TWI763846B - Separation device and separation method - Google Patents

Separation device and separation method

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TWI763846B
TWI763846B TW107116556A TW107116556A TWI763846B TW I763846 B TWI763846 B TW I763846B TW 107116556 A TW107116556 A TW 107116556A TW 107116556 A TW107116556 A TW 107116556A TW I763846 B TWI763846 B TW I763846B
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adhesive sheet
sheet
holding
elongation
wafer
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TW107116556A
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Chinese (zh)
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TW201901773A (en
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也
山田忠知
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日商琳得科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

Abstract

分離裝置(10)係一種裝置，對黏著片(AS)上的板狀構材(WF)賦予4方向的張力而增加從板狀構材(WF)形成的複數個片狀體(CP)之間隔，具備：複數個保持手段(20)，以複數個保持構材(21)保持黏著片(AS)；伸長手段(30A、30B)，使保持構材(21)移動於4方向之中每個保持手段(20)不同的1方向，並使該保持構材(21)移動於該1方向的交叉方向而使黏著片(AS)伸長；和控制手段(40)，控制利用伸長手段(30A、30B)之下的保持構材(21)的移動；控制手段(40)，係依片狀體(CP)的尺寸與間隔的目標值而算出黏著片(AS)的伸長量的目標值，使伸長手段(30A、30B)以黏著片(AS)的伸長量成為該目標值的方式移動保持構材(21)。The separation device (10) is a device that applies tension in four directions to the plate-like member (WF) on the adhesive sheet (AS) to increase the number of sheet-like bodies (CP) formed from the plate-like member (WF). The space is provided with: a plurality of holding means (20) for holding the adhesive sheet (AS) with a plurality of holding members (21); and elongation means (30A, 30B) for moving the holding member (21) in each of the four directions The holding means (20) are different in one direction, and the holding member (21) is moved in the intersecting direction of the one direction to extend the adhesive sheet (AS); and control means (40) for controlling the use of the extending means (30A) , the movement of the holding member (21) under 30B); the control means (40) is to calculate the target value of the elongation of the adhesive sheet (AS) according to the target value of the size and interval of the sheet body (CP), The holding member ( 21 ) is moved by the extension means ( 30A, 30B) so that the extension amount of the adhesive sheet (AS) becomes the target value.

Description

分離裝置及分離方法Separation device and separation method

本發明涉及分離裝置及分離方法。The present invention relates to a separation device and a separation method.

歷來，於半導體製程中進行以下：將半導體晶圓(以下有時簡稱為「晶圓」)切斷為既定的形狀、既定的尺寸而單片化為複數個半導體晶片(以下有時簡稱為「晶片」)，增加被單片化的各晶片的相互間隔後搭載於引線框架、基板等的被搭載物上。各晶片以計算而導出的位置(以下有時簡稱為「理論上的位置」)為基準而透過搬送裝置、拾取裝置等的搬送手段進行搬送，搭載於被搭載物上。 　　此外，近年來，電子機器的小型化、輕量化及高機能化正進展，於搭載於電子機器的半導體裝置方面亦尋求小型化、薄型化及高密度化。為此，晶片有時安裝為接近其尺寸的封裝體。如此的封裝有時稱為晶片級封裝(Chip Scale Package；CSP)。製造CSP的程序之一，舉例晶圓級封裝(Wafer Level Package；WLP)。於WLP，在透過切割將封裝體單片化之前，在晶片電路形成面形成外部電極等，最後將包含晶片的封裝晶圓進行切割，進行單片化。WLP方面舉例扇入(Fan-In)型與扇出(Fan-Out)型。於扇出型的WLP(以下有時簡記為FO-WLP)，將晶片以成為比晶片尺寸大的區域的方式利用密封構材進行覆蓋而形成晶片密封體，將再配線層、外部電極，不僅晶片的電路面而亦形成於密封構材的表面區域。此情況下，在以密封構材將被單片化的各晶片包圍之前，重貼於擴展用的晶圓黏片帶，使晶圓黏片帶展延而使複數個晶片之間的距離增加。 　　增加晶片(片狀體)的相互間隔的分離方法方面已知：以複數個保持手段保持被黏貼晶圓(板狀構材)的保護帶、晶圓黏片帶等的黏著片，使該保持手段移動於互相分離之方向(參見例如文獻1：日本特開2016-111188號公報)。在如此的增加晶片的相互間隔的方法，例如對黏著片賦予＋X軸方向、-X軸方向、＋Y軸方向、-Y軸方向的4方向的張力。藉此，防止對黏著片除上述4方向以外張力亦被賦予於例如其等之合成方向，亦即防止張力被賦予於＋X軸方向與＋Y軸方向的合成方向、＋X軸方向與-Y軸方向的合成方向、-X軸方向與＋Y軸方向的合成方向、-X軸方向與 -Y軸方向的合成方向，可極力防止各片狀體的位置偏離理論上的位置。 　　將各片狀體配置於理論上的位置所需的黏著片的伸長量因片狀體的尺寸、黏著片的種類而異，故每次變更片狀體的尺寸、黏著片，需要實際上一面使黏著片伸長一面確認各片狀體的位置而設定伸長量。此設定耗時，隨設定每單位時間的處理能力降低，故期望能以簡易的方法設定黏著片的伸長量，防止每單位時間的處理能力降低。Conventionally, in the semiconductor manufacturing process, the following has been performed: a semiconductor wafer (hereinafter sometimes referred to as a "wafer") is cut into a predetermined shape and a predetermined size and singulated into a plurality of semiconductor wafers (hereinafter sometimes referred to as a "wafer"). Chips”) are mounted on objects to be mounted such as lead frames, substrates, etc. after increasing the distance between the individual chips. Each wafer is transferred by a transfer means such as a transfer device and a pick-up device based on a position derived by calculation (hereinafter, sometimes simply referred to as a "theoretical position"), and is mounted on the object to be mounted. In addition, in recent years, electronic equipment has been reduced in size, weight, and high-performance, and semiconductor devices mounted on electronic equipment have also sought to be reduced in size, thickness, and density. For this reason, wafers are sometimes mounted as packages close to their size. Such packages are sometimes referred to as wafer-level packages (Chip Scale Package; CSP). One of the procedures for manufacturing CSP, such as Wafer Level Package (WLP). In WLP, before the package body is singulated by dicing, external electrodes and the like are formed on the circuit formation surface of the chip, and finally the package wafer including the chip is diced and singulated. In terms of WLP, an example is a fan-in (Fan-In) type and a fan-out (Fan-Out) type. In the fan-out type WLP (hereinafter sometimes abbreviated as FO-WLP), the wafer is covered with a sealing member so as to have an area larger than the wafer size to form a wafer sealing body, and the rewiring layer, external electrodes, not only The circuit surface of the wafer is also formed in the surface area of the sealing member. In this case, before enclosing each of the singulated chips with the sealing member, the wafer adhesive tape for expansion is reattached to extend the wafer adhesive tape to increase the distance between the plurality of chips . A separation method for increasing the distance between wafers (sheet-like bodies) is known: a protective tape to which a wafer (plate-like member) is to be adhered, an adhesive sheet such as a wafer adhesive tape, etc. are held by a plurality of holding means, and the holding means are The means move in the direction of separation from each other (see, for example, Document 1: Japanese Patent Laid-Open No. 2016-111188). In such a method of increasing the mutual spacing of the wafers, for example, tensions in four directions of +X-axis direction, -X-axis direction, +Y-axis direction, and -Y-axis direction are applied to the adhesive sheet. In this way, tension is prevented from being applied to the adhesive sheet in addition to the above-mentioned four directions, for example, in the combined direction thereof, that is, in the combined direction of the +X-axis direction and the +Y-axis direction, and the +X-axis direction and the -Y-axis direction. The combined direction of the -X-axis direction and the +Y-axis direction, the combined direction of the -X-axis direction and the -Y-axis direction, can prevent the position of each sheet body from deviating from the theoretical position as much as possible. The amount of elongation of the adhesive sheet required to arrange each sheet-like body at a theoretical position varies depending on the size of the sheet-like body and the type of the adhesive sheet. While extending the adhesive sheet, the position of each sheet-like body was confirmed, and the amount of elongation was set. This setting is time-consuming, and the processing capacity per unit time decreases with the setting, so it is desirable to set the elongation amount of the adhesive sheet in a simple method to prevent the processing capacity per unit time from decreasing.

本發明之目的在於提供一種分離裝置及分離方法，能以簡易的方法設定黏著片的伸長量，可防止每單位時間的處理能力降低。 　　本發明的分離裝置一種分離裝置，對黏著片上的板狀構材賦予4方向的張力而增加從該板狀構材形成的複數個片狀體的相互間隔，具備：複數個保持手段，分別以複數個保持構材保持前述黏著片；伸長手段，使前述保持構材移動於前述4方向之中每個前述保持手段不同的1方向，並使該保持構材移動於與前述1方向交叉的交叉方向而使前述黏著片伸長；和控制手段，控制利用前述伸長手段之下的前述保持構材的移動；前述控制手段依前述片狀體的尺寸與前述片狀體之間隔的目標值而算出前述黏著片的伸長量的目標值，使前述伸長手段以前述黏著片的伸長量成為該伸長量的目標值的方式移動前述保持構材。 　　於本發明的分離裝置，優選上，前述控制手段將前述片狀體的尺寸與前述片狀體之間隔的目標值應用於下述式(1)而算出前述黏著片的伸長量的目標值。

Figure 02_image001
CD：片狀體之間隔(μm) 　　CS：片狀體的尺寸(mm) 　　EA：黏著片的伸長量(mm) 　　K1、K2：常數 　　優選上，本發明的分離裝置具有測定前述片狀體的相互間隔的測定手段，前述控制手段基於前述測定手段的測定結果，使前述伸長手段移動前述保持構材。 　　本發明的分離方法一種分離方法，對黏著片上的板狀構材賦予4方向的張力而增加從該板狀構材形成的複數個片狀體的相互間隔，具備：保持程序，以分別具備複數個保持構材的複數個保持手段保持前述黏著片；和伸長程序，使前述保持構材移動於前述4方向之中每個前述保持手段不同的1方向，並使該保持構材移動於與前述1方向交叉的交叉方向而使前述黏著片伸長；在前述伸長程序，依前述片狀體的尺寸與前述片狀體之間隔的目標值而算出前述黏著片的伸長量的目標值，以前述黏著片的伸長量成為該伸長量的目標值的方式使前述保持構材移動。 　　依如以上的本發明時，依片狀體的尺寸與片狀體之間隔的目標值而算出黏著片的伸長量的目標值，以黏著片的伸長量成為該伸長量的目標值的方式使保持構材移動，故能以簡易的方法設定黏著片的伸長量，可防止每個單位時間的處理能力降低。 　　此外，只要作成將片狀體的尺寸與片狀體之間隔的目標值應用於式(1)而算出黏著片的伸長量的目標值，即能以更簡易的方法設定黏著片的伸長量，可更有效地防止每個單位時間的處理能力降低。 　　此外，只要基於片狀體的相互間隔的測定結果，使保持構材配合目標伸長量而移動，即可極力防止在每個板狀構材暫黏於黏著片的一體物中各片狀體的位置偏離理論上的位置。An object of the present invention is to provide a separation device and a separation method which can set the elongation amount of the adhesive sheet in a simple method and can prevent the reduction of the processing capacity per unit time. The separating device of the present invention is a separating device that applies tension in four directions to a plate-like member on an adhesive sheet to increase the mutual interval of a plurality of sheet-like bodies formed from the plate-like member, and includes a plurality of holding means, each of which is A plurality of holding members hold the above-mentioned adhesive sheet; elongation means moves the holding member in one direction that is different for each of the holding means among the four directions, and moves the holding member in a cross that intersects the one direction and control means for controlling the movement of the holding member under the stretching means; and the control means calculates the above-mentioned sheet-like body according to the size of the above-mentioned sheet-like body and the target value of the interval between the above-mentioned sheet-like bodies The target value of the elongation of the adhesive sheet is to move the holding member so that the elongation of the adhesive sheet becomes the target value of the elongation by the elongation means. In the separator of the present invention, preferably, the control means calculates a target value of the elongation amount of the adhesive sheet by applying the target value of the size of the sheet-like body and the interval between the sheet-like bodies to the following formula (1).
Figure 02_image001
CD: Interval between sheets (μm) CS: Size of sheet (mm) EA: Elongation of adhesive sheet (mm) K1, K2: Constants Preferably, the separation device of the present invention has a means for measuring the sheet. In the mutually spaced measuring means, the control means moves the holding member by the extending means based on the measurement results of the measuring means. The separation method of the present invention is a separation method in which a tension in four directions is applied to a plate-shaped member on an adhesive sheet to increase the mutual interval of a plurality of sheet-shaped bodies formed from the plate-shaped member, and includes a holding procedure so as to have a plurality of A plurality of holding means of one holding member hold the adhesive sheet; and an elongation process for moving the holding member in one direction different from each of the holding means among the four directions, and moving the holding member in a different direction from the above-mentioned The above-mentioned adhesive sheet is stretched in the intersecting direction of 1 direction; in the above-mentioned stretching procedure, the target value of the elongation amount of the above-mentioned adhesive sheet is calculated according to the size of the above-mentioned sheet-like body and the target value of the interval between the above-mentioned sheet-like bodies, and the above-mentioned adhesive The holding member is moved so that the elongation of the sheet becomes the target value of the elongation. According to the present invention as described above, the target value of the elongation of the adhesive sheet is calculated according to the size of the sheet and the target value of the interval between the sheets, and the elongation of the adhesive sheet becomes the target value of the elongation. The movement of the member is maintained, so the elongation amount of the adhesive sheet can be set in a simple method, and the reduction of the processing capacity per unit time can be prevented. In addition, if the target value of the elongation amount of the adhesive sheet is calculated by applying the target value of the size of the sheet-like body and the interval between the sheet-like bodies to the formula (1), the elongation amount of the adhesive sheet can be set in a simpler method. The reduction of the processing capacity per unit time can be prevented more effectively. In addition, if the holding member is moved according to the target elongation amount based on the measurement result of the mutual distance between the sheet-like bodies, it is possible to prevent as much as possible the separation of the individual sheet-like bodies in the integrated body of each plate-like member and the pressure-sensitive adhesive sheet. The position deviates from the theoretical position.

以下，基於圖式說明本發明的各實施方式。 　　另外，於各實施方式，X軸、Y軸、Z軸存在彼此正交的關係，X軸及Y軸設為既定平面內的軸，Z軸設為與前述既定平面正交的軸。再者，在本實施方式，以從與Y軸平行的圖1中眼前方向觀看的情況為基準而表示方向的情況下，「上」設為Z軸的箭頭方向，「下」設為其逆向，「左」設為X軸的箭頭方向，「右」設為其逆向，「前」設為Y軸的箭頭方向，亦即圖1中與紙面正交的眼前方向，「後」設為其逆向。 　　此外，於第2實施方式以下，對與在第1實施方式說明的構材相同的構材及具有同樣的功能的構材，標注與第1實施方式的構材相同的符號，將其等之說明省略或簡略化。 [第1實施方式] 　　圖1、圖2中，分離裝置10對黏著片AS上的作為板狀構材的四角形的晶圓WF賦予張力於＋X軸方向、＋Y軸方向、-X軸方向、-Y軸方向的4方向，增加從該晶圓WF形成的作為複數個片狀體的晶片CP的相互間隔的裝置，並具備：4體的保持手段20，將黏著片AS以5體的保持構材21進行保持；屬驅動機器之作為伸長手段的線性馬達30A、30B，使保持構材21移動於前述4方向之中每個保持手段20不同的1方向，並使該保持構材21移動於與前述1方向交叉的交叉方向而將黏著片AS予以伸長；控制手段40，就利用線性馬達30A、30B之下的保持構材21的移動進行控制；光學感測器、相機等的測定手段50，就晶片CP的相互間隔進行測定。另外，晶圓WF作成為俯視下正方形，利用切斷刃、加壓水、乾式蝕刻等的晶圓切斷手段而被單片化為晶片CP，或利用雷射光、藥液等的晶圓脆弱化手段而可被單片化為晶片CP，暫黏於黏著片AS而作成為一體物WK。此外，黏著片AS係形成為俯視下正方形。 　　保持手段20具備支撐於線性馬達30B的複數個滑件31B的各者的保持構材21。 　　保持構材21具備：支撐於滑件31B的下支撐構材22、支撐於下支撐構材22的作為驅動機器的轉動馬達23、支撐於轉動馬達23的輸出軸23A(貫通軸)的上支撐構材24。 　　保持手段20及線性馬達30A以中心點CT為中心於前後左右設置4體。 　　線性馬達30B支撐於線性馬達30A的滑件31A。 　　根據如以上的構成，線性馬達30A使保持手段20移動於每個保持手段20不同的方向，且線性馬達30B使保持構材21移動於與保持手段20的移動方向交叉的交叉方向，從而設為可對黏著片AS賦予張力。 　　控制手段40以個人電腦、定序器等構成，被構成為不僅控制利用線性馬達30A、30B之下的保持構材21的移動，亦可控制分離裝置10整體的動作。 　　就於以上的分離裝置10增加從晶圓WF形成的複數個晶片CP的相互間隔的順序進行說明。 　　首先，對各構材在初始位置待機的圖1中以實線表示的分離裝置10，該分離裝置10的使用者(以下簡稱為「使用者」)經由操作面板、個人電腦等的未圖示的操作手段，輸入作為片狀體的尺寸的晶片尺寸、作為片狀體之間隔的晶片間距離的目標值及取決於黏著片AS之下的後述的常數K1、K2的值，並輸入自動運轉開始的訊號。另外，晶片尺寸係晶片CP的一邊的長度。此外，晶片間距離係被單片化而增寬的晶圓WF(相互間隔增加的晶片CP群)之相向的2邊的既定的位置(以下有時將相向的2邊的既定的位置簡稱為「基準位置」)之間隔。 　　然後，使用者或搬送機器人、多關節機器人、帶式搬送機等的未圖示的搬送手段搬送一體物WK，以該一體物WK配置於各下支撐構材22上的方式進行載置。此時，測定手段50與可移動一體物WK的未圖示的定位手段共動，進行晶圓WF與各保持構材21的定位。之後，各保持手段20驅動轉動馬達23，如示於圖2，以下支撐構材22與上支撐構材24夾住黏著片AS。 　　接著，控制手段40驅動線性馬達30A、30B，如示於圖3，一面使保持手段20移動於＋X軸方向、＋Y軸方向、-X軸方向、-Y軸方向的4方向，一面使保持構材21以等間隔移動於與使保持手段20移動的方向交叉的交叉方向。此時，控制手段40將晶片尺寸CS與晶片間距離CD的目標值應用於下述的式(1)而算出黏著片AS的伸長量EA的目標值。然後，控制手段40以黏著片AS的伸長量EA成為以式(1)所得的目標值且各保持手段20的保持構材21之間隔成為等間隔的方式，驅動線性馬達30A、30B。藉此，對黏著片AS賦予張力於＋X軸方向、＋Y軸方向、-X軸方向、 -Y軸方向的4方向，晶片CP的相互間隔增加為晶片間距離CD的目標值。

Figure 02_image003
CD：晶片間距離(μm) 　　CS：晶片尺寸(mm) 　　EA：黏著片AS的伸長量(mm) 　　K1、K2：常數 　　晶片間距離CD方面，使用經由操作手段而輸入的目標值，晶片尺寸CS方面，使用經由操作手段而輸入的尺寸值。常數K1、K2係依黏著片AS而定的值，經由操作手段輸入。另外，關於式(1)的根據後述之。 　　之後，搬送裝置、拾取裝置等的未圖示的搬送手段將各晶片CP保持而搬送，搭載於載具、引線框架、基板等的被搭載物上。然後，全部的晶片CP的搬送結束時，控制手段40驅動各驅動機器，使各構材回歸至初始位置後，搬送手段回收晶片CP被卸除的一體物WK，之後重複上述同樣的動作。 　　如以上，分離裝置10使黏著片AS的伸長量EA為從式(1)所得之值，使得可使晶片間距離CD為其目標值。此處，式(1)基於以下的根據而定。 　　首先，為了調查有關在晶片CP為正方形的情況下的黏著片AS的伸長量EA與晶片間距離CD的關係，一面使各保持手段20分別移動於＋X軸方向、＋Y軸方向、-X軸方向、-Y軸方向的4方向，一面使各保持手段20的保持構材21等間隔移動的結果，獲得示於圖4的結果。另外，黏著片AS方面，使用示於表1者。此外，晶片間距離CD係將晶圓WF沿著X軸方向及Y軸方向一次分割5行所得的25個晶片CP之中，就位於X軸方向及Y軸方向的各自的中央行的9個晶片，測定彼此相向的邊之間隔，使用其平均值。
Figure 02_image005
如示於圖4，雖相對於伸長量EA的晶片間距離CD的值因黏著片AS而異，對於全部的黏著片AS，伸長量EA與晶片間距離CD之間成立線形的關係。另外，晶片CP設為3×3mm的正方形的尺寸。 　　再者，改變晶片尺寸CS而調查的結果，如示於圖5，黏著片AS的伸長量EA為任一個條件下，晶片尺寸CS與晶片間距離CD之間皆成立線形的關係。另外，黏著片AS方面，使用表1的A者。 　　接著，為了調查有關在晶片CP為長方形的情況下的晶片尺寸CS與晶片間距離CD的關係，就X軸方向及Y軸方向的尺寸分別為6×2mm、6×4mm、6×6mm的晶片CP，使黏著片AS於X軸方向及Y軸方向伸長相同的量的結果，獲得示於圖6的結果。另外，黏著片AS方面，使用表1的A者。此外，黏著片AS的伸長量EA係X軸方向及Y軸方向皆設為60mm。 　　如示於圖6，在6×6mm的正方形的晶片CP，晶片間距離CD在X軸方向及Y軸方向成為大致上相同的值。另一方面，在6×2mm及6×4mm的長方形的晶片CP，X軸方向的晶片間距離CD相對於晶片尺寸CS線性地減少，Y軸方向的晶片間距離CD相對於晶片尺寸CS線性地增加。為此，為了使黏著片AS在X軸方向與Y軸方向依晶片尺寸CS而獨立伸長，將圖5的圖形按晶片尺寸CS以黏著片AS的伸長量EA與晶片間距離CD的關係進行繪示者即為圖7。 　　如示於圖7，即使晶片尺寸CS不同的情況下，晶片間距離CD亦相對於黏著片AS的伸長量EA線性地增加。為此，於黏著片AS的伸長量EA與晶片間距離CD之間，成立下述的式(2)的關係。
Figure 02_image007
K：線形回歸斜率 　　所以，透過線形回歸求出圖7的各圖形的斜率的結果，相對於各晶片尺寸CS的式(2)的關係式成為如下述的表2。如示於表2，各晶片尺寸CS皆相關係數為0.99，顯示良好的線性。
Figure 02_image009
圖8係將表2的晶片尺寸CS與線形回歸斜率K的關係進行圖形化者。如示於圖8，線形回歸斜率K相對於晶片尺寸CS線性地增加。此情況下，於晶片尺寸CS與線形回歸斜率K之間，成立下述的式(3)的關係。
Figure 02_image011
然後，將式(3)代入式(2)時，獲得下述的式(4)。
Figure 02_image013
式(4)係表1的A的黏著片AS方面的晶片尺寸CS、晶片間距離CD及黏著片AS的伸長量EA的關係式。因此，使用表1的A的黏著片AS的情況下，將晶片尺寸CS與晶片間距離CD的目標值應用於式(4)時，求出黏著片AS的伸長量EA。晶片CP為正方形的情況下，晶片尺寸CS的值為1個，故使用式(4)的計算式為1個。晶片CP為長方形的情況下，晶片尺寸CS在X軸方向與Y軸方向不同，按晶片尺寸CS應用式(4)的計算式，故使用式(4)的計算式成為2個。 　　此外，根據目前為止的說明，即使黏著片AS、晶片尺寸CS改變，於晶片尺寸CS、晶片間距離CD及黏著片AS的伸長量EA之間仍成立線形的關係。所以，將式(4)的常數部分一般化者即為上述式(1)。因此，每個黏著片AS方面式(1)的常數K1、K2的值固定，即使黏著片AS改變，仍可易於配合黏著片AS改變常數K1、K2的值從而求出黏著片AS的伸長量EA。 　　依如以上的實施方式時，依晶片尺寸CS與晶片間距離CD的目標值算出黏著片AS的伸長量EA的目標值，以黏著片AS的伸長量EA成為該伸長量EA的目標值的方式使保持構材21移動，故能以簡易的方法設定黏著片AS的伸長量EA，可防止每個單位時間的處理能力降低。 [第2實施方式] 　　圖9中，分離裝置10被構成為控制手段40基於測定手段50的測定結果而控制保持構材21的移動。另外，黏著片AS及晶圓WF分別俯視下形成為圓形。 　　控制手段40如同上述，以黏著片AS的伸長量EA成為以式(1)所得的值且各保持手段20的保持構材21之間隔成為等間隔的方式，驅動線性馬達30A、30B。藉此，雖可使晶片間距離CD接近目標值，惟如示於圖10，即便如此有時仍於晶片CP的相互間隔微妙地產生差異，無法將各晶片CP配置於理論上的位置。 　　所以，控制手段40基於測定手段50的測定結果而驅動線性馬達30B，如示於圖11，使保持構材21進一步移動於前後方向或左右方向而調整各保持構材21彼此之間隔，從而可調整晶片CP的相互間隔。藉此，可使各晶片CP配置於理論上的位置(極力使各晶片CP的相互間隔為等間隔)。 　　另外，在透過線性馬達30B的驅動而調整晶片CP的相互間隔之際，可各保持構材21中至少一者移動，可此等移動距離、移動方向相同，亦可不同。 [第3實施方式] 　　圖12中，分離裝置10具備屬驅動機器的作為伸長手段的線性馬達30A、30B、30C，以線性馬達30C的滑件支撐保持構材21。 　　線性馬達30C被與線性馬達30A平行地延伸設置，支撐於線性馬達30B的滑件31B。 　　於以上的分離裝置10，控制手段40如同上述，驅動線性馬達30A、30B，使晶片間距離CD接近目標值。在即便如此有時仍於晶片CP的相互間隔微妙地產生差異而無法將各晶片CP配置於理論上的位置的情況下，控制手段40驅動線性馬達30C，如示於圖12，使保持構材21移動於與使保持手段20移動的方向平行的方向而使各晶片CP配置於理論上的位置。 　　如以上，在前述記載揭露用於實施本發明的最佳的構成、方法等，惟本發明非限定於此等者。亦即，本發明主要就特定的實施方式特別繪圖且說明，惟在不脫離本發明的技術思想及目的之範圍之下，對以上論述的實施方式，於形狀、材質、數量、其他詳細的構成，本發明所屬技術領域中具有通常知識者可追加各種的變形。此外，將揭露於上述的形狀、材質等進行限定的記載係為了使本發明的理解變容易而例示性記載者，非限定本發明者，故以除去該等之形狀、材質等的限定的一部分或全部的限定之下的構材的名稱的記載係包含於本發明中。 　　保持手段20可為機械式夾具、夾頭缸等的夾持手段、減壓泵浦、真空噴射器等的未圖示的減壓手段、以黏著劑、磁力等支撐一體物WK的構成。 　　保持手段20具有的保持構材21可為2體至4體，亦可為6體以上，在各保持手段20的個數可為相同，亦可不同。 　　各保持構材21移動的交叉方向，係可為與保持手段20透過線性馬達30A移動的方向正交的方向，亦可為斜向交叉的方向。此情況下，亦可設置線性馬達30C。 　　伸長手段可固定各保持手段20中的至少1體而使其他保持手段20移動，此情況下，可不設置使打算固定的保持手段20移動的線性馬達30A。 　　亦可代替或併用線性馬達30A而設置線性馬達30C。此情況下，可按保持構材21設置線性馬達30C，亦可不按保持構材21設置。 　　線性馬達30B係亦可將各保持構材21中的至少1體進行固定，透過線性馬達30A使其他保持構材21移動於與保持手段20移動的方向正交的方向。 　　控制手段40可將黏著片AS與該常數K1、K2的值賦予關聯而記憶，經由操作手段選擇黏著片AS從而自動將常數K1、K2應用於式(1)。 　　控制手段40係於晶片尺寸CS、晶片間距離CD及黏著片AS的伸長量EA之間，式(1)以外的一定的關係成立的情況下，可將晶片尺寸CS與晶片間距離CD的目標值應用於該一定的關係，算出黏著片AS的伸長量EA的目標值。 　　測定手段50亦被構成為控制手段40不基於測定手段50的測定結果而控制保持構材21的移動。此情況下，認識到晶片CP的相互間隔非相同的使用者可操作保持手段20、線性馬達30B，調整晶片CP的相互間隔。 　　黏著片AS的形狀，係可為圓形，亦可為五角形以上的多角形，亦可為其他形狀。 　　晶圓WF可設為長方形。 　　晶片CP可為圓形、正方形、長方形、三角形、五角形以上的多角形等、其他形狀。 　　一體物WK可為圓形的晶圓WF暫黏於正方形的黏著片AS者，亦可為正方形或長方形狀的晶圓WF暫黏於圓形的黏著片AS者。 　　此外，本發明中的黏著片AS的材質、類別、形狀等未特別限定。例如，黏著片AS可為圓形、橢圓形、三角形、五角形以上的多角形、其他形狀。此外，黏著片AS可為例如僅黏著劑層的單層者、在基材與黏著劑層之間具有中間層者、在基材之上表面具有遮蓋層等3層以上者，再者亦可為如將基材從黏著劑層剝離的所謂雙面黏著片者，雙面黏著片可為具有單層或複層之中間層者、無中間層的單層或複層者。此外，基材、黏著劑層的材質、類別、厚度等未特別限定，例如亦可為胺基甲酸酯材質的基材。 　　板狀構材、片狀體的形狀亦可為例如圓形、橢圓形、三角形、五角形以上的多角形等、其他形狀。再者，板狀構材方面係例如，矽半導體晶圓、化合物半導體晶圓等的半導體晶圓、電路基板、光碟等的資訊記錄基板、玻璃板、鋼板、陶器、木板或樹脂板等任意的方式的構材、物品等皆可當作對象，片狀體只要為其等被單片化者即可。另外，黏著片AS換成功能性、用途性的讀法，例如可為保護片、切割帶、晶粒黏著膜DAF、晶粒接合帶等的任意的薄片、膜、貼帶等。 　　在本發明中的手段及程序只要可發揮就該等手段及程序進行說明的動作、功能或程序，則無任何限定，更不論未完全限定於在前述實施方式所示的僅一實施方式的構成物、程序。例如，保持手段只要為能以複數個保持構材保持黏著片者，則對照申請時的技術常識，只要為該技術範圍內者即無任何限定(其他手段及程序方面的說明係省略)。 　　此外，前述實施方式中的驅動機器只要可採用轉動馬達、直線馬達、線性馬達、單軸機器人、多關節機器人等的電動機器、汽缸、油壓缸、無桿缸及旋缸等的致動器等，則亦可採用將該等直接或間接組合者(亦存在與在實施方式所例示者重複者)。Hereinafter, each embodiment of the present invention will be described based on the drawings. In addition, in each embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. In addition, in this embodiment, when the direction is shown based on the case of viewing from the front direction in FIG. 1 parallel to the Y axis, "up" is the arrow direction of the Z axis, and "down" is the reverse direction. , "left" is the arrow direction of the X axis, "right" is the reverse direction, "front" is the arrow direction of the Y axis, that is, the front direction perpendicular to the paper in Figure 1, and "rear" is the reverse. In addition, in the following second embodiment, the same members and members having the same functions as those described in the first embodiment are denoted by the same reference numerals as the members in the first embodiment, and are denoted by the same reference numerals. Description is omitted or simplified. [First Embodiment] In FIGS. 1 and 2 , the separation device 10 applies tension in the +X-axis direction, +Y-axis direction, -X-axis direction, - In the four directions of the Y-axis direction, a device for increasing the mutual spacing of the wafers CP formed from the wafer WF as a plurality of sheet-like bodies is provided with four holding means 20 for holding the adhesive sheet AS in a five-piece holding structure. The material 21 is held; the linear motors 30A, 30B, which are driving machines as elongation means, move the holding member 21 in a different direction for each holding means 20 among the aforementioned 4 directions, and move the holding member 21 to the The adhesive sheet AS is stretched in the intersecting direction intersecting with the above-mentioned 1 direction; the control means 40 controls the movement of the holding member 21 under the linear motors 30A and 30B; the measuring means 50 such as an optical sensor and a camera , the mutual spacing of the wafers CP is measured. In addition, the wafer WF is formed into a square in plan view, and is singulated into a wafer CP by a wafer cutting means such as a cutting blade, pressurized water, dry etching, etc., or the wafer is fragile by laser light, chemical solution, etc. It can be singulated into a chip CP by means of singulation, and temporarily adhered to the adhesive sheet AS to form an integrated body WK. In addition, the adhesive sheet AS is formed in a square shape in plan view. The holding means 20 includes a holding member 21 supported by each of the plurality of sliders 31B of the linear motor 30B. The holding member 21 includes a lower support member 22 supported by the slider 31B, a swing motor 23 as a driving device supported by the lower support member 22 , and an upper support supported by an output shaft 23A (through shaft) of the swing motor 23 Member 24. The holding means 20 and the linear motor 30A are provided as four bodies in front, rear, left and right with the center point CT as the center. The linear motor 30B is supported by the slider 31A of the linear motor 30A. According to the above configuration, the linear motor 30A moves the holding means 20 in different directions for each holding means 20 , and the linear motor 30B moves the holding member 21 in the intersecting direction intersecting with the moving direction of the holding means 20 . Tension can be imparted to the adhesive sheet AS. The control means 40 is composed of a personal computer, a sequencer, or the like, and is configured not only to control the movement of the holding member 21 under the linear motors 30A and 30B, but also to control the entire operation of the separation device 10 . The procedure of increasing the mutual intervals of the plurality of wafers CP formed from the wafer WF in the separation apparatus 10 described above will be described. First, the separation device 10 shown by the solid line in FIG. 1 in which each member is in standby at the initial position, the user of the separation device 10 (hereinafter simply referred to as a "user") via an operation panel, a personal computer, etc., not shown in the figure operation means, input the wafer size as the size of the sheet body, the target value of the inter-wafer distance as the interval between the sheet bodies, and the values depending on the constants K1 and K2 described later under the adhesive sheet AS, and input the automatic operation. start signal. In addition, the wafer size is the length of one side of the wafer CP. In addition, the inter-wafer distance is a predetermined position of two opposing sides of wafers WF (groups of wafers CP whose mutual distances are increased) that are widened by singulation (hereinafter, the predetermined position of two opposing sides may be simply referred to as "reference position"). Then, the integrated object WK is transported by a user or a transporting means not shown such as a transport robot, an articulated robot, and a belt conveyor, and the integrated object WK is placed on each of the lower support members 22 . At this time, the measuring means 50 cooperates with the positioning means (not shown) of the movable integrated object WK to perform the positioning of the wafer WF and the respective holding members 21 . After that, each holding means 20 drives the rotation motor 23, and as shown in FIG. 2, the lower support member 22 and the upper support member 24 sandwich the adhesive sheet AS. Next, the control means 40 drives the linear motors 30A and 30B to move the holding means 20 in four directions of the +X-axis direction, the +Y-axis direction, the -X-axis direction, and the -Y-axis direction, as shown in FIG. 3 . The material 21 is moved at equal intervals in the intersecting direction intersecting the direction in which the holding means 20 is moved. At this time, the control means 40 calculates the target value of the elongation amount EA of the adhesive sheet AS by applying the target value of the wafer size CS and the inter-wafer distance CD to the following formula (1). Then, the control means 40 drives the linear motors 30A and 30B so that the elongation EA of the adhesive sheet AS becomes the target value obtained by the formula (1) and the interval between the holding members 21 of each holding means 20 is equal. Thereby, tension is applied to the adhesive sheet AS in four directions of +X-axis direction, +Y-axis direction, -X-axis direction, and -Y-axis direction, and the mutual space between wafers CP increases to a target value of inter-wafer distance CD.
Figure 02_image003
CD: Inter-wafer distance (μm) CS: Wafer size (mm) EA: Elongation amount of adhesive sheet AS (mm) K1, K2: Constant inter-wafer distance CD Using the target value input through the operation means, the wafer size CS On the one hand, the dimension value input via the operation means is used. The constants K1 and K2 are values determined by the adhesive sheet AS, and are input through the operation means. In addition, the basis of the formula (1) will be described later. After that, each wafer CP is held and conveyed by conveying means, not shown, such as a conveying device and a pickup device, and is mounted on an object to be mounted such as a carrier, a lead frame, and a substrate. Then, when the transfer of all the wafers CP is completed, the control means 40 drives the respective drive devices to return each member to the initial position, and then the transfer means recovers the integrated body WK from which the wafers CP have been detached, and repeats the same operations as described above. As described above, the separation apparatus 10 makes the elongation amount EA of the adhesive sheet AS a value obtained from the formula (1), so that the inter-wafer distance CD can be set to a target value. Here, Formula (1) is determined based on the following grounds. First, in order to investigate the relationship between the elongation amount EA of the adhesive sheet AS and the inter-wafer distance CD when the wafer CP is square, each holding means 20 is moved in the +X-axis direction, the +Y-axis direction, and the -X-axis direction, respectively. The results shown in FIG. 4 were obtained when the holding members 21 of the holding means 20 were moved at equal intervals in the four directions of the -Y axis direction. In addition, the adhesive sheet AS shown in Table 1 was used. In addition, the inter-wafer distance CD refers to 9 of the 25 wafers CP obtained by dividing the wafer WF into 5 rows at a time in the X-axis direction and the Y-axis direction, which are located in the center of each of the X-axis direction and the Y-axis direction. For the wafer, the distance between the sides facing each other was measured, and the average value was used.
Figure 02_image005
As shown in FIG. 4 , although the value of the inter-wafer distance CD with respect to the elongation EA varies depending on the adhesive sheet AS, a linear relationship is established between the elongation EA and the inter-wafer distance CD for all the adhesive sheets AS. In addition, the wafer CP was set to have a square size of 3×3 mm. Furthermore, as shown in FIG. 5 , as a result of investigation by changing the wafer size CS, a linear relationship is established between the wafer size CS and the inter-wafer distance CD under any condition that the elongation amount EA of the adhesive sheet AS is. In addition, as the adhesive sheet AS, A of Table 1 was used. Next, in order to investigate the relationship between the wafer size CS and the inter-wafer distance CD when the wafer CP is a rectangle, the dimensions of the X-axis direction and the Y-axis direction are respectively 6×2 mm, 6×4 mm, and 6×6 mm. For CP, the results shown in FIG. 6 were obtained as a result of extending the adhesive sheet AS by the same amount in the X-axis direction and the Y-axis direction. In addition, as the adhesive sheet AS, A of Table 1 was used. In addition, the elongation amount EA of the adhesive sheet AS was set to 60 mm in both the X-axis direction and the Y-axis direction. As shown in FIG. 6 , in the 6×6 mm square wafer CP, the inter-wafer distance CD has substantially the same value in the X-axis direction and the Y-axis direction. On the other hand, in the rectangular wafers CP of 6×2 mm and 6×4 mm, the inter-wafer distance CD in the X-axis direction decreases linearly with respect to the wafer size CS, and the inter-wafer distance CD in the Y-axis direction linearly decreases with respect to the wafer size CS Increase. Therefore, in order to make the adhesive sheet AS independently stretch in the X-axis direction and the Y-axis direction according to the wafer size CS, the graph of FIG. It is shown in Figure 7. As shown in FIG. 7 , even when the wafer size CS is different, the inter-wafer distance CD increases linearly with respect to the elongation amount EA of the adhesive sheet AS. Therefore, the relationship of the following formula (2) is established between the elongation amount EA of the adhesive sheet AS and the inter-wafer distance CD.
Figure 02_image007
K: Linear regression slope Therefore, as a result of obtaining the slope of each graph of FIG. 7 by linear regression, the relational expression of the formula (2) with respect to each wafer size CS is as shown in Table 2 below. As shown in Table 2, the correlation coefficient of each wafer size CS was 0.99, showing good linearity.
Figure 02_image009
FIG. 8 is a graph of the relationship between the wafer size CS and the linear regression slope K in Table 2. FIG. As shown in Figure 8, the linear regression slope K increases linearly with respect to the wafer size CS. In this case, the relationship of the following formula (3) is established between the wafer size CS and the linear regression slope K.
Figure 02_image011
Then, when formula (3) is substituted into formula (2), the following formula (4) is obtained.
Figure 02_image013
The formula (4) is a relational expression of the wafer size CS, the inter-wafer distance CD, and the elongation EA of the adhesive sheet AS in A of Table 1. Therefore, when the adhesive sheet AS of Table 1 A is used, when the target values of the wafer size CS and the inter-wafer distance CD are applied to the formula (4), the elongation amount EA of the adhesive sheet AS is obtained. When the wafer CP is a square, since the value of the wafer size CS is one, the calculation formula using the formula (4) is one. When the wafer CP is a rectangle, the wafer size CS differs in the X-axis direction and the Y-axis direction, and the formula (4) is applied for each wafer size CS, so there are two calculation formulas using the formula (4). In addition, according to the description so far, even if the adhesive sheet AS and the wafer size CS are changed, a linear relationship is established among the wafer size CS, the inter-wafer distance CD, and the elongation amount EA of the adhesive sheet AS. Therefore, the formula (1) is obtained by generalizing the constant part of the formula (4). Therefore, the values of the constants K1 and K2 of the formula (1) are fixed for each adhesive sheet AS. Even if the adhesive sheet AS is changed, it is easy to change the values of the constants K1 and K2 according to the adhesive sheet AS to obtain the elongation of the adhesive sheet AS. EA. According to the above embodiment, the target value of the elongation EA of the adhesive sheet AS is calculated from the target values of the wafer size CS and the inter-wafer distance CD, so that the elongation EA of the adhesive sheet AS becomes the target value of the elongation EA. Since the holding member 21 is moved, the elongation amount EA of the adhesive sheet AS can be set in a simple manner, and it is possible to prevent a decrease in the processing capacity per unit time. 2ND EMBODIMENT In FIG. 9, the separation apparatus 10 is comprised so that the control means 40 may control the movement of the holding member 21 based on the measurement result of the measurement means 50. In addition, the adhesive sheet AS and the wafer WF are each formed in a circular shape in plan view. As described above, the control means 40 drives the linear motors 30A and 30B so that the elongation EA of the adhesive sheet AS becomes the value obtained by the formula (1) and the interval between the holding members 21 of each holding means 20 is equal. In this way, the inter-wafer distance CD can be brought close to the target value, but as shown in FIG. 10 , there are cases where a slight difference occurs in the mutual spacing of the wafers CP, and the individual wafers CP cannot be arranged at theoretical positions. Therefore, the control means 40 drives the linear motor 30B based on the measurement result of the measurement means 50 to move the holding members 21 further in the front-rear direction or the left-right direction as shown in FIG. The mutual spacing of the wafers CP is adjusted. Thereby, each wafer CP can be arrange|positioned in a theoretical position (the mutual space|interval of each wafer CP is made to be equal space|interval as much as possible). In addition, at least one of the holding members 21 may be moved when the distance between the wafers CP is adjusted by the driving of the linear motor 30B, and the moving distances and moving directions may be the same or different. [Third Embodiment] In FIG. 12 , the separation device 10 includes linear motors 30A, 30B, and 30C as extension means, which are driving devices, and the holding member 21 is supported by a slider of the linear motor 30C. The linear motor 30C is extended in parallel with the linear motor 30A, and is supported by the slider 31B of the linear motor 30B. In the separation apparatus 10 described above, the control means 40 drives the linear motors 30A and 30B so that the inter-wafer distance CD approaches the target value as described above. Even in this case, when there is a case where there is a slight difference in the distance between the wafers CP and each wafer CP cannot be arranged at a theoretical position, the control means 40 drives the linear motor 30C, as shown in FIG. 12 , to cause the holding member 21 moves in a direction parallel to the direction in which the holding means 20 is moved to arrange each wafer CP at a theoretical position. As described above, the above description discloses the best configuration, method, etc. for carrying out the present invention, but the present invention is not limited to these. That is, the present invention is mainly drawn and described with respect to a specific embodiment, but within the scope not departing from the technical idea and purpose of the present invention, the above-discussed embodiment has details in terms of shape, material, quantity, and other configurations. , and various modifications can be added by those with ordinary knowledge in the technical field to which the present invention pertains. In addition, the descriptions that limit the shape, material, etc. disclosed in the above are illustrative descriptions in order to facilitate the understanding of the present invention, and do not limit the present invention, so a part of the limitations of such shapes, materials, etc. are excluded. The description of the names of members or all of them under the limitations is included in the present invention. The holding means 20 may be a mechanical jig, clamping means such as a chuck cylinder, a decompression means not shown such as a decompression pump and a vacuum ejector, or a structure in which the integrated body WK is supported by an adhesive, a magnetic force, or the like. The holding members 21 included in the holding means 20 may be two to four, or six or more, and the number of the holding means 20 may be the same or different. The intersecting direction in which each holding member 21 moves may be a direction perpendicular to the direction in which the holding means 20 is moved by the linear motor 30A, or may be a direction intersecting obliquely. In this case, the linear motor 30C may also be provided. The extension means can fix at least one of the holding means 20 and move the other holding means 20. In this case, the linear motor 30A for moving the holding means 20 to be fixed does not need to be provided. Instead of or in combination with the linear motor 30A, the linear motor 30C may be provided. In this case, the linear motor 30C may be provided in accordance with the holding member 21 or may not be provided in accordance with the holding member 21 . The linear motor 30B may fix at least one of the holding members 21 , and the other holding members 21 may be moved in a direction orthogonal to the direction in which the holding means 20 moves through the linear motor 30A. The control means 40 can associate and memorize the values of the adhesive sheet AS and the constants K1 and K2, and select the adhesive sheet AS through the operation means to automatically apply the constants K1 and K2 to the formula (1). The control means 40 can set the target of the wafer size CS and the inter-wafer distance CD when a certain relationship other than the formula (1) is established among the wafer size CS, the inter-wafer distance CD, and the elongation amount EA of the adhesive sheet AS. The value is applied to this constant relationship, and the target value of the elongation amount EA of the adhesive sheet AS is calculated. The measurement means 50 is also configured such that the control means 40 controls the movement of the holding member 21 without the measurement results of the measurement means 50 . In this case, the user who realizes that the mutual intervals of the wafers CP are not the same can operate the holding means 20 and the linear motor 30B to adjust the mutual intervals of the wafers CP. The shape of the adhesive sheet AS may be a circle, a pentagon or a polygon, or other shapes. The wafer WF can be formed into a rectangle. The wafer CP may have other shapes, such as a circle, a square, a rectangle, a triangle, a polygon other than a pentagon, and the like. The integrated object WK may be a circular wafer WF temporarily adhered to a square adhesive sheet AS, or may be a square or rectangular wafer WF temporarily adhered to a circular adhesive sheet AS. In addition, the material, type, shape, etc. of the adhesive sheet AS in this invention are not specifically limited. For example, the adhesive sheet AS may be a circle, an ellipse, a triangle, a polygon other than a pentagon, or other shapes. In addition, the adhesive sheet AS may be, for example, a single layer of only an adhesive layer, a layer having an intermediate layer between the substrate and the adhesive layer, and a covering layer on the upper surface of the substrate having three or more layers, or else As a so-called double-sided adhesive sheet in which the base material is peeled from the adhesive layer, the double-sided adhesive sheet may have a single layer or an intermediate layer, or a single layer or multiple layers without an intermediate layer. In addition, the material, type, thickness, etc. of the base material and the adhesive layer are not particularly limited, and for example, a base material made of urethane may be used. The shape of the plate-like member and the sheet-like body may be, for example, other shapes such as a circle, an ellipse, a triangle, a polygon such as a pentagon or more. In addition, in terms of plate-shaped members, for example, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit boards, information recording substrates such as optical discs, glass plates, steel plates, ceramics, wood boards, and resin plates are used. Any type of members, articles, etc. can be used as objects, and the sheet-like body only needs to be singulated. In addition, the adhesive sheet AS can be replaced with a functional and useful reading, and may be any sheet, film, tape, or the like such as a protective sheet, a dicing tape, a die attach film DAF, a die bonding tape, or the like. The means and programs in the present invention are not limited in any way, as long as they can exhibit the operations, functions, or programs described in relation to the means and programs, and are not completely limited to the configuration of only one embodiment shown in the above-mentioned embodiment. objects, programs. For example, as long as the holding means can hold the pressure-sensitive adhesive sheet by a plurality of holding members, there is no restriction on the technical common sense at the time of filing, as long as it is within the technical scope (descriptions of other means and procedures are omitted). In addition, as long as the driving machine in the above-mentioned embodiment can use electric machines such as rotary motors, linear motors, linear motors, single-axis robots, articulated robots, etc., and actuators such as cylinders, hydraulic cylinders, rodless cylinders, and rotary cylinders, etc. etc., the direct or indirect combination of these can also be used (there are also those repeated with those exemplified in the embodiment).

10‧‧‧分離裝置20‧‧‧保持手段21‧‧‧保持構材22‧‧‧下支撐構材23‧‧‧轉動馬達23A‧‧‧輸出軸24‧‧‧上支撐構材30A‧‧‧線性馬達30B‧‧‧線性馬達30C‧‧‧線性馬達31A‧‧‧滑件31B‧‧‧滑件40‧‧‧控制手段50‧‧‧測定手段AS‧‧‧黏著片CP‧‧‧晶片CT‧‧‧中心點WF‧‧‧晶圓WK‧‧‧一體物10‧‧‧Separation device 20‧‧‧Holding means 21‧‧‧Holding member 22‧‧‧Lower supporting member 23‧‧‧Rotating motor 23A‧‧‧Output shaft 24‧‧‧Upper supporting member 30A‧‧ ‧Linear Motor 30B‧‧‧Linear Motor 30C‧‧‧Linear Motor 31A‧‧‧Slide 31B‧‧‧Slide 40‧‧‧Control Means 50‧‧‧Measuring Means AS‧‧‧Adhesive Sheet CP‧‧‧Chip CT‧‧‧Centre pointWF‧‧‧Wafer WK‧‧‧Integrated

圖1係本發明的第1實施方式相關的分離裝置之側視圖。 　　圖2係圖1的分離裝置的平面圖。 　　圖3係圖1的分離裝置的動作說明圖。 　　圖4係就黏著片的伸長量與晶片間距離的關係進行繪示的圖形。 　　圖5係就晶片尺寸與晶片間距離的關係進行繪示的圖形。 　　圖6係就複數個晶片尺寸與晶片間距離的關係的關係進行繪示的圖形。 　　圖7係圖5以黏著片的伸長量與晶片間距離的關係進行繪示的圖形。 　　圖8係就晶片尺寸與圖7的線形回歸斜率的關係進行繪示的圖形。 　　圖9係本發明的第2實施方式相關的分離裝置的平面圖。 　　圖10係圖9的分離裝置的動作說明圖。 　　圖11係圖9的分離裝置的動作說明圖。 　　圖12係本發明的第3實施方式相關的分離裝置的動作說明圖。FIG. 1 is a side view of a separation device according to a first embodiment of the present invention. Fig. 2 is a plan view of the separation device of Fig. 1 . Fig. 3 is an explanatory diagram of the operation of the separation device of Fig. 1 . Figure 4 is a graph showing the relationship between the elongation of the adhesive sheet and the distance between the wafers. Figure 5 is a graph showing the relationship between the wafer size and the distance between wafers. Figure 6 is a graph showing the relationship between the dimensions of a plurality of wafers and the distance between wafers. Fig. 7 is a graph showing the relationship between the elongation of the adhesive sheet and the distance between the wafers in Fig. 5 . Figure 8 is a graph plotting the relationship between wafer size and the slope of the linear regression of Figure 7. Fig. 9 is a plan view of a separation device according to a second embodiment of the present invention. Fig. 10 is an explanatory diagram of the operation of the separation device of Fig. 9 . Fig. 11 is an explanatory diagram of the operation of the separation device shown in Fig. 9 . Fig. 12 is an explanatory diagram of the operation of the separation device according to the third embodiment of the present invention.

10‧‧‧分離裝置 10‧‧‧Separation device

20‧‧‧保持手段 20‧‧‧Maintaining Means

21‧‧‧保持構材 21‧‧‧Maintaining members

23‧‧‧轉動馬達 23‧‧‧Rotating the motor

24‧‧‧上支撐構材 24‧‧‧Upper support member

30A‧‧‧線性馬達 30A‧‧‧Linear motor

30B‧‧‧線性馬達 30B‧‧‧Linear Motor

31A‧‧‧滑件 31A‧‧‧Slide

31B‧‧‧滑件 31B‧‧‧Slide

40‧‧‧控制手段 40‧‧‧Control means

CP‧‧‧晶片 CP‧‧‧Chip

CT‧‧‧中心點 CT‧‧‧Center Point

WF‧‧‧晶圓 WF‧‧‧Wafer

WK‧‧‧一體物 WK‧‧‧All in one

AS‧‧‧黏著片 AS‧‧‧Adhesive Sheet

Claims (4)

一種分離裝置，對黏著片上的板狀構材賦予4方向的張力而增加從該板狀構材形成的複數個片狀體的相互間隔，具備：複數個保持手段，分別以複數個保持構材保持前述黏著片；伸長手段，使前述保持構材移動於前述4方向之中每個前述保持手段不同的1方向，並使該保持構材移動於與前述1方向交叉的交叉方向而使前述黏著片伸長；和控制手段，控制利用前述伸長手段之下的前述保持構材的移動；前述控制手段依前述片狀體的尺寸與前述片狀體之間隔的目標值而算出前述黏著片的伸長量的目標值，使前述伸長手段以前述黏著片的伸長量成為該伸長量的目標值的方式移動前述保持構材。 A separation device for applying tension in four directions to a plate-like member on an adhesive sheet to increase the mutual interval of a plurality of sheet-like bodies formed from the plate-like member, comprising: a plurality of holding means, each of which is a plurality of holding members Holding the above-mentioned adhesive sheet; extending means to move the above-mentioned holding member in one direction different for each of the above-mentioned holding means among the above-mentioned 4 directions, and move the holding member in a cross direction intersecting with the above-mentioned one direction to make the above-mentioned adhesion sheet elongation; and control means for controlling the movement of the holding member under the elongation means; the control means calculates the elongation amount of the adhesive sheet according to the size of the sheet-like body and the target value of the interval between the sheet-like bodies the target value, and the extending means moves the holding member so that the elongation of the adhesive sheet becomes the target value of the elongation. 如請求項1的分離裝置，其中，前述控制手段將前述片狀體的尺寸與前述片狀體之間隔的目標值應用於式(1)而算出前述黏著片的伸長量的目標值，前述式(1)為CD=(K1×CS+K2)×EA，其中CD為片狀體的間隔(μm)，CS為片狀體的尺寸(mm)，EA為黏著片的伸長量(mm)，K1、K2為常數。 The separation device according to claim 1, wherein the control means calculates the target value of the elongation of the adhesive sheet by applying the target value of the size of the sheet-like body and the interval between the sheet-like bodies to the formula (1), and the formula (1) is CD=(K1×CS+K2)×EA, where CD is the interval of the sheet (μm), CS is the size of the sheet (mm), EA is the elongation of the adhesive sheet (mm), K1 and K2 are constants. 如請求項1或2的分離裝置，其具有測定前述片狀體的相互間隔的測定手段，前述控制手段基於以前述測定手段的測定結果，使前述伸長手段移動前述保持構材。 The separation device according to claim 1 or 2, comprising measuring means for measuring the mutual distance between the sheet-like bodies, and the control means moves the holding member by the extending means based on the measurement results by the measuring means. 一種分離方法，對黏著片上的板狀構材賦予4方向的張力而增加從該板狀構材形成的複數個片狀體的相互間隔，具備：保持程序，以分別具備複數個保持構材的複數個保持手段保持前述黏著片；和伸長程序，使前述保持構材移動於前述4方向之中每個前述保持手段不同的1方向，並使該保持構材移動於與前述1方向交叉的交叉方向而使前述黏著片伸長；在前述伸長程序，依前述片狀體的尺寸與前述片狀體之間隔的目標值而算出前述黏著片的伸長量的目標值，以前述黏著片的伸長量成為該伸長量的目標值的方式使前述保持構材移動。 A separation method in which a tension in four directions is applied to a plate-like member on an adhesive sheet to increase the mutual interval of a plurality of sheet-like bodies formed from the plate-like member, comprising: a holding procedure for each having a plurality of holding members. A plurality of holding means hold the above-mentioned adhesive sheet; and an elongation process, the holding member is moved in one direction different for each of the holding means among the four directions, and the holding member is moved in a cross that intersects the one direction. The adhesive sheet is stretched in the direction of the direction; in the stretching procedure, the target value of the elongation amount of the adhesive sheet is calculated according to the size of the sheet-like body and the target value of the interval between the sheet-like bodies, and the elongation amount of the adhesive sheet becomes The aforementioned holding member is moved so as to reach the target value of the elongation amount.
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