TWI758469B - 加成硬化型聚矽氧組成物、該組成物之製造方法、聚矽氧硬化物及光學元件 - Google Patents

加成硬化型聚矽氧組成物、該組成物之製造方法、聚矽氧硬化物及光學元件 Download PDF

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TWI758469B
TWI758469B TW107114129A TW107114129A TWI758469B TW I758469 B TWI758469 B TW I758469B TW 107114129 A TW107114129 A TW 107114129A TW 107114129 A TW107114129 A TW 107114129A TW I758469 B TWI758469 B TW I758469B
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polysiloxane
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TW107114129A
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TW201843239A (zh
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小林之人
小材利之
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日商信越化學工業股份有限公司
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/38Polysiloxanes modified by chemical after-treatment
    • C08G77/382Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
    • C08G77/398Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing boron or metal atoms
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C08G77/52Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages containing aromatic rings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L33/56Materials, e.g. epoxy or silicone resin
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    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW107114129A 2017-04-27 2018-04-26 加成硬化型聚矽氧組成物、該組成物之製造方法、聚矽氧硬化物及光學元件 TWI758469B (zh)

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JP2017-088879 2017-04-27
JP2017088879A JP6754317B2 (ja) 2017-04-27 2017-04-27 付加硬化型シリコーン組成物、該組成物の製造方法、シリコーン硬化物、及び光学素子

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TWI758469B true TWI758469B (zh) 2022-03-21

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KR (1) KR102414395B1 (ja)
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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7021046B2 (ja) * 2018-10-22 2022-02-16 信越化学工業株式会社 付加硬化型シリコーン組成物、シリコーン硬化物、及び、光学素子
JP2020125430A (ja) * 2019-02-06 2020-08-20 信越化学工業株式会社 ダイボンディング用有機変性シリコーン樹脂組成物、その硬化物及び光半導体素子
JP2020132743A (ja) * 2019-02-18 2020-08-31 信越化学工業株式会社 ダイボンディング用シリコーン樹脂組成物、硬化物、発光ダイオード素子及び該組成物の製造方法
JP7084343B2 (ja) * 2019-03-11 2022-06-14 信越化学工業株式会社 付加硬化型シリコーン組成物、その硬化物、及び光半導体素子
JP7088880B2 (ja) * 2019-05-30 2022-06-21 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物、該組成物の製造方法、及び光半導体装置
US20230250284A1 (en) * 2020-07-13 2023-08-10 Dow Toray Co., Ltd. Silicone gel composition, cured product thereof, and use therefor
WO2022019056A1 (ja) * 2020-07-22 2022-01-27 信越化学工業株式会社 硫化防止コーティング材料、その硬化物、及び、電子デバイス

Citations (5)

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TW200831565A (en) * 2006-08-07 2008-08-01 Gen Electric Polysiloxane copolymers, thermoplastic composition, and articles formed therefrom
JP2008291148A (ja) * 2007-05-25 2008-12-04 Shin Etsu Chem Co Ltd 耐熱性に優れたシリコーンゲル組成物
TW201406863A (zh) * 2012-06-29 2014-02-16 Dow Corning 聚有機金屬矽氧烷、可固化聚合物組成物,其固化產物及光學半導體裝置
TW201430064A (zh) * 2012-12-11 2014-08-01 Dow Corning Toray Co Ltd 透明性優異之高折射率熱傳導性組合物、包含其之熱傳導性油脂、熱傳導性硬化物、熱軟化性熱傳導性組合物及其用途
TW201510095A (zh) * 2013-09-03 2015-03-16 Dow Corning 硬化性聚矽氧組合物、其硬化物、及光半導體裝置

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JP2004292714A (ja) 2003-03-28 2004-10-21 Kanegafuchi Chem Ind Co Ltd 硬化性組成物、硬化物、その製造方法およびその硬化物により封止された発光ダイオード
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP2005327777A (ja) * 2004-05-12 2005-11-24 Shin Etsu Chem Co Ltd 発光ダイオード用シリコーン樹脂組成物
JP4862032B2 (ja) 2008-12-05 2012-01-25 信越化学工業株式会社 高屈折率を有する硬化物を与える付加硬化型シリコーン組成物、及び該組成物からなる光学素子封止材
JP5524017B2 (ja) * 2010-10-08 2014-06-18 信越化学工業株式会社 付加硬化型シリコーン組成物、及び該組成物の硬化物により半導体素子が被覆された半導体装置
JP5524424B1 (ja) * 2012-09-27 2014-06-18 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 光半導体素子封止用シリコーン組成物および光半導体装置
KR101747160B1 (ko) * 2013-02-22 2017-06-14 다우 코닝 도레이 캄파니 리미티드 경화성 실리콘 조성물, 이의 경화물, 및 광반도체 디바이스
KR20160013872A (ko) * 2013-05-29 2016-02-05 다우 코닝 도레이 캄파니 리미티드 반도체 장치 및 반도체 소자 밀봉용 경화성 실리콘 조성물
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200831565A (en) * 2006-08-07 2008-08-01 Gen Electric Polysiloxane copolymers, thermoplastic composition, and articles formed therefrom
JP2008291148A (ja) * 2007-05-25 2008-12-04 Shin Etsu Chem Co Ltd 耐熱性に優れたシリコーンゲル組成物
TW201406863A (zh) * 2012-06-29 2014-02-16 Dow Corning 聚有機金屬矽氧烷、可固化聚合物組成物,其固化產物及光學半導體裝置
TW201430064A (zh) * 2012-12-11 2014-08-01 Dow Corning Toray Co Ltd 透明性優異之高折射率熱傳導性組合物、包含其之熱傳導性油脂、熱傳導性硬化物、熱軟化性熱傳導性組合物及其用途
TW201510095A (zh) * 2013-09-03 2015-03-16 Dow Corning 硬化性聚矽氧組合物、其硬化物、及光半導體裝置

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TW201843239A (zh) 2018-12-16
KR20180120594A (ko) 2018-11-06
CN108795053B (zh) 2021-03-09
KR102414395B1 (ko) 2022-06-30
JP2018184579A (ja) 2018-11-22
CN108795053A (zh) 2018-11-13
JP6754317B2 (ja) 2020-09-09

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