 Lintec Corp 転写テープマウント装置および転写テープマウント方法
JP2014143313A (ja) * 2013-01-24 2014-08-07 Disco Abrasive Syst Ltd 拡張装置および拡張方法
US20140339673A1 (en) * 2013-05-14 2014-11-20 Texas Instruments Incorporated Wafer processing
TW201633446A (zh) * 2014-12-05 2016-09-16 Lintec Corp 間離裝置及間離方法

Also Published As

Publication number Publication date
KR102434544B1 (ko) 2022-08-19
JP2018200973A (ja) 2018-12-20
CN108933085A (zh) 2018-12-04
JP6912938B2 (ja) 2021-08-04
CN108933085B (zh) 2023-08-29
TW201901773A (zh) 2019-01-01
KR20180130440A (ko) 2018-12-07

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