JP6912938B2 - Separation device and separation method - Google Patents

Description

The present invention relates to a separation device and a separation method.

Conventionally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter, may be simply referred to as a “wafer”) is cut into a predetermined shape and a predetermined size into a plurality of semiconductor chips (hereinafter, may be simply referred to as a “chip”). It is individualized, and after widening the mutual spacing between the individualized chips, it is mounted on an object to be mounted such as a lead frame or a substrate. Each chip is transported by a transport means such as a transport device or a pickup device based on a position derived by calculation (hereinafter, may be referred to as a "theoretical position"), and is mounted on an object to be mounted.

Further, in recent years, electronic devices have been made smaller, lighter, and more sophisticated, and semiconductor devices mounted on electronic devices are also required to be smaller, thinner, and higher in density. For this reason, the chip may be mounted in a package close to its size. Such a package is sometimes referred to as a chip scale package (CSP). One of the processes for manufacturing CSP is a wafer level package (WLP). In the WLP, an external electrode or the like is formed on the chip circuit forming surface before the package is diced by dicing, and finally the package wafer containing the chip is diced to be sliced. Examples of the WLP include a fan-in type and a fan-out type. In a fan-out type WLP (hereinafter, may be abbreviated as FO-WLP), the chip is covered with a sealing member so as to have a region larger than the chip size to form a chip encapsulant, and the chip encapsulant is formed again. The wiring layer and the external electrode are formed not only on the circuit surface of the chip but also on the surface region of the sealing member. In this case, before each of the individualized chips is surrounded by the sealing member, the wafer mount tape is replaced with an expanding wafer mount tape, and the wafer mount tape is spread to increase the distance between the plurality of chips.

As a separation method for widening the mutual spacing between the chips (pieces), an adhesive sheet such as a protective tape or a wafer mount tape to which a wafer (plate-shaped member) is attached is held by a plurality of holding means, and the holding means are held by each other. It is known to move in the direction of separation (see, for example, Patent Document 1). In such a method of widening the mutual distance between the chips, for example, tensions in four directions of + X-axis direction, −X-axis direction, + Y-axis direction, and −Y-axis direction are applied to the adhesive sheet. As a result, in addition to the above four directions on the adhesive sheet, for example, the combined direction thereof, that is, the combined direction of the + X-axis direction and the + Y-axis direction, the combined direction of the + X-axis direction and the -Y-axis direction, and the -X-axis direction. It prevents tension from being applied to the combined direction with the + Y-axis direction and the combined direction with the -X-axis direction and the -Y-axis direction, and prevents the position of each piece from shifting from the theoretical position. It can be prevented as much as possible.

Japanese Unexamined Patent Publication No. 2016-11188

The amount of elongation of the adhesive sheet required to place each piece in the theoretical position depends on the size of the piece and the type of adhesive sheet, so each time the size of the piece or the adhesive sheet is changed. , It is necessary to confirm the position of each piece while actually stretching the adhesive sheet and set the stretch amount. Since this setting takes time and the processing capacity per unit time decreases with the setting, the elongation amount of the adhesive sheet can be set by a simple method and the processing capacity per unit time does not decrease. It is desired to do.

An object of the present invention is to provide a separating device and a separating method capable of setting an elongation amount of an adhesive sheet by a simple method and preventing a decrease in processing capacity per unit time.

The separating device of the present invention is a separating device that applies tension to a plate-shaped member on an adhesive sheet in four directions to widen the mutual distance between a plurality of pieces formed from the plate-shaped member, and the adhesive sheet. The holding means is moved in one of the four directions, which is different for each holding means, and the holding member is moved in the intersecting direction intersecting the one direction. An extending means for moving and extending the adhesive sheet and a control means for controlling the movement of the holding member by the extending means are provided, and the control means determines the size of the piece and the distance between the pieces. The feature is that the target value of the elongation amount of the adhesive sheet is calculated according to the target value, and the holding member is moved to the extension means so that the extension amount of the adhesive sheet becomes the target value of the extension amount. do.

In the separation device of the present invention, the control means applies the size of the piece and the target value of the distance between the pieces to the following formula (1) to calculate the target value of the elongation amount of the adhesive sheet. It is preferable to do so.
[Equation 1]
CD = (K1 x CS + K2) x EA ... (1)
CD: Fragment spacing (μm)
CS: Flake size (mm)
EA: Elongation amount of adhesive sheet (mm)
K1, K2: constant

The separating device of the present invention has a measuring means for measuring the mutual spacing between the pieces, and the controlling means can move the holding member to the extending means based on the measurement result of the measuring means. preferable.

The separation method of the present invention is a separation method in which tension is applied to a plate-shaped member on an adhesive sheet in four directions to widen the mutual distance between a plurality of pieces formed from the plate-shaped member, and a plurality of separation methods are provided. A holding step of holding the adhesive sheet by a plurality of holding means including a holding member, moving the holding member in one of the four directions different for each holding means, and intersecting the holding member in the one direction. The adhesive sheet is stretched by moving in the crossing direction to stretch the adhesive sheet. The holding member is moved so that the stretched amount of the adhesive sheet becomes the target value of the stretched amount.

According to the present invention as described above, the target value of the elongation amount of the adhesive sheet is calculated according to the size of the piece and the target value of the interval between the pieces, and the elongation amount of the adhesive sheet is the extension amount. Since the holding member is moved so as to reach the target value, the elongation amount of the adhesive sheet can be set by a simple method, and it is possible to prevent the processing capacity per unit time from being lowered.

Further, if the target value of the elongation amount of the adhesive sheet is calculated by applying the size of the flake body and the target value of the interval of the flake body to the equation (1), the adhesive sheet can be obtained by a simpler method. The amount of elongation can be set, and it is possible to more effectively prevent the processing capacity per unit time from decreasing.
Further, if the holding member is moved according to the target elongation amount based on the measurement result of the mutual spacing of the pieces, the position of each piece is positioned for each integral body in which the plate-shaped member is temporarily attached to the adhesive sheet. Can be prevented as much as possible from deviating from the theoretical position.

The side view of the separation device which concerns on 1st Embodiment of this invention. The plan view of the separation device of FIG. The operation explanatory view of the separation device of FIG. The graph which shows the relationship between the elongation amount of an adhesive sheet and the distance between chips. A graph showing the relationship between the chip size and the distance between chips. A graph showing the relationship between a plurality of chip sizes and the distance between chips. FIG. 5 is a graph showing the relationship between the elongation amount of the adhesive sheet and the distance between chips. The graph which shows the relationship between the chip size and the linear regression gradient of FIG. The plan view of the separation device which concerns on 2nd Embodiment of this invention. FIG. 9 is an operation explanatory view of the separation device of FIG. FIG. 9 is an operation explanatory view of the separation device of FIG. The operation explanatory drawing of the separation device which concerns on 3rd Embodiment of this invention.

Hereinafter, each embodiment of the present invention will be described with reference to the drawings.
In each embodiment, the X-axis, the Y-axis, and the Z-axis are orthogonal to each other, the X-axis and the Y-axis are axes in a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. And. Further, in the present embodiment, when viewed from the front direction in FIG. 1 parallel to the Y axis as a reference, when the direction is indicated, "up" is the direction of the arrow on the Z axis, "down" is the opposite direction, and ""Left" is the direction of the arrow on the X-axis, "right" is the opposite direction, "front" is the direction of the arrow on the Y-axis, and "rear" is the opposite direction.
Further, in the second and subsequent embodiments, the same constituent members as the constituent members described in the first embodiment and the constituent members having the same functions are designated by the same reference numerals as those of the first embodiment, and the description thereof will be described. Is omitted or simplified.

[First Embodiment]
In FIGS. 1 and 2, the separating device 10 applies tension to the square wafer WF as a plate-shaped member on the adhesive sheet AS in four directions of + X-axis direction, + Y-axis direction, −X-axis direction, and −Y-axis direction. A device for widening the mutual spacing between the chip CPs as a plurality of pieces formed from the wafer WF by applying the adhesive sheet AS, and the four holding means 20 for holding the adhesive sheet AS by the five holding members 21 respectively. The holding member 21 is moved in one of the four directions different for each holding means 20, and the holding member 21 is moved in the intersecting direction intersecting the one direction to extend the adhesive sheet AS. The linear motors 30A and 30B as extension means, the control means 40 for controlling the movement of the holding member 21 by the linear motors 30A and 30B, and the measuring means 50 such as an optical sensor and a camera for measuring the mutual distance between the chip CPs are provided. ing. The wafer WF has a square shape in a plan view and is either separated into chip CP by wafer cutting means such as cutting blade, pressurized water, and dry etching, or chip CP by wafer weakening means such as laser beam or chemical solution. It can be separated into individual pieces, and is temporarily attached to the adhesive sheet AS to form an integral WK. Further, the adhesive sheet AS is formed in a square shape in a plan view.

The holding means 20 includes a holding member 21 supported by each of the plurality of sliders 31B of the linear motor 30B.
The holding member 21 is supported by a lower support member 22 supported by the slider 31B, a rotary motor 23 as a drive device supported by the lower support member 22, and an output shaft 23A (through shaft) of the rotary motor 23. It also includes an upper support member 24.

Four holding means 20 and four linear motors 30A are provided in front, back, left and right with the center point CT as the center.
The linear motor 30B is supported by the slider 31A of the linear motor 30A.
With the above configuration, the linear motor 30A moves the holding means 20 in different directions for each holding means 20, and the linear motor 30B moves the holding member 21 in the intersecting direction intersecting the moving direction of the holding means 20. Therefore, tension can be applied to the adhesive sheet AS.

The control means 40 is composed of a personal computer, a sequencer, or the like, and is configured not only to control the movement of the holding member 21 by the linear motors 30A and 30B, but also to control the operation of the entire separation device 10.

In the above separation device 10, the procedure for widening the mutual distance between the plurality of chip CPs formed from the wafer WF will be described.
First, with respect to the separation device 10 shown by the solid line in FIG. 1 in which each member stands by at the initial position, the user of the separation device 10 (hereinafter, simply referred to as “user”) operates an operation panel, a personal computer, or the like (not shown). Through the means, the chip size as the size of the flake, the target value of the distance between the chips as the distance between the flake, and the values of the constants K1 and K2 described later determined by the adhesive sheet AS are input, and the automatic operation is performed. Enter the start signal. The chip size is the length of one side of the chip CP. Further, the inter-chip distance is defined by "referenced" the predetermined positions of the two opposing sides (hereinafter, the predetermined positions of the two opposing sides) in the wafer WF (chip CP group in which the mutual spacing is widened) that has been separated and expanded. It is the interval of (sometimes called "position").

Then, a user or a transfer means (not shown) such as a transfer robot, an articulated robot, or a belt conveyor conveys the integrated WK, and the integrated WK is placed on each lower support member 22. At this time, the measuring means 50 and the positioning means (not shown) that can move the integral WK cooperate with each other to position the wafer WF and each holding member 21. After that, each holding means 20 drives the rotary motor 23, and as shown in FIG. 2, the adhesive sheet AS is sandwiched between the lower support member 22 and the upper support member 24.

Next, the control means 40 drives the linear motors 30A and 30B, and as shown in FIG. 3, the holding means 20 is moved in four directions of the + X-axis direction, the + Y-axis direction, the −X-axis direction, and the −Y-axis direction. However, the holding members 21 are moved at equal intervals in the intersecting directions that intersect in the direction in which the holding means 20 is moved. At this time, the control means 40 applies the chip size CS and the target value of the inter-chip distance CD to the following formula (1) to calculate the target value of the elongation amount EA of the adhesive sheet AS. Then, the control means 40 has linear motors 30A and 30B so that the extension amount EA of the adhesive sheet AS becomes the target value obtained by the equation (1) and the intervals between the holding members 21 of the holding means 20 are equal. To drive. As a result, tension is applied to the adhesive sheet AS in the four directions of the + X-axis direction, the + Y-axis direction, the −X-axis direction, and the −Y-axis direction, and the mutual distance between the chips CP is expanded to the target value of the inter-chip distance CD.

[Equation 1]
CD = (K1 x CS + K2) x EA ... (1)
CD: Distance between chips (μm)
CS: Chip size (mm)
EA: Elongation amount of adhesive sheet AS (mm)
K1, K2: constant

The target value input via the operating means is used for the inter-chip distance CD, and the size value input via the operating means is used for the chip size CS. The constants K1 and K2 are values determined by the adhesive sheet AS and are input via the operating means. The basis of equation (1) will be described later.

After that, a transport means (not shown) such as a transport device or a pickup device holds and transports each chip CP, and mounts the chip CP on an object to be mounted such as a tray, a lead frame, or a substrate. Then, when the transfer of all the chip CPs is completed, the control means 40 drives each drive device, returns each component to the initial position, and then the transfer means collects the integrated WK from which the chip CP has been removed. After that, the same operation as above is repeated.

As described above, the separation device 10 can set the inter-chip distance CD to the target value by setting the elongation amount EA of the adhesive sheet AS to the value obtained from the equation (1). Here, the equation (1) is determined based on the following grounds.
First, in order to investigate the relationship between the elongation amount EA of the adhesive sheet AS and the inter-chip distance CD when the chip CP is square, each of the holding means 20 is set in the + X-axis direction, the + Y-axis direction, the -X-axis direction, and -Y. When the holding members 21 of each holding means 20 were moved at equal intervals while moving in four directions in the axial direction, the results shown in FIG. 4 were obtained. As the adhesive sheet AS, the one shown in Table 1 was used. Further, the inter-chip distance CD is provided in the central row of each of the X-axis direction and the Y-axis direction among the 25 chip CPs obtained by dividing the wafer WF into 5 rows each along the X-axis direction and the Y-axis direction. For the nine chip CPs located, the distance between the sides facing each other was measured, and the average value was used.

As shown in FIG. 4, although the value of the inter-chip distance CD with respect to the elongation amount EA differs depending on the adhesive sheet AS, there is a linear relationship between the elongation amount EA and the inter-chip distance CD for all the adhesive sheet AS. It was established. The chip CP had a square size of 3 × 3 mm.
Further, when the chip size CS was changed and examined, as shown in FIG. 5, a linear relationship was established between the chip size CS and the inter-chip distance CD under any condition of the elongation amount EA of the adhesive sheet AS. rice field. As the adhesive sheet AS, the one of A in Table 1 was used.

Next, in order to investigate the relationship between the chip size CS and the inter-chip distance CD when the chip CP is rectangular, the sizes in the X-axis direction and the Y-axis direction are 6 × 2 mm, 6 × 4 mm, and 6 × 6 mm, respectively. When the adhesive sheet AS was stretched by the same amount in the X-axis direction and the Y-axis direction for the chip CP, the results shown in FIG. 6 were obtained. As the adhesive sheet AS, the one of A in Table 1 was used. The elongation amount EA of the adhesive sheet AS was set to 60 mm in both the X-axis direction and the Y-axis direction.

As shown in FIG. 6, in the 6 × 6 mm square chip CP, the inter-chip distance CD was substantially the same in the X-axis direction and the Y-axis direction. On the other hand, in the 6 × 2 mm and 6 × 4 mm rectangular chip CPs, the inter-chip distance CD in the X-axis direction decreases linearly with respect to the chip size CS, and the inter-chip distance CD in the Y-axis direction becomes the chip size CS. On the other hand, it increased linearly. Therefore, in order to extend the adhesive sheet AS independently according to the chip size CS in the X-axis direction and the Y-axis direction, the graph of FIG. 5 shows the extension amount EA of the adhesive sheet AS and the space between the chips for each chip size CS. FIG. 7 shows the relationship with the distance CD.

As shown in FIG. 7, even when the chip size CS is different, the inter-chip distance CD linearly increases with respect to the elongation amount EA of the adhesive sheet AS. Therefore, the relationship of the following formula (2) is established between the elongation amount EA of the adhesive sheet AS and the inter-chip distance CD.

[Equation 2]
CD = K x EA ... (2)
K: Linear regression gradient

Therefore, when the gradient of each graph in FIG. 7 was obtained by linear regression, the relational expression of the equation (2) for each chip size CS was as shown in Table 2 below. As shown in Table 2, each chip size CS has a correlation coefficient of 0.99, showing good linearity.

FIG. 8 is a graph showing the relationship between the chip size CS and the linear regression gradient K in Table 2. As shown in FIG. 8, the linear regression gradient K increases linearly with respect to the chip size CS. In this case, the relationship of the following equation (3) holds between the chip size CS and the linear regression gradient K.

[Equation 3]
K = 1.23 x CS + 3.81 ... (3)

Then, by substituting the equation (3) into the equation (2), the following equation (4) is obtained.

[Equation 4]
CD = (1.23 x CS + 3.81) x EA ... (4)

Equation (4) is a relational expression of the chip size CS, the inter-chip distance CD, and the elongation amount EA of the adhesive sheet AS with respect to the adhesive sheet AS of Table 1. Therefore, when the adhesive sheet AS of A in Table 1 is used, the elongation amount EA of the adhesive sheet AS can be obtained by applying the chip size CS and the target value of the inter-chip distance CD to the equation (4). When the chip CP is square, the value of the chip size CS is one, so the calculation formula using the formula (4) is one. When the chip CP is rectangular, the chip size CS differs between the X-axis direction and the Y-axis direction, and the calculation formula (4) is applied to each chip size CS. Therefore, the calculation formula using the formula (4) is 2. Become one.

Further, from the above description, even if the adhesive sheet AS and the chip size CS are changed, a linear relationship is established between the chip size CS, the inter-chip distance CD, and the elongation amount EA of the adhesive sheet AS. Therefore, the above equation (1) is a generalization of the constant part of the equation (4). Therefore, if the values of the constants K1 and K2 in the formula (1) are determined for each adhesive sheet AS, even if the adhesive sheet AS changes, the values of the constants K1 and K2 can be changed according to the adhesive sheet AS to adhere. The elongation amount EA of the sheet AS can be easily obtained.

According to the above embodiment, the target value of the elongation amount EA of the adhesive sheet AS is calculated according to the target value of the chip size CS and the inter-chip distance CD, and the elongation amount EA of the adhesive sheet AS is the elongation amount. Since the holding member 21 is moved so as to be the target value of the EA, the elongation amount EA of the adhesive sheet AS can be set by a simple method, and it is possible to prevent the processing capacity per unit time from being lowered.

[Second Embodiment]
In FIG. 9, the separation device 10 is configured such that the control means 40 controls the movement of the holding member 21 based on the measurement result of the measuring means 50. The adhesive sheet AS and the wafer WF are each formed in a circular shape in a plan view.

In the control means 40, similarly to the above, the linear motor 30A is such that the extension amount EA of the adhesive sheet AS is a value obtained by the equation (1) and the intervals between the holding members 21 of the holding means 20 are equal. , 30B is driven. As a result, the inter-chip distance CD can be brought closer to the target value, but as shown in FIG. 10, there is still a slight difference in the mutual spacing between the chip CPs, and each chip CP is arranged at a theoretical position. May not be possible.

Therefore, the control means 40 drives the linear motor 30B based on the measurement result of the measuring means 50, and as shown in FIG. 11, the holding member 21 is further moved in the front-rear direction or the left-right direction, and the distance between the holding members 21 is increased. By adjusting the above, the mutual spacing between the chip CPs can be adjusted. As a result, each chip CP is arranged at a theoretical position (the mutual spacing between the chip CPs is made as equal as possible).
When adjusting the mutual spacing of the chip CPs by driving the linear motor 30B, at least one of the holding members 21 may move, and the moving distances and moving directions thereof may be the same or different. good.

[Third Embodiment]
In FIG. 12, the separation device 10 includes linear motors 30A, 30B, and 30C as extension means which are drive devices, and supports the holding member 21 by a slider of the linear motor 30C.
The linear motor 30C extends parallel to the linear motor 30A and is supported by the slider 31B of the linear motor 30B.

In the above separation device 10, the control means 40 drives the linear motors 30A and 30B in the same manner as described above, and brings the inter-chip distance CD closer to the target value. If there is still a slight difference in the mutual spacing of the chip CPs and each chip CP cannot be placed in a theoretical position, the control means 40 drives the linear motor 30C and holds it, as shown in FIG. The holding member 21 is moved in a direction parallel to the direction in which the means 20 is moved, and each chip CP is arranged at a theoretical position.

As described above, the best configuration, method, etc. for carrying out the present invention are disclosed in the above description, but the present invention is not limited thereto. That is, the present invention is particularly illustrated and described primarily with respect to a particular embodiment, but without departing from the scope of the technical idea and purpose of the present invention, with respect to the embodiments described above. Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. Further, the description limiting the shape, material, etc. disclosed above is exemplarily described for facilitating the understanding of the present invention, and does not limit the present invention. Therefore, those shapes, materials, etc. The description by the name of the member which removes a part or all of the limitation such as is included in the present invention.

The holding means 20 may be configured to support the integrated WK with a chuck means such as a mechanical chuck or a chuck cylinder, a decompression means (not shown) such as a decompression pump or a vacuum ejector, an adhesive, a magnetic force, or the like.
The number of the holding members 21 included in the holding means 20 may be 2 to 4, 6 or more, and the number of the holding members 20 in each holding means 20 may be the same or different. ..
The crossing direction in which the holding members 21 move may be a direction orthogonal to the direction in which the holding means 20 moves by the linear motor 30A, or may be a direction in which the holding members 21 cross diagonally. In this case, the linear motor 30C may be provided.

As the extending means, at least one of the holding means 20 may be fixed and the other holding means 20 may be moved. In this case, the linear motor 30A for moving the fixed holding means 20 may not be provided. good.
The linear motor 30C may be provided in place of or in combination with the linear motor 30A. In this case, the linear motor 30C may or may not be provided for each holding member 21.
The linear motor 30B may fix at least one of each holding member 21 and move the other holding member 21 in a direction orthogonal to the direction in which the holding means 20 is moved by the linear motor 30A.

The control means 40 automatically converts the constants K1 and K2 into the equation (1) by storing the adhesive sheet AS in association with the values of the constants K1 and K2 and selecting the adhesive sheet AS via the operating means. May be applied as a target.
When a certain relationship other than the formula (1) is established between the chip size CS, the inter-chip distance CD, and the extension amount EA of the adhesive sheet AS, the control means 40 has the constant relationship between the chip size CS and the chip. The target value of the elongation amount EA of the adhesive sheet AS may be calculated by applying the target value of the distance CD.

The measuring means 50 may not be required when the control means 40 does not control the movement of the holding member 21 based on the measurement result of the measuring means 50. In this case, the user who recognizes that the mutual spacing between the chip CPs is not the same may operate the holding means 20 and the linear motor 30B to adjust the mutual spacing between the chip CPs.

The shape of the adhesive sheet AS may be circular, polygonal or more pentagonal, or any other shape.
The wafer WF may be rectangular.
The chip CP may have other shapes such as a circle, a square, a rectangle, a triangle, a polygon of a pentagon or more, and the like.
The one-piece WK may be a circular wafer WF temporarily attached to a square adhesive sheet AS, or a square or rectangular wafer WF temporarily attached to a circular adhesive sheet AS. ..

Further, the material, type, shape, etc. of the adhesive sheet AS in the present invention are not particularly limited. For example, the adhesive sheet AS may have a circular shape, an elliptical shape, a polygonal shape of a triangle, a pentagon or more, or any other shape. Further, the adhesive sheet AS is, for example, a single layer having only an adhesive layer, a material having an intermediate layer between the base material and the adhesive layer, a material having a cover layer on the upper surface of the base material, and the like having three or more layers. Further, it may be a so-called double-sided adhesive sheet capable of peeling the base material from the adhesive layer, and the double-sided adhesive sheet may have a single-layer or multi-layer intermediate layer or an intermediate layer. It may be single-layer or multi-layer without. Further, the material, type, thickness and the like of the base material and the adhesive layer are not particularly limited, and for example, a base material made of urethane may be used.

The shape of the plate-shaped member or the flake-shaped body may be other shapes such as a circle, an ellipse, a triangle, a polygon of a pentagon or more, and the like. Further, as the plate-shaped member, for example, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, a circuit board, an information recording board such as an optical disk, a glass plate, a steel plate, a pottery, a wooden board or a resin plate, or any other form of a member. , Articles, etc. can also be targeted, and the flake body may be any individualized body. The adhesive sheet AS may be any sheet, film, tape or the like such as a protective sheet, a dicing tape, a die attach film or a die bonding tape, instead of a functional and versatile reading.

The means and processes in the present invention are not limited as long as they can perform the operations, functions or processes described for the means and processes, much less the components of the mere embodiment shown in the above-described embodiment. It is not limited to the process at all. For example, the holding means is not limited as long as the adhesive sheet can be held by a plurality of holding members, as long as it is within the technical range in light of the common general technical knowledge at the time of filing (others). The description of the means and the process will be omitted).
Further, the drive equipment in the above embodiment includes electric equipment such as a rotary motor, a linear motor, a linear motor, a single-axis robot, and an articulated robot, and actuators such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to being able to be adopted, it is also possible to adopt a combination thereof directly or indirectly (some of which overlap with those illustrated in the embodiment).

10 ... Separation device 20 ... Holding means 21 ... Holding members 30A, 30B, 30C ... Linear motor (extending means)
40 ... Control means 50 ... Measuring means AS ... Adhesive sheet CD: Distance between chips (distance between pieces)
CP ... Chip (fragment)
CS: Chip size (size of flake)
EA: Elongation amount of adhesive sheet WF ... Wafer (plate-shaped member)

Claims (3)

A separation device that applies tension to a plate-shaped member on an adhesive sheet in four directions to widen the mutual spacing between a plurality of pieces formed from the plate-shaped member.
A plurality of holding means for holding the adhesive sheet by a plurality of holding members, and
An extension means for extending the adhesive sheet by moving the holding member in one of the four directions different for each holding means and moving the holding member in an intersecting direction intersecting the one direction.
A control means for controlling the movement of the holding member by the extension means is provided.
The control means applies the size of the flake and the target value of the interval between the flake to the following formula (1) to calculate the target value of the elongation amount of the adhesive sheet, and the stretching means is used. A separating device characterized in that the holding member is moved so that the elongation amount of the adhesive sheet becomes a target value of the elongation amount.
[Equation 1]
CD = (K1 x CS + K2) x EA ... (1)
CD: Fragment spacing (μm)
CS: Flake size (mm)
EA: Elongation amount of adhesive sheet (mm)
K1, K2: constant It has a measuring means for measuring the mutual distance between the pieces.
The separation device according to claim 1, wherein the control means moves the holding member to the extension means based on the measurement result of the measurement means. It is a separation method in which tension is applied to a plate-shaped member on an adhesive sheet in four directions to widen the mutual distance between a plurality of pieces formed from the plate-shaped member.
A holding step of holding the adhesive sheet by a plurality of holding means each including a plurality of holding members,
The holding member is moved in one of the four directions different for each holding means, and the holding member is moved in an intersecting direction intersecting the one direction to extend the adhesive sheet.
In the stretching step, the size of the piece and the target value of the interval between the pieces are applied to the following formula (1) to calculate the target value of the stretch amount of the adhesive sheet, and the stretch of the adhesive sheet is performed. A separation method comprising moving the holding member so that the amount becomes a target value of the extension amount.
[Equation 1]
CD = (K1 x CS + K2) x EA ... (1)
CD: Fragment spacing (μm)
CS: Flake size (mm)
EA: Elongation amount of adhesive sheet (mm)
K1, K2: constant

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