TWI762636B - 固晶用矽氧樹脂組成物、固晶材料及光半導體裝置 - Google Patents
固晶用矽氧樹脂組成物、固晶材料及光半導體裝置 Download PDFInfo
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- TWI762636B TWI762636B TW107115703A TW107115703A TWI762636B TW I762636 B TWI762636 B TW I762636B TW 107115703 A TW107115703 A TW 107115703A TW 107115703 A TW107115703 A TW 107115703A TW I762636 B TWI762636 B TW I762636B
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- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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Applications Claiming Priority (2)
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| JP7099355B2 (ja) * | 2019-02-18 | 2022-07-12 | 信越化学工業株式会社 | 熱硬化性シリコーン組成物およびその硬化物 |
| TW202200674A (zh) * | 2020-06-12 | 2022-01-01 | 日商信越化學工業股份有限公司 | 加成反應硬化型有機聚矽氧烷組成物、及剝離紙以及剝離膜 |
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| JPH09296113A (ja) * | 1996-04-26 | 1997-11-18 | Toray Dow Corning Silicone Co Ltd | 導電性シリコーンゴム組成物、半導体装置の製造方法およびその半導体装置 |
| TW200833789A (en) * | 2006-08-14 | 2008-08-16 | Dow Corning Toray Co Ltd | Silicone rubber composition for fabric coating and coated fabric |
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| JP3962926B2 (ja) * | 2003-04-01 | 2007-08-22 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
| JP2005343925A (ja) * | 2004-05-31 | 2005-12-15 | Mitsubishi Rayon Co Ltd | 熱可塑性樹脂組成物、及びそれを用いた成形品 |
| JP4648099B2 (ja) * | 2005-06-07 | 2011-03-09 | 信越化学工業株式会社 | ダイボンディング用シリコーン樹脂組成物 |
| KR20090092324A (ko) * | 2006-12-20 | 2009-08-31 | 다우 코닝 코포레이션 | 양이온 민감성 층을 포함하는 복합 물품 |
| JP6426628B2 (ja) * | 2013-02-11 | 2018-11-21 | ダウ シリコーンズ コーポレーション | 官能基密集型ポリオルガノシロキサン及びシリコーン反応性希釈剤を含む硬化性シリコーン組成物 |
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| JPH09296113A (ja) * | 1996-04-26 | 1997-11-18 | Toray Dow Corning Silicone Co Ltd | 導電性シリコーンゴム組成物、半導体装置の製造方法およびその半導体装置 |
| TW200833789A (en) * | 2006-08-14 | 2008-08-16 | Dow Corning Toray Co Ltd | Silicone rubber composition for fabric coating and coated fabric |
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| CN108864429B (zh) | 2021-04-30 |
| TW201906977A (zh) | 2019-02-16 |
| CN108864429A (zh) | 2018-11-23 |
| JP2018188583A (ja) | 2018-11-29 |
| KR102491922B1 (ko) | 2023-01-27 |
| JP6754318B2 (ja) | 2020-09-09 |
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