CN108795053B - 加成固化型硅酮组合物、该组合物的制造方法、硅酮固化物、以及光学元件 - Google Patents

加成固化型硅酮组合物、该组合物的制造方法、硅酮固化物、以及光学元件 Download PDF

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CN108795053B
CN108795053B CN201810359283.7A CN201810359283A CN108795053B CN 108795053 B CN108795053 B CN 108795053B CN 201810359283 A CN201810359283 A CN 201810359283A CN 108795053 B CN108795053 B CN 108795053B
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CN108795053A (zh
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小林之人
小材利之
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Shin Etsu Chemical Co Ltd
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/38Polysiloxanes modified by chemical after-treatment
    • C08G77/382Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C08G77/52Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages containing aromatic rings
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    • H01L23/00Details of semiconductor or other solid state devices
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    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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CN201810359283.7A 2017-04-27 2018-04-20 加成固化型硅酮组合物、该组合物的制造方法、硅酮固化物、以及光学元件 Active CN108795053B (zh)

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JP2017-088879 2017-04-27
JP2017088879A JP6754317B2 (ja) 2017-04-27 2017-04-27 付加硬化型シリコーン組成物、該組成物の製造方法、シリコーン硬化物、及び光学素子

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JP7021046B2 (ja) * 2018-10-22 2022-02-16 信越化学工業株式会社 付加硬化型シリコーン組成物、シリコーン硬化物、及び、光学素子
JP2020125430A (ja) * 2019-02-06 2020-08-20 信越化学工業株式会社 ダイボンディング用有機変性シリコーン樹脂組成物、その硬化物及び光半導体素子
JP2020132743A (ja) * 2019-02-18 2020-08-31 信越化学工業株式会社 ダイボンディング用シリコーン樹脂組成物、硬化物、発光ダイオード素子及び該組成物の製造方法
JP7084343B2 (ja) * 2019-03-11 2022-06-14 信越化学工業株式会社 付加硬化型シリコーン組成物、その硬化物、及び光半導体素子
JP7088880B2 (ja) * 2019-05-30 2022-06-21 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物、該組成物の製造方法、及び光半導体装置
WO2022013917A1 (ja) * 2020-07-13 2022-01-20 ダウ・東レ株式会社 シリコーンゲル組成物、その硬化物、およびそれらの用途
JPWO2022019056A1 (ja) * 2020-07-22 2022-01-27

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US7790292B2 (en) * 1999-05-18 2010-09-07 Sabic Innovative Plastics Ip B.V. Polysiloxane copolymers, thermoplastic composition, and articles formed therefrom
JP2004292714A (ja) 2003-03-28 2004-10-21 Kanegafuchi Chem Ind Co Ltd 硬化性組成物、硬化物、その製造方法およびその硬化物により封止された発光ダイオード
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP2005327777A (ja) * 2004-05-12 2005-11-24 Shin Etsu Chem Co Ltd 発光ダイオード用シリコーン樹脂組成物
JP2008291148A (ja) * 2007-05-25 2008-12-04 Shin Etsu Chem Co Ltd 耐熱性に優れたシリコーンゲル組成物
JP4862032B2 (ja) 2008-12-05 2012-01-25 信越化学工業株式会社 高屈折率を有する硬化物を与える付加硬化型シリコーン組成物、及び該組成物からなる光学素子封止材
JP5524017B2 (ja) * 2010-10-08 2014-06-18 信越化学工業株式会社 付加硬化型シリコーン組成物、及び該組成物の硬化物により半導体素子が被覆された半導体装置
TW201406863A (zh) * 2012-06-29 2014-02-16 Dow Corning 聚有機金屬矽氧烷、可固化聚合物組成物,其固化產物及光學半導體裝置
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TW201843239A (zh) 2018-12-16
JP6754317B2 (ja) 2020-09-09
KR102414395B1 (ko) 2022-06-30
CN108795053A (zh) 2018-11-13
KR20180120594A (ko) 2018-11-06
JP2018184579A (ja) 2018-11-22
TWI758469B (zh) 2022-03-21

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